EP1C4F324C6N

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA

Quantity 641 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits78336

Overview of EP1C4F324C6N – Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA

The EP1C4F324C6N is a Cyclone® family FPGA in a 324-ball BGA package designed for mid-range logic integration and on-chip memory. It implements the Cyclone architecture and provides 4,000 logic elements with 78,336 bits of embedded RAM, making it suitable for data-path functions, protocol bridging, and memory interface tasks in commercial products.

This surface-mount device operates from a nominal 1.5 V supply range (1.425 V to 1.575 V), is RoHS compliant, and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Logic Capacity — 4,000 logic elements for medium-density programmable logic and control functions.
  • On-chip Memory — 78,336 bits of embedded RAM to support buffering, FIFOs, and small data storage needs.
  • I/O Resources — 249 user I/O pins to interface with external devices and peripherals in a compact package.
  • Clocking — Cyclone family architecture provides up to two PLLs for clock multiplication and phase shifting (family feature).
  • Process and Configuration — Based on the Cyclone family 1.5-V, 0.13-µm SRAM process and supports standard Cyclone configuration and testing flows (family feature).
  • Package and Mounting — 324-ball FineLine BGA (324-FBGA, 19×19) in a 324-BGA package, designed for surface-mount assembly.
  • Power — Supply voltage range 1.425 V to 1.575 V for device core operation.
  • Operating Conditions — Commercial grade, operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Data-path processing — Implement mid-range packet processing, protocol handling, and customized logic pipelines using 4,000 logic elements and embedded RAM.
  • Memory interface bridging — Support DDR/SDRAM interface designs and buffering tasks using the Cyclone family’s memory interface features.
  • High-speed I/O and serialization — Use the device’s I/O count to implement LVDS-capable links and multi-channel interfaces for communication and sensor aggregation (family I/O standards supported).
  • Embedded control in commercial electronics — Integrate control, timing, and peripheral management functions in compact consumer or commercial equipment using the 324-BGA package.

Unique Advantages

  • Balanced mid-range capacity: 4,000 logic elements and 78,336 bits of RAM provide a compact solution for designs that need more capability than small CPLDs but do not require the highest-density FPGAs.
  • Flexible I/O count: 249 user I/O pins enable broad peripheral connectivity while keeping board area compact with a 19×19 FBGA footprint.
  • Onboard clocking resources: Family-level support for up to two PLLs allows clock domain management, frequency synthesis, and phase control for complex timing requirements.
  • Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product deployments.
  • Proven Cyclone ecosystem: Built on the Cyclone family architecture and tooling, enabling pin migration and design portability across Cyclone devices (Quartus II support for pin cross-referencing and migration noted in family documentation).

Why Choose EP1C4F324C6N?

The EP1C4F324C6N combines a Cyclone family architecture with a practical balance of logic, embedded RAM, and I/O in a compact 324-BGA package. It is well suited for commercial applications requiring efficient data-path processing, memory interfacing, and multi-channel I/O while maintaining a surface-mount, RoHS-compliant form factor.

Designers targeting mid-range programmable solutions will find this device appropriate for scaling within the Cyclone product family and compatible with Cyclone development flows and migration strategies described in the Cyclone device handbook.

Request a quote or submit a product inquiry to receive pricing and availability for the EP1C4F324C6N.

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