EP1C4F400C7
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 301 78336 4000 400-BGA |
|---|---|
| Quantity | 922 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 400-FBGA (21x21) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-BGA | Number of I/O | 301 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 400 | Number of Logic Elements/Cells | 4000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 78336 |
Overview of EP1C4F400C7 – Cyclone FPGA, 400-BGA, 4,000 Logic Elements
The EP1C4F400C7 is an Intel Cyclone® field programmable gate array (FPGA) device in a 400-ball fine-pitch BGA package. It combines a mid-range logic capacity with embedded RAM and a high I/O count to address data-path and interface-oriented designs.
Built on the Cyclone device family architecture, the device supports features for clocking, memory interfacing, and high-speed I/O standards, making it suitable for commercial embedded applications that require flexible logic implementation and broad I/O connectivity.
Key Features
- Logic Capacity Approximately 4,000 logic elements for implementing moderate-density combinational and sequential logic functions.
- Embedded Memory Approximately 78 Kbits of on-chip RAM (78,336 total RAM bits) to support FIFOs, buffers, and small on-chip data storage.
- I/O Density Up to 301 user I/O pins, providing extensive external device and bus connectivity for multi-channel interfaces.
- Clocking Resources Includes up to two phase-locked loops (PLLs) and multiple global clock resources to support clock multiplication and phase shifting for complex timing schemes.
- High-Speed I/O Support Family-level support for LVDS (high-speed and low-speed) and PCI (66- and 33-MHz, 64- and 32-bit) interfaces for common high-speed protocols and bus bridging.
- Memory Interface Family support for external memory types such as DDR SDRAM, FCRAM, and SDR SDRAM for designs that require external main memory or buffer expansion.
- Supply and Mounting Operates from a core voltage range of 1.425 V to 1.575 V and is provided in a surface-mount 400-FBGA (21 × 21) package.
- Commercial Grade & RoHS Commercial temperature grade (0 °C to 85 °C) and RoHS-compliant for lead-free assembly environments.
Typical Applications
- Data-path processing Implement mid-range packet processing, protocol translation, or custom datapath logic where 4,000 logic elements and on-chip RAM provide the required throughput and buffering.
- High-speed interface bridging Use the high I/O count and family LVDS/PCI support to bridge or adapt between high-speed serial/parallel interfaces and system logic.
- Memory controller and buffering Leverage built-in memory resources and family-level DDR support to create controllers, FIFOs, and interface logic for external memory subsystems.
Unique Advantages
- Balanced logic and memory Combines about 4,000 logic elements with ~78 Kbits of embedded RAM to support both control logic and on-chip data storage in one device.
- High I/O availability 301 user I/O pins enable complex multi-channel interfaces and simplified board routing for system designs requiring many connections.
- Flexible clocking On-chip PLLs and multiple global clock resources help simplify clock-domain management and timing closure for multi-rate designs.
- Compact, production-ready package 400-FBGA (21 × 21) surface-mount package offers a compact footprint for space-constrained commercial products.
- Commercial operating range Specified for 0 °C to 85 °C operation, aligning with a wide range of commercial embedded applications.
- RoHS compliant Designed for lead-free assembly processes and regulatory compliance in commercial manufacturing.
Why Choose EP1C4F400C7?
The EP1C4F400C7 positions itself as a versatile mid-range Cyclone FPGA option for commercial embedded systems that require a balance of logic capacity, embedded memory, and extensive I/O. Its combination of approximately 4,000 logic elements, ~78 Kbits of on-chip RAM, and 301 user I/O pins makes it suitable for projects that need flexible protocol interfacing, memory buffering, and moderate computational logic in a compact BGA package.
Designed within the Cyclone family architecture, this device benefits from family-level features such as PLL-based clocking, high-speed I/O standards support, and external memory interfacing—providing a scalable path for designs that may migrate across Cyclone densities while maintaining consistent architectural elements.
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