EP1C3T100C7N

The EP1C3T100C7N is a Cyclone® family field programmable gate array (FPGA) supplied in a 100‑pin TQFP (14×14) surface‑mount package. It provides a compact, commercial‑grade programmable logic solution with 2,910 logic elements and approximately 59,904 bits of on‑chip RAM.

Designed for data‑path and mixed‑signal interface applications, this device operates from a 1.425 V to 1.575 V core supply, supports standard FPGA clocking resources (1 PLL on this device), and is specified for 0 °C to 85 °C operation. It is RoHS compliant for environmental regulatory requirements.

Key Features

• Logic Capacity — 2,910 logic elements (LEs) to implement medium‑complexity programmable logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 59,904 bits of on‑chip RAM (M4K RAM blocks: 13) for small buffers, FIFOs, and local storage.
• I/O and Interface — 65 user I/O pins provided in the 100‑TQFP package for peripheral, sensor, and bus connections.
• Clocking — Device includes 1 PLL for clock multiplication and phase adjustments to support custom timing domains.
• Power — Core voltage range specified 1.425 V to 1.575 V, matching the Cyclone family’s 1.5 V SRAM process.
• Package and Mounting — 100‑TQFP (14×14) surface‑mount package for ease of PCB routing and prototyping in compact designs.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Data‑Path Processing — Implement medium‑complexity custom datapaths, transcoders, and protocol parsing where on‑chip logic and RAM reduce external components.
• Memory Interface Control — Suitable for control logic and buffering between controllers and external memory devices, leveraging the device’s embedded RAM and clocking resources.
• Peripheral and Bus Bridging — Use the 65 I/Os and programmable fabric to implement interface translation, glue logic, and bus bridging in embedded systems.
• Prototyping and Low‑Volume Systems — Compact 100‑pin TQFP package and surface‑mount mounting make this device a fit for compact prototypes and commercial‑grade products.

Unique Advantages

• Balanced Logic and Memory Integration: 2,910 logic elements and ~59,904 bits of RAM reduce the need for external PLD/MMIO chips and small external memories.
• Compact, Industry‑Standard Package: 100‑TQFP (14×14) provides a space‑efficient footprint while retaining a generous number of I/Os for peripheral connections.
• Dedicated Clocking Resource: Integrated PLL enables flexible clock domain generation and phase control without additional external components.
• Commercial‑Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
• Low‑Voltage Core Compatibility: Designed for the Cyclone family 1.5 V SRAM process with a defined core supply window (1.425 V–1.575 V) to match modern low‑voltage system rails.

Why Choose EP1C3T100C7N?

The EP1C3T100C7N delivers a practical balance of logic density, embedded memory, and I/O in a compact surface‑mount TQFP package. It is well suited to engineers building medium‑complexity programmable solutions where integration, predictable power characteristics, and controlled operating temperature range are priorities.

This device fits designs that benefit from on‑chip RAM and a dedicated PLL for local clock management, allowing reduced BOM and simplified board layouts while preserving flexibility for interface and protocol implementation.

Request a quote or submit a purchase inquiry to check availability, pricing, and lead times for EP1C3T100C7N. Our team can provide technical details and assistance to evaluate this Cyclone FPGA for your design.