EP1C4F324I7
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA |
|---|---|
| Quantity | 1,043 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 249 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 78336 |
Overview of EP1C4F324I7 – Industrial Cyclone® FPGA, 324-BGA
The EP1C4F324I7 is an industrial-grade Cyclone® Field Programmable Gate Array (FPGA) in a 324-ball fine-pitch BGA package. It integrates 4,000 logic elements and 78,336 bits of on-chip RAM within a compact 324-FBGA (19×19) footprint for space-constrained embedded designs.
Designed for data-path and control applications, this Cyclone device delivers a balance of logic capacity, embedded memory and I/O density—making it suitable for industrial automation, communications peripherals and general-purpose system control that require a robust operating temperature range and RoHS-compliant manufacturing.
Key Features
- Logic Capacity — 4,000 logic elements and 400 logic array blocks (LABs) to implement moderate-complexity logic, control and glue logic functions.
- On-chip Memory — 78,336 bits of embedded RAM for local buffering, FIFOs and small lookup tables.
- I/O Density — Up to 249 user I/O pins for rich peripheral interfacing and board-level connectivity.
- Package — 324-ball Fine-Pitch BGA (324-FBGA, 19×19) surface-mount package for compact board integration and high pin count in a small footprint.
- Supply Voltage — Core supply range of 1.425 V to 1.575 V to match controlled power domains and system rails.
- Industrial Temperature Range — Specified for −40 °C to 100 °C operation to meet demanding environmental conditions.
- PLL Clocking — Cyclone architecture supports up to two PLLs (series-level feature) for clock multiplication and phase control to support a variety of timing architectures.
- I/O Standards (series capability) — Cyclone family support for multiple I/O standards, including LVTTL, LVCMOS, SSTL and LVDS, enabling flexible interface options for system-level connectivity.
- Regulatory & Mounting — RoHS-compliant and designed for surface-mount assembly.
Typical Applications
- Industrial Control — Implement motor control logic, I/O aggregation and deterministic control tasks within extended temperature environments.
- Communications Peripherals — Manage parallel and serial interfaces, protocol bridging and timing-critical packet handling using available PLLs and high I/O count.
- Embedded System Glue Logic — Offload interface conversion, address decoding and custom bus logic to consolidate discrete components and simplify PCB layouts.
- Memory Interface Management — Act as a logic layer between system controllers and external memory devices using supported Cyclone memory interfacing features.
Unique Advantages
- Balanced Logic and Memory — 4,000 logic elements combined with 78,336 bits of RAM provide the right mix for control and mid-density data-path tasks without overprovisioning.
- High Pin Count in Small Footprint — 249 I/Os in a 324-FBGA (19×19) package enable dense connectivity while keeping board area low.
- Designed for Industrial Use — Specified operating range from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
- Flexible Clocking — Up to two PLLs (series capability) allow designers to implement clock multiplication and phase alignment for complex timing requirements.
- Standards-Compatible I/O — Support for a range of I/O standards (series-level feature set) eases integration with common memory and interface devices.
- RoHS Compliant — Meets environmental compliance for lead-free manufacturing and assembly processes.
Why Choose EP1C4F324I7?
The EP1C4F324I7 offers a practical combination of logic resources, embedded RAM and high I/O density in a compact 324-ball FBGA package, targeted at engineers building industrial and embedded systems that require reliable operation across a wide temperature range. Its Cyclone architecture features—such as integrated PLLs and broad I/O standard support—provide design flexibility for timing-sensitive and interface-rich applications.
This FPGA is well suited for teams seeking a mid-density programmable device that simplifies board-level design, consolidates discrete logic, and supports deployment in industrial environments while maintaining RoHS compliance.
Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the EP1C4F324I7.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018