EP1C4F324C6

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA

Quantity 612 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits78336

Overview of EP1C4F324C6 – Cyclone FPGA, 324-BGA, 4,000 logic elements

The EP1C4F324C6 is a Cyclone® field-programmable gate array (FPGA) in a 324-BGA package, offering 4,000 logic elements and approximately 78 Kbits of embedded RAM. It is built on the Cyclone family architecture based on a 1.5‑V, 0.13‑μm, all‑layer copper SRAM process and targets cost‑sensitive data‑path and control applications that require moderate logic density, on‑chip memory, and flexible I/O.

Device-level specifications include a supply voltage range of 1.425 V to 1.575 V, support for surface‑mount 324‑FBGA (19×19) packaging, 249 user I/O pins, and commercial temperature grading (0 °C to 85 °C). The device is RoHS‑compliant.

Key Features

  • Core Architecture  Cyclone family SRAM-based FPGA architecture; device density of 4,000 logic elements for data‑path and control logic integration.
  • Embedded Memory  Approximately 78 Kbits (78,336 bits) of on‑chip RAM to support buffers, FIFOs, and small on‑chip data structures.
  • Clocking  Includes PLL resources consistent with the Cyclone family to support clock multiplication and phase shifting (family documentation references up to two PLLs for EP1C4 devices).
  • I/O  249 user I/O pins provided in the 324‑BGA package to support parallel interfaces and board-level connectivity.
  • Power  Core supply specified between 1.425 V and 1.575 V to match system power budgets and regulator designs.
  • Package & Mounting  324‑BGA package (supplier device package: 324‑FBGA, 19×19) with surface‑mount assembly.
  • Operating Range & Grade  Commercial grade operation from 0 °C to 85 °C.
  • Compliance  RoHS‑compliant for lead‑free assembly requirements.

Typical Applications

  • Data‑path processing  Use the device to implement moderate-density packet processing, signal steering, or custom datapath logic where on‑chip RAM and 4,000 logic elements meet throughput and buffering needs.
  • Memory interface support  Suitable for designs requiring on‑chip logic to interface with external memory systems; the Cyclone family documentation highlights support for DDR SDRAM interfaces.
  • High‑density I/O control  With 249 user I/O pins in a compact BGA footprint, the device is effective for multi‑lane parallel interfaces, sensor aggregation, and board‑level glue logic.
  • Embedded control and prototyping  Well‑suited for control logic, peripheral bridging, and FPGA‑based prototyping tasks in commercial electronic systems.

Unique Advantages

  • Balanced logic and memory  4,000 logic elements paired with ~78 Kbits of embedded RAM provide a compact platform for integrating control and moderate buffering on a single device.
  • High I/O density in a compact package  249 user I/O pins in a 324‑FBGA (19×19) package reduce board routing complexity for multi‑signal interfaces.
  • Low‑voltage core  Specified core supply range (1.425–1.575 V) enables predictable power provisioning and design integration with modern power rails.
  • Commercial temperature and RoHS compliance  Rated for 0 °C to 85 °C operation and RoHS‑compliant to support standard commercial product lifecycles and assembly processes.
  • Family architecture continuity  Part of the Cyclone FPGA family, providing architecture and configuration characteristics consistent with family documentation for seamless design planning.

Why Choose EP1C4F324C6?

The EP1C4F324C6 positions itself as a practical Cyclone FPGA choice when you need a compact, commercially graded FPGA with a balanced combination of logic resources, embedded memory, and extensive I/O capability in a 324‑BGA footprint. Its specification set—4,000 logic elements, approximately 78 Kbits of on‑chip RAM, 249 user I/Os, and a 1.425–1.575 V core supply—makes it suitable for board‑level integration where a moderate FPGA density and predictable thermal and power characteristics are required.

Designers and procurement teams seeking a RoHS‑compliant FPGA from the Cyclone family can leverage this device for moderate‑complexity data‑path, memory‑interface, and I/O‑dense applications while benefiting from the family’s documented architecture and configuration features.

Request a quote or submit your requirements to receive pricing and availability information for the EP1C4F324C6.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up