EP1C4F324C7

The EP1C4F324C7 is a Cyclone® family FPGA in a 324‑ball fine-pitch BGA package, offering 4,000 logic elements and approximately 78,336 bits of on-chip RAM. Built for data-path and embedded control applications, this device delivers reprogrammable logic, on-chip memory, and programmable clocking resources suitable for systems requiring flexible I/O and moderate logic density.

As a Cyclone device, it is based on the family architecture described in the Cyclone device handbook and includes features such as programmable PLLs and a DDR-capable interface approach that support memory and high‑throughput I/O implementations.

Key Features

• Logic Capacity – 4,000 logic elements (LEs) to implement combinational and sequential logic for control, glue, and moderate-complexity data-path functions.
• Embedded Memory – Approximately 78,336 total RAM bits (M4K RAM blocks: 17), providing on-chip storage for buffers, FIFOs, and small lookup tables.
• Programmable Clocking – Up to 2 PLLs per device for clock multiplication and phase shifting as described for the Cyclone family.
• I/O Density – 249 user I/O pins to interface with external peripherals, memories, and ASSP/ASIC devices.
• Package and Mounting – 324‑FBGA (19 × 19) package, surface‑mount mounting type, suitable for compact board designs.
• Power and Voltage – Core supply range 1.425 V to 1.575 V; device family is based on a 1.5‑V process.
• Operating Range – Commercial grade operation from 0 °C to 85 °C.
• Standards and Compliance – RoHS compliant.

Typical Applications

• Data‑Path Processing – Implement medium-density data-path logic and pipelined processing where reprogrammable logic and on-chip RAM are required.
• Memory Interface and Bridging – Use the Cyclone family’s DDR-capable interface features and PLLs to build memory controllers, buffers, or protocol bridges to external SDRAM/DDR devices.
• Peripheral and Interface Logic – Provide glue logic, protocol conversion, and high‑pin‑count I/O handling for systems that require flexible I/O mapping across 249 pins.
• Embedded Control and Prototyping – Ideal for control logic, state machines, and rapid prototyping of ASIC or ASSP functions at commercial operating conditions.

Unique Advantages

• Balanced Logic and Memory – 4,000 logic elements combined with approximately 78,336 bits of embedded RAM enable compact implementations of control and buffering without excessive external components.
• Flexible Clocking – Two PLLs allow designers to generate and phase‑align multiple clock domains directly on the device, simplifying timing architectures.
• High I/O Count – 249 available I/O pins support dense peripheral connectivity and multi-device interfacing on a single FPGA package.
• Compact, Surface‑Mount Package – 324‑FBGA (19 × 19) provides a space-efficient footprint for board-level integration while supporting migration across Cyclone package options.
• Commercial Temperature and RoHS Compliance – Rated for 0 °C to 85 °C operation and RoHS compliant for contemporary assembly processes and regulatory requirements.

Why Choose EP1C4F324C7?

The EP1C4F324C7 positions itself as a practical, reprogrammable logic device for designs that need moderate logic density, substantial I/O capacity, and on-chip RAM in a compact BGA package. Its Cyclone family heritage provides programmable clocking resources and architecture optimized for data-path and memory-interfacing tasks.

This device is well suited to engineering teams implementing control logic, protocol bridging, memory interfaces, or rapid prototypes that benefit from FPGA flexibility, supported by the Cyclone device handbook guidance and the family’s development ecosystem.

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