EP1C4F324C6
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA |
|---|---|
| Quantity | 612 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 249 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 78336 |
Overview of EP1C4F324C6 – Cyclone FPGA, 324-BGA, 4,000 logic elements
The EP1C4F324C6 is a Cyclone® field-programmable gate array (FPGA) in a 324-BGA package, offering 4,000 logic elements and approximately 78 Kbits of embedded RAM. It is built on the Cyclone family architecture based on a 1.5‑V, 0.13‑μm, all‑layer copper SRAM process and targets cost‑sensitive data‑path and control applications that require moderate logic density, on‑chip memory, and flexible I/O.
Device-level specifications include a supply voltage range of 1.425 V to 1.575 V, support for surface‑mount 324‑FBGA (19×19) packaging, 249 user I/O pins, and commercial temperature grading (0 °C to 85 °C). The device is RoHS‑compliant.
Key Features
- Core Architecture Cyclone family SRAM-based FPGA architecture; device density of 4,000 logic elements for data‑path and control logic integration.
- Embedded Memory Approximately 78 Kbits (78,336 bits) of on‑chip RAM to support buffers, FIFOs, and small on‑chip data structures.
- Clocking Includes PLL resources consistent with the Cyclone family to support clock multiplication and phase shifting (family documentation references up to two PLLs for EP1C4 devices).
- I/O 249 user I/O pins provided in the 324‑BGA package to support parallel interfaces and board-level connectivity.
- Power Core supply specified between 1.425 V and 1.575 V to match system power budgets and regulator designs.
- Package & Mounting 324‑BGA package (supplier device package: 324‑FBGA, 19×19) with surface‑mount assembly.
- Operating Range & Grade Commercial grade operation from 0 °C to 85 °C.
- Compliance RoHS‑compliant for lead‑free assembly requirements.
Typical Applications
- Data‑path processing Use the device to implement moderate-density packet processing, signal steering, or custom datapath logic where on‑chip RAM and 4,000 logic elements meet throughput and buffering needs.
- Memory interface support Suitable for designs requiring on‑chip logic to interface with external memory systems; the Cyclone family documentation highlights support for DDR SDRAM interfaces.
- High‑density I/O control With 249 user I/O pins in a compact BGA footprint, the device is effective for multi‑lane parallel interfaces, sensor aggregation, and board‑level glue logic.
- Embedded control and prototyping Well‑suited for control logic, peripheral bridging, and FPGA‑based prototyping tasks in commercial electronic systems.
Unique Advantages
- Balanced logic and memory 4,000 logic elements paired with ~78 Kbits of embedded RAM provide a compact platform for integrating control and moderate buffering on a single device.
- High I/O density in a compact package 249 user I/O pins in a 324‑FBGA (19×19) package reduce board routing complexity for multi‑signal interfaces.
- Low‑voltage core Specified core supply range (1.425–1.575 V) enables predictable power provisioning and design integration with modern power rails.
- Commercial temperature and RoHS compliance Rated for 0 °C to 85 °C operation and RoHS‑compliant to support standard commercial product lifecycles and assembly processes.
- Family architecture continuity Part of the Cyclone FPGA family, providing architecture and configuration characteristics consistent with family documentation for seamless design planning.
Why Choose EP1C4F324C6?
The EP1C4F324C6 positions itself as a practical Cyclone FPGA choice when you need a compact, commercially graded FPGA with a balanced combination of logic resources, embedded memory, and extensive I/O capability in a 324‑BGA footprint. Its specification set—4,000 logic elements, approximately 78 Kbits of on‑chip RAM, 249 user I/Os, and a 1.425–1.575 V core supply—makes it suitable for board‑level integration where a moderate FPGA density and predictable thermal and power characteristics are required.
Designers and procurement teams seeking a RoHS‑compliant FPGA from the Cyclone family can leverage this device for moderate‑complexity data‑path, memory‑interface, and I/O‑dense applications while benefiting from the family’s documented architecture and configuration features.
Request a quote or submit your requirements to receive pricing and availability information for the EP1C4F324C6.

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