EP1C3T100I7
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 65 59904 2910 100-TQFP |
|---|---|
| Quantity | 1,230 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 65 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 291 | Number of Logic Elements/Cells | 2910 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 59904 |
Overview of EP1C3T100I7 – Cyclone® Field Programmable Gate Array, 100-TQFP (Industrial)
The EP1C3T100I7 is a Cyclone® family SRAM-based FPGA supplied in a 100-pin TQFP (14×14) surface-mount package and rated for industrial use. It integrates 2,910 logic elements and approximately 59,904 bits of embedded memory in a low-voltage 1.425 V to 1.575 V core, making it suitable for compact custom logic, control and data-path designs.
With support for common I/O standards and on-chip clocking resources from the Cyclone family architecture, this device targets designers requiring a balance of logic capacity, on-chip memory, and industrial temperature operation from −40 °C to 100 °C.
Key Features
- Core Logic 2,910 logic elements (LEs) provide programmable combinational and sequential resources for custom logic and control functions.
- Embedded Memory Approximately 59,904 bits of on-chip RAM to support buffering, FIFOs, and small data structures without external memory.
- I/O Count & Standards 65 user I/O pins; Cyclone family support for LVTTL, LVCMOS, SSTL-2, SSTL-3 and LVDS I/O standards aids interfacing with a wide range of peripherals and signaling levels.
- Clocking Family-level clocking features include up to one PLL for clock multiplication and phase shifting to support synchronous designs.
- Power Low-voltage core operation with a specified supply range of 1.425 V to 1.575 V for the FPGA core.
- Package & Mounting 100-TQFP (14×14) surface-mount package provides a compact, industry-familiar footprint for board-level integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
- RoHS Compliant Device is RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Data-path and buffering On-chip RAM and 2,910 logic elements enable buffering, packet handling or small data-path accelerators without immediate reliance on external memory.
- Peripheral and protocol bridging Flexible I/O standard support allows the device to act as a bridge between legacy logic levels and higher-speed serial interfaces.
- Control and interface logic Compact package and industrial temperature rating make it suitable for embedded control, sensor aggregation, and mid-density logic tasks in industrial equipment.
Unique Advantages
- Balanced logic and memory The combination of 2,910 LEs with ~59,904 bits of embedded RAM reduces the need for external memory for many mid-size designs.
- Industrial-ready thermal range −40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
- Compact 100-TQFP footprint 100-pin TQFP (14×14) package simplifies board layout for space-constrained applications while providing ample I/O.
- Low-voltage core operation Specified 1.425 V to 1.575 V supply reduces power domain complexity for modern low-voltage designs.
- Standards-oriented I/O flexibility Support for multiple I/O standards helps simplify integration with a variety of external devices and memory interfaces.
- RoHS compliance Meets common environmental compliance requirements for commercial and industrial manufacturing.
Why Choose EP1C3T100I7?
The EP1C3T100I7 positions itself as a practical mid-density Cyclone FPGA option that combines a modest logic fabric (2,910 LEs) with nearly 60 Kbits of embedded RAM, industrial temperature capability, and flexible I/O in a compact 100-TQFP package. It is well suited for engineers who need a reliable, low-voltage FPGA for control, interface, or moderate data-path tasks without large board-space or power overhead.
Backed by Cyclone family documentation and device features, the EP1C3T100I7 offers an efficient integration point for long-lived industrial designs where predictable logic capacity, on-chip memory, and I/O flexibility are primary selection criteria.
Request a quote or submit an inquiry to check availability and pricing for EP1C3T100I7 and discuss how it fits your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018