EP1C4F324I7

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA

Quantity 1,043 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits78336

Overview of EP1C4F324I7 – Industrial Cyclone® FPGA, 324-BGA

The EP1C4F324I7 is an industrial-grade Cyclone® Field Programmable Gate Array (FPGA) in a 324-ball fine-pitch BGA package. It integrates 4,000 logic elements and 78,336 bits of on-chip RAM within a compact 324-FBGA (19×19) footprint for space-constrained embedded designs.

Designed for data-path and control applications, this Cyclone device delivers a balance of logic capacity, embedded memory and I/O density—making it suitable for industrial automation, communications peripherals and general-purpose system control that require a robust operating temperature range and RoHS-compliant manufacturing.

Key Features

  • Logic Capacity — 4,000 logic elements and 400 logic array blocks (LABs) to implement moderate-complexity logic, control and glue logic functions.
  • On-chip Memory — 78,336 bits of embedded RAM for local buffering, FIFOs and small lookup tables.
  • I/O Density — Up to 249 user I/O pins for rich peripheral interfacing and board-level connectivity.
  • Package — 324-ball Fine-Pitch BGA (324-FBGA, 19×19) surface-mount package for compact board integration and high pin count in a small footprint.
  • Supply Voltage — Core supply range of 1.425 V to 1.575 V to match controlled power domains and system rails.
  • Industrial Temperature Range — Specified for −40 °C to 100 °C operation to meet demanding environmental conditions.
  • PLL Clocking — Cyclone architecture supports up to two PLLs (series-level feature) for clock multiplication and phase control to support a variety of timing architectures.
  • I/O Standards (series capability) — Cyclone family support for multiple I/O standards, including LVTTL, LVCMOS, SSTL and LVDS, enabling flexible interface options for system-level connectivity.
  • Regulatory & Mounting — RoHS-compliant and designed for surface-mount assembly.

Typical Applications

  • Industrial Control — Implement motor control logic, I/O aggregation and deterministic control tasks within extended temperature environments.
  • Communications Peripherals — Manage parallel and serial interfaces, protocol bridging and timing-critical packet handling using available PLLs and high I/O count.
  • Embedded System Glue Logic — Offload interface conversion, address decoding and custom bus logic to consolidate discrete components and simplify PCB layouts.
  • Memory Interface Management — Act as a logic layer between system controllers and external memory devices using supported Cyclone memory interfacing features.

Unique Advantages

  • Balanced Logic and Memory — 4,000 logic elements combined with 78,336 bits of RAM provide the right mix for control and mid-density data-path tasks without overprovisioning.
  • High Pin Count in Small Footprint — 249 I/Os in a 324-FBGA (19×19) package enable dense connectivity while keeping board area low.
  • Designed for Industrial Use — Specified operating range from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
  • Flexible Clocking — Up to two PLLs (series capability) allow designers to implement clock multiplication and phase alignment for complex timing requirements.
  • Standards-Compatible I/O — Support for a range of I/O standards (series-level feature set) eases integration with common memory and interface devices.
  • RoHS Compliant — Meets environmental compliance for lead-free manufacturing and assembly processes.

Why Choose EP1C4F324I7?

The EP1C4F324I7 offers a practical combination of logic resources, embedded RAM and high I/O density in a compact 324-ball FBGA package, targeted at engineers building industrial and embedded systems that require reliable operation across a wide temperature range. Its Cyclone architecture features—such as integrated PLLs and broad I/O standard support—provide design flexibility for timing-sensitive and interface-rich applications.

This FPGA is well suited for teams seeking a mid-density programmable device that simplifies board-level design, consolidates discrete logic, and supports deployment in industrial environments while maintaining RoHS compliance.

Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the EP1C4F324I7.

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