EP1C4F324I7N

The EP1C4F324I7N is an Intel Cyclone® series FPGA supplied in a 324-FBGA (19×19) package. It integrates 4,000 logic elements and on-chip embedded memory to address mid-density programmable logic requirements for industrial applications.

Designed for data-path and control applications, this device combines a compact fine-pitch BGA package with a broad I/O count and industrial operating range to simplify integration in embedded and industrial systems.

Key Features

• Logic Capacity — 4,000 logic elements provide mid-range programmable logic resources for glue logic, state machines, and moderate processing tasks.
• Embedded Memory — 78,336 total RAM bits (approximately 78 Kbits) of on-chip memory to implement FIFOs, small buffers, and register files.
• I/O Density — Up to 249 I/O pins to support extensive external interfacing and parallel buses.
• Clocking Resources — Device-level Cyclone family clocking architecture (as specified for the family) supports PLLs for clock management.
• Power Supply — Core voltage supply range of 1.425 V to 1.575 V for precise power management in system designs.
• Package & Mounting — 324-ball fine-pitch BGA (324-FBGA, 19×19) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Rating — Specified operating range from −40 °C to 100 °C to meet industrial-environment requirements.
• Compliance — RoHS compliant for material and environmental conformance.

Typical Applications

• Data-path systems — Mid-density logic and on-chip memory make the device suitable for data buffering, protocol handling, and control logic in data-path applications.
• Industrial control — Industrial temperature rating and substantial I/O count support sensor interfacing, motor-control logic, and machine-control functions.
• Embedded platform glue logic — Use as a programmable glue solution between processors, memory, and peripheral ASICs where configurable logic and multiple I/Os are required.
• Interface bridging — High I/O density enables implementation of bus translators, parallel interface bridges, and I/O expansion functions.

Unique Advantages

• Balanced mid-range resources: 4,000 logic elements and 78,336 bits of RAM provide a compact yet capable resource set for many embedded and industrial designs.
• High I/O capacity: 249 I/O pins allow flexible external connectivity without sacrificing board-level routing options.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployment in demanding environments.
• Compact package: 324-FBGA (19×19) enables space-efficient board layouts while maintaining high pin count.
• Precise core voltage window: Narrow supply range (1.425 V–1.575 V) supports stable core operation and predictable power design.
• RoHS compliant: Meets material restriction requirements for environmentally conscious system design.

Why Choose EP1C4F324I7N?

The EP1C4F324I7N balances programmable logic capacity, embedded memory, and a large I/O complement in a compact 324-FBGA package, making it well suited for mid-density FPGA roles in industrial and embedded applications. Its industrial temperature rating and RoHS compliance help ensure reliable operation and environmental conformance across production deployments.

This Cyclone-series device is appropriate for engineers seeking a scalable, manufacturable programmable-logic component for interfacing, control, and data-path tasks where moderate logic resources and extensive I/O are required.

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