EP1C4F324C8

The EP1C4F324C8 is a Cyclone family FPGA offered in a 324-ball fine-pitch BGA package, designed for mid-density programmable logic and data-path applications. It combines 4,000 logic elements with 78,336 bits of on-chip RAM and a 249-pin I/O count to address control, interface bridging, and moderate memory-buffering tasks within commercial-temperature designs.

This device is built for designers who require a compact, surface-mount FPGA solution with Cyclone-family architecture compatibility and support for common FPGA toolflows and IP ecosystems documented for Cyclone devices.

Key Features

• Logic Capacity — 4,000 logic elements suited for mid-range programmable logic functions and moderate-density control and datapath implementations.
• Embedded Memory — 78,336 total RAM bits (approximately 78 Kbits) for on-chip buffering, FIFOs, and small lookup tables.
• I/O — 249 user I/O pins to support a broad range of parallel and serialized interfacing needs.
• Package & Mounting — 324-ball fine-pitch BGA (324-FBGA, 19 × 19) in a surface-mount form factor for space-efficient board integration.
• Power Supply — Core supply range specified at 1.425 V to 1.575 V to meet Cyclone device operating requirements.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for general-purpose applications.
• Cyclone Family Capabilities — As part of the Cyclone family, this device aligns with architecture features described for Cyclone devices, including support for PLLs and common memory and I/O interface standards documented for the family.
• Compliance — RoHS compliant for environmental conformity in commercial electronic assemblies.

Typical Applications

• Data-path and control logic — Implement custom packet handling, protocol translation, and control-state machines using the device’s logic element and RAM resources.
• Memory interface buffering — On-chip RAM and Cyclone-family memory support enable small buffering and controller logic for external SDRAM/DDR interfaces outlined for the family.
• Peripheral and bus bridging — Use the available I/O resources to implement bridge logic between processors, peripherals, and custom interfaces.
• Signal conditioning and pre-processing — Deploy the FPGA for front-end processing tasks where moderate logic density and multiple I/Os are required.

Unique Advantages

• Right-sized logic density: 4,000 logic elements provide a balanced option between small, low-cost FPGAs and larger, higher-cost devices for mid-range designs.
• Significant on-chip RAM: 78,336 bits of embedded memory reduce external memory needs for many buffering and LUT-based functions, simplifying board design.
• High I/O count in a compact package: 249 I/Os in a 324-FBGA (19 × 19) allow dense signal routing while conserving PCB area.
• Surface-mount BGA form factor: The 324-ball FBGA supports automated assembly and reliable solder connections for production volumes.
• Commercial-temperature suitability: Rated 0 °C to 85 °C for mainstream electronics deployed in indoor and controlled-environment systems.
• RoHS compliance: Meets environmental regulatory expectations for modern electronic assemblies.

Why Choose EP1C4F324C8?

The EP1C4F324C8 positions itself as a compact, Cyclone-family FPGA option for engineers needing a mid-density programmable solution with a substantial I/O count and embedded RAM. Its 4,000 logic elements and 78,336 bits of on-chip memory make it suitable for control logic, interface bridging, and moderate buffering tasks while the 324-FBGA package keeps board footprint and assembly straightforward.

Designed within the Cyclone device family, this device benefits from documented Cyclone architecture features and toolchain references, enabling designers to leverage family-level IP and development flows when migrating or scaling designs.

Request a quote or submit an inquiry to receive pricing and availability information for EP1C4F324C8 and to discuss how this Cyclone FPGA can fit into your next design.