EP1C3T144C8

The EP1C3T144C8 is an Intel Cyclone® family FPGA in a 144‑pin LQFP package designed for cost‑sensitive, data‑path applications. This SRAM‑based Cyclone device provides 2,910 logic elements and approximately 0.06 Mbits (59,904 bits) of on‑chip RAM, delivering compact programmable logic and embedded memory for a range of embedded and interface tasks.

Part-specific highlights include 104 user I/O pins, a single integrated PLL for clocking, a surface‑mount 144‑LQFP (supplier: 144‑TQFP 20×20) package, RoHS compliance, and commercial temperature operation from 0 °C to 85 °C with a core supply range of 1.425 V to 1.575 V.

Key Features

• Core architecture Cyclone® family SRAM-based FPGA architecture providing a cost-effective programmable logic fabric for data-path and interface applications.
• Logic resources 2,910 logic elements (LEs) suitable for small to mid-density logic implementations and glue‑logic tasks.
• Embedded memory Approximately 0.06 Mbits of on‑chip RAM (59,904 bits) for FIFOs, small buffers, and local storage.
• I/O and interfaces 104 user I/O pins enabling flexible external interfacing in a compact package; family-level support includes common I/O standards and high-speed LVDS options.
• Clocking One integrated PLL for clock multiplication and phase adjustment.
• Packaging & mounting 144‑LQFP package (supplier device package: 144‑TQFP 20×20) with surface‑mount mounting for standard PCB assembly.
• Power supply Core supply operating range of 1.425 V to 1.575 V.
• Operational grade Commercial temperature range: 0 °C to 85 °C.
• Environmental compliance RoHS compliant.

Typical Applications

• Data‑path processing Small to mid-sized programmable logic tasks where local combinational and sequential processing is required.
• Memory interface bridging Use as an interface or timing adapter for external memory systems, leveraging the Cyclone family’s DDR/SDR support at the family level.
• Protocol and I/O adaptation Implement custom I/O logic, protocol conversion, or glue logic between ASSPs, ASICs, and microcontrollers using the device’s 104 I/O pins.
• Clock management On‑chip PLL provides basic clock generation and phase adjustment for synchronous subsystems.

Unique Advantages

• Compact, solderable package: 144‑LQFP surface‑mount package supports standard PCB assembly and space‑conscious board designs.
• Balanced logic and memory: 2,910 logic elements combined with ~59,904 bits of embedded RAM enable a wide range of small to moderate logic functions with local storage.
• Flexible I/O count: 104 user I/O pins provide ample external connectivity for peripherals, buses, and sensors.
• Single integrated PLL: Built‑in PLL simplifies clocking needs for many embedded and interfacing applications.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS‑compliant for regulatory and manufacturing compatibility.
• Straightforward power domain: Defined core supply range (1.425 V–1.575 V) supports predictable power design and supply planning.

Why Choose EP1C3T144C8?

The EP1C3T144C8 delivers a practical combination of programmable logic, embedded memory, and I/O density in a compact 144‑pin package. It is well suited for designers seeking a commercially graded Cyclone FPGA for data‑path, interface adaptation, and control‑logic roles where space and cost are key considerations.

With Intel Cyclone family architecture, family-level features for memory and I/O standards, an integrated PLL, and clear electrical and thermal parameters, this device provides predictable integration into systems with defined supply and temperature requirements.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for EP1C3T144C8. Include your required quantity and delivery needs for a faster response.