EP1C3T144C8NGA

IC FPGA 104 I/O 144TQFP
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 104 59904 2910 144-LQFP

Quantity 23 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O104Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs291Number of Logic Elements/Cells2910
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits59904

Overview of EP1C3T144C8NGA – Cyclone® Field Programmable Gate Array (FPGA) IC 104 59904 2910 144-LQFP

The EP1C3T144C8NGA is a Cyclone® family FPGA from Intel, offering 2,910 logic elements and approximately 59,904 bits of embedded RAM in a 144‑pin LQFP surface‑mount package. Designed for data‑path and general embedded logic applications, this commercial‑grade device provides a compact, low‑voltage programmable fabric for system designers.

With a dedicated clocking resource and support for common memory interfaces in the Cyclone family, the device targets applications that require flexible I/O, on‑chip memory, and scalable logic integration within a standard commercial operating temperature range.

Key Features

  • Logic Capacity  2,910 logic elements for implementing combinational and sequential logic functions in a compact FPGA.
  • Embedded Memory  Approximately 59,904 bits of on‑chip RAM to support FIFOs, small buffers, and local storage.
  • I/O Density  Up to 104 user I/O pins to interface with external devices and peripherals.
  • Clocking  Includes on‑device phase‑locked loop (PLL) resources consistent with the EP1C3 Cyclone device to assist with clock multiplication and phase shifting.
  • Power  Nominal core supply range of 1.425 V to 1.575 V to match system power budgeting and regulator choices.
  • Package & Mounting  144‑pin LQFP (supplier package listed as 144‑TQFP 20×20) in a surface‑mount format for PCB assembly.
  • Operating Range  Commercial temperature rating: 0 °C to 85 °C for typical commercial applications.
  • Compliance  RoHS‑compliant manufacturing status.

Typical Applications

  • Data‑path acceleration  Implement packet processing, simple datapath logic, and custom protocol handling using the device's logic elements and on‑chip RAM.
  • Memory interface support  Use with external memory systems (DDR/SDR types referenced in Cyclone family documentation) relying on on‑chip logic and available clocking resources.
  • High‑speed I/O bridging  Integrate LVDS and other supported I/O standards for interfacing between ASSPs/ASICs and system peripherals.
  • Embedded control and prototyping  Compact FPGA in LQFP packaging well suited for board‑level prototypes and embedded control tasks in commercial products.

Unique Advantages

  • Compact integration: 2,910 logic elements and embedded RAM reduce the need for discrete glue logic and small external memory devices.
  • Flexible I/O: 104 user I/O pins provide versatility for mixed signal interfaces and peripheral connectivity on a single device.
  • Deterministic clock resources: On‑chip PLL support enables localized clock management for timing‑sensitive designs.
  • Industry‑standard packaging: 144‑pin LQFP surface‑mount package simplifies PCB layout and assembly for commercial designs.
  • Regulatory readiness: RoHS compliance supports environmentally conscious product builds and supply chain requirements.

Why Choose EP1C3T144C8NGA?

The EP1C3T144C8NGA offers a balanced combination of logic density, embedded memory, and I/O capability in a compact, commercially rated package. It is well suited to designers who need a programmable fabric for data‑path functions, interface bridging, and embedded control without moving to larger device families.

Backed by Cyclone family documentation and development resources, this FPGA provides predictable supply‑voltage and thermal envelopes for commercial applications, enabling straightforward integration into board‑level designs where moderate logic capacity and flexible I/O are required.

Request a quote or submit a pricing and availability inquiry to evaluate EP1C3T144C8NGA for your next design.

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