EP1C3T144I7N

The EP1C3T144I7N is an Intel Cyclone® field-programmable gate array (FPGA) in a compact 144-pin LQFP package, offering a balance of logic density, embedded memory, and I/O flexibility for cost-sensitive and industrial designs. It is built on the Cyclone family architecture described in the device handbook (1.5‑V, 0.13‑µm SRAM process) and targets data-path and control applications that require on-chip RAM and a moderate number of logic elements.

With 2,910 logic elements (291 LABs), approximately 59,904 bits of embedded RAM, 104 user I/O pins, and an industrial operating range (−40 °C to 100 °C), this device is suited to space-constrained boards where a surface-mount 144‑LQFP package and predictable power rails (1.425 V to 1.575 V) are required.

Key Features

• Core Architecture Cyclone family SRAM-based FPGA architecture (1.5‑V, 0.13‑µm process) delivering 2,910 logic elements and 291 LABs for combinational and sequential logic implementation.
• Embedded Memory Approximately 59,904 bits of on-chip RAM to support small data buffers, FIFOs, and state storage within the FPGA fabric.
• I/O Density & Standards 104 user I/O pins provide flexible external connectivity. The Cyclone family supports common I/O standards (LVTTL, LVCMOS, SSTL‑2, SSTL‑3, LVDS), enabling a range of interfacing options.
• Memory Interface Support Series-level Cyclone documentation indicates support for external memory interfaces such as DDR SDRAM and SDR SDRAM, enabling designs that require external memory coupling.
• Clocking Device documentation for the EP1C3 family specifies 1 PLL to support clock multiplication and phase shifting for typical clocking needs.
• Package & Mounting 144‑LQFP package (supplier reference: 144‑TQFP, 20×20) in a surface-mount form factor suitable for compact PCB layouts.
• Power & Temperature Core supply range 1.425 V to 1.575 V and rated for industrial operation from −40 °C to 100 °C.
• Compliance RoHS‑compliant manufacturing to meet common environmental requirements.

Typical Applications

• Embedded Control Systems Implement control logic, protocol handling, and glue logic in industrial controllers where the −40 °C to 100 °C range and surface-mount 144‑pin footprint are beneficial.
• Memory Interface and Data-Path Use the on-chip RAM and series-level support for DDR SDRAM to build buffering and memory interface functions in data-path applications.
• Sensor Aggregation and I/O Bridging Leverage 104 user I/Os and multi-standard I/O support to aggregate sensors, convert signals, and bridge peripheral interfaces on a single FPGA.
• Prototyping and Low-Cost FPGA Implementations The compact package and moderate logic density make the device suitable for proof-of-concept designs and cost-sensitive production devices.

Unique Advantages

• Balanced Logic and Memory: 2,910 logic elements paired with ~59,904 bits of embedded RAM provide a practical combination for control and buffering functions without external logic.
• Compact Package with Ample I/O: 144‑LQFP surface-mount package delivers a space-efficient footprint while offering 104 user I/O pins for versatile board-level connectivity.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C for reliable operation across industrial environments.
• Flexible Power Envelope: Designed for a 1.425 V to 1.575 V core supply to match system power rails derived for the Cyclone family.
• Multi-Standard I/O Support: Series-level support for LVTTL, LVCMOS, SSTL, and LVDS enables interfacing with a broad range of peripherals and memory types.
• Tooling and Migration Support: Cyclone device documentation references vendor tools (e.g., Quartus II) for pin cross-referencing and device migration across densities, aiding design scalability.

Why Choose EP1C3T144I7N?

The EP1C3T144I7N is positioned for engineers needing a reliable, industrial-grade Cyclone FPGA with a practical mix of logic elements, embedded RAM, and I/O in a compact 144‑pin surface-mount package. Its operating temperature range, RoHS compliance, and common I/O standard support make it suitable for industrial controllers, memory-interface modules, and space-constrained embedded systems.

Designers benefit from a documented Cyclone architecture and vendor tooling references for migration and pin planning, enabling straightforward integration into projects that require moderate logic density, on-chip buffering, and flexible external interfacing.

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