EP1C4F400C6

The EP1C4F400C6 is a Cyclone® field programmable gate array (FPGA) from Intel designed for cost-sensitive data-path and I/O-dense applications. Built on the Cyclone device family architecture, this device integrates approximately 4,000 logic elements and 78,336 bits of embedded RAM to support mid-range logic and memory requirements.

With up to 301 user I/Os in a compact 400-ball FBGA (21 × 21) package and commercial-grade temperature rating, the EP1C4F400C6 targets applications that require flexible interfacing and moderate on-chip resources while maintaining low-voltage core operation.

Key Features

• Core Logic  Approximately 4,000 logic elements provide the programmable logic capacity needed for mid-density designs.
• Embedded Memory  78,336 bits of on-chip RAM (approximately 0.078 Mbits) for data buffering, small FIFOs, and control-state storage.
• I/O Density  Up to 301 user I/O pins support extensive external interfacing in a single device package.
• Package  400-ball FineLine BGA (400-FBGA, 21 × 21) in a surface-mount format suitable for space-constrained PCB layouts.
• Power  Core supply voltage range: 1.425 V to 1.575 V to match standard Cyclone low-voltage operation.
• Temperature and Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Standards and Compliance  RoHS-compliant manufacturing and component status.
• Family Capabilities (Cyclone)  As a Cyclone-family device, it benefits from the family’s architecture (SRAM-based configuration, on-chip PLL resources, and common toolchain support as described in the Cyclone device documentation).

Typical Applications

• Embedded Control and Glue Logic  Mid-density logic consolidation for control paths, protocol adaptation, and interface bridging.
• Consumer and Commercial Electronics  User-interface control, display drivers, and peripheral aggregation where commercial temperature grade is appropriate.
• Communications and Networking  I/O-dense front-end functions and protocol conversion requiring many external signals in a compact package.
• Memory Interface and Buffering  Small FIFOs and buffering tasks supported by on-chip RAM for moderate throughput systems.

Unique Advantages

• Balanced Logic and Memory  Combines approximately 4,000 logic elements with 78,336 bits of embedded RAM to support a wide range of mid-range designs without external FPGA-level memory.
• High I/O Count in a Compact Package  301 user I/Os in a 400-ball FBGA (21 × 21) enable complex external interfacing while minimizing PCB footprint.
• Low-Voltage Operation  Narrow core voltage range (1.425 V–1.575 V) aligns with standard Cyclone low-voltage power domains for consistent power planning.
• RoHS Compliant  Supports environmentally conscious manufacturing and procurement requirements.
• Commercial Temperature Rating  Rated 0 °C to 85 °C for mainstream commercial applications and product deployments.
• Surface-Mount FBGA  Surface-mount 400-FBGA simplifies automated assembly for volume production while delivering high pin density.

Why Choose EP1C4F400C6?

The EP1C4F400C6 offers a well-balanced combination of logic capacity, embedded RAM, and high I/O count in a compact 400-ball FBGA package, making it suitable for designers who need flexible programmability and dense external connectivity without moving to higher-cost, higher-density devices. Its Cyclone-family architecture and documented device features provide a predictable platform for mid-range data-path, control, and interface-focused designs.

This commercial-grade, RoHS-compliant FPGA is appropriate for product lines that require moderate logic/memory resources, extensive I/O, and standard operating-temperature support, while allowing designers to leverage the Cyclone device handbook and toolchain for design and migration planning.

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