EP1C4F324C7N

The EP1C4F324C7N is a Cyclone® family FPGA offering mid-range logic density and flexible I/O in a compact 324-ball BGA package. It implements the Cyclone architecture and is suited for data-path and interface tasks where a balance of logic resources, embedded memory, and I/O count are required.

This device targets commercial applications requiring a low-voltage SRAM-based FPGA with support for multiple clocking resources and a range of I/O. It provides designers a platform for custom logic, protocol bridging, and memory interfacing within a defined commercial temperature range.

Key Features

• Core Logic — 4,000 logic elements for implementing custom combinational and sequential logic and mid-density system functions.
• Embedded Memory — Approximately 0.078 Mbits of on-chip RAM (78,336 total bits) for data buffering and small local storage.
• Clocking — Up to two PLLs (as provided in the Cyclone device family) to support clock multiplication and phase shifting for timing management.
• I/O Capacity — 249 user I/O pins to support multiple interfaces and external device connections.
• Package — 324-ball FineLine BGA (324-FBGA, 19 × 19) in a surface-mount package for space-efficient board designs.
• Power — Nominal core supply range of 1.425 V to 1.575 V for the device core.
• Operating Grade — Commercial temperature grade with operating range from 0 °C to 85 °C.
• Standards and Compatibility — Cyclone family features include support for common I/O standards and memory interfaces as detailed in the Cyclone device handbook.
• Regulatory — RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Data-Path Processing — Implement mid-range packet handling, data formatting, or signal-conditioning functions using the device's logic elements and embedded RAM.
• Memory Interface and Bridging — Use the Cyclone family’s memory-interface capabilities for DDR/SDR bridging and buffering in systems requiring external memory support.
• Custom I/O and Protocol Conversion — Leverage 249 I/O pins to build protocol bridges, board-level interface logic, or glue logic between ASSP/ASIC components.
• Prototyping and System Integration — Deploy as a programmable platform for validating logic functions and integrating IP cores during system development.

Unique Advantages

• Balanced Logic and Memory: 4,000 logic elements paired with approximately 78 Kbits of on-chip RAM enable mid‑complexity designs without external buffer requirements.
• High I/O Count: 249 user I/O pins provide flexibility for multi‑interface applications and dense board-level connectivity.
• Compact BGA Package: 324-FBGA (19 × 19) saves PCB area while supporting a high pin count for system integration.
• Low-Voltage Core: Narrow core supply range (1.425 V–1.575 V) supports consistent power sequencing and design planning.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for mainstream electronics deployed in commercial environments.
• RoHS Compliant: Supports lead‑free manufacturing flows and environmental compliance objectives.

Why Choose EP1C4F324C7N?

The EP1C4F324C7N delivers a practical combination of logic density, embedded memory, and I/O capacity in a space-efficient BGA package, making it well suited for commercial designs that need mid-range programmable logic and flexible interfacing. Its Cyclone family heritage provides familiar architecture and toolchain continuity for designers migrating from or within the Cyclone lineup.

This device is a fit for teams building custom data-path functions, protocol bridges, and prototype systems that require a programmable solution with clear power and temperature specifications, RoHS compliance, and a proven FPGA architecture.

Request a quote or submit a procurement inquiry to evaluate EP1C4F324C7N for your next design project.