EP1C3T144C6

The EP1C3T144C6 is a Cyclone® field-programmable gate array (FPGA) from Intel, built on the Cyclone device family architecture. It provides 2,910 logic elements and 59,904 bits of on-chip RAM in a compact 144‑pin LQFP package suited to cost‑sensitive, data‑path and general programmable logic applications.

With a 104‑pin I/O count, low-voltage core operation and commercial temperature rating, this device targets embedded systems and peripheral‑interface designs that require moderate logic density, on‑chip memory and flexible I/O connectivity.

Key Features

• Logic Capacity — 2,910 logic elements (LEs) to implement medium‑complexity FPGA designs and custom logic functions.
• Embedded Memory — 59,904 bits of on‑chip RAM for data buffering, small LUTRAM use or microcode storage within the fabric.
• I/O Density — Up to 104 user I/O pins to support multi‑signal interfaces and external device connections.
• Core Voltage — Operates with a core supply range of 1.425 V to 1.575 V for the device core rails.
• Package Options — 144‑lead LQFP package (supplier device package listed as 144‑TQFP, 20 × 20 mm) for surface‑mount PCB designs.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard embedded applications.
• On‑chip Clocking — Family documentation indicates Cyclone devices include PLL resources (EP1C3 devices include one PLL) for clock management and phase control in system designs.
• Standards & Compliance — RoHS compliant to meet lead‑free environmental requirements.

Typical Applications

• Data‑Path and Interface Glue Logic — Implement custom data routing, protocol conversion and glue logic between processors, memories and peripherals using the FPGA fabric and on‑chip RAM.
• Memory Interface Prototyping — Support external memory interfacing and buffering tasks leveraging available on‑chip RAM and the family’s documented DDR/SDR memory support.
• High‑Speed I/O Links — Use the device’s I/O resources to implement LVDS or other high‑speed serial/parallel links as described for the Cyclone family.
• Peripheral Bus Integration — Integrate or prototype peripheral interfaces (for example, 33/66‑MHz PCI configurations referenced in the Cyclone documentation) in cost‑sensitive embedded platforms.

Unique Advantages

• Balanced Logic and Memory: 2,910 logic elements paired with 59,904 bits of embedded RAM provide a compact platform for mid‑range FPGA designs without external memory for small data buffers.
• Flexible I/O Count: 104 user I/O pins enable diverse peripheral and sensor connections while keeping the PCB footprint modest with a 144‑pin package.
• Low‑Voltage Core: Narrow core supply window (1.425–1.575 V) supports consistent power delivery and simplifies power‑rail planning for the FPGA core.
• Commercial Temperature Rating: 0 °C to 85 °C operation aligns with standard embedded product requirements and commercial deployments.
• RoHS Compliant: Meets lead‑free environmental standards for modern manufacturing and regulatory needs.
• Family Ecosystem: Part of the Cyclone FPGA family, which includes documented support for PLLs, memory interfaces and migration paths across densities as described in the Cyclone device handbook.

Why Choose EP1C3T144C6?

The EP1C3T144C6 delivers a practical combination of moderate logic density, embedded memory and a healthy I/O count in a compact 144‑pin LQFP package, making it well suited for designers seeking a cost‑effective FPGA platform for data‑path tasks, interface logic and memory‑interfacing prototypes. Its commercial temperature rating and RoHS compliance support standard embedded product requirements.

As a member of the Cyclone family, this device benefits from the documented architecture and configuration options of that family, providing predictable migration and development workflows for teams using Cyclone device toolchains and IP resources.

Request a quote or submit an inquiry to receive pricing and availability for EP1C3T144C6 and to discuss how it fits your design requirements.