EP1C4F324C8N

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 78336 4000 324-BGA

Quantity 253 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs400Number of Logic Elements/Cells4000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits78336

Overview of EP1C4F324C8N – Cyclone® FPGA, 4,000 Logic Elements, 78,336-bit RAM, 249 I/O, 324-BGA

The EP1C4F324C8N is a Cyclone® family field programmable gate array (FPGA) optimized for data-path and embedded logic applications. It integrates approximately 4,000 logic elements and about 78 Kbits of on-chip RAM in a compact 324-ball FBGA package for space-constrained board designs.

Built on the Cyclone architecture and intended for commercial applications, this device provides a combination of programmable logic density, a high I/O count, and low-voltage operation to support memory interfaces, peripheral bridging, and custom digital functions.

Key Features

  • Core Logic  Approximately 4,000 logic elements suitable for mid-density programmable logic and control tasks.
  • Embedded Memory  Approximately 78,336 bits of on-chip RAM to implement FIFOs, buffers, and small data stores without external memory.
  • I/O Capacity  249 user I/O pins to support dense peripheral and memory interfaces on a single device.
  • Package & Mounting  324-ball FBGA (19 × 19) package, surface-mount mounting for compact PCB integration.
  • Power  Nominal low-voltage supply range 1.425 V to 1.575 V, consistent with Cyclone family 1.5-V process operation.
  • Temperature & Grade  Commercial temperature range 0 °C to 85 °C; suitable for general-purpose commercial applications.
  • Compliance  RoHS-compliant construction to meet lead-free assembly and environmental requirements.
  • Cyclone Family Capabilities  Implements Cyclone architecture features such as PLL support and memory-interface capabilities as defined for the family series.

Typical Applications

  • Data-Path Processing  Mid-density programmable logic for custom data processing, protocol handling, and signal routing tasks.
  • Memory Interface Support  Ideal for designs requiring on-chip RAM and Cyclone family memory-interface features to support external DDR or fast-cycle memory connections.
  • High-Density I/O  Use in systems that require numerous GPIO or parallel interfaces—such as peripheral bridging, sensor aggregation, or control front-ends.
  • Embedded Control  Implement control logic, glue-logic, or custom sequencers where a compact BGA package and surface-mount assembly are preferred.

Unique Advantages

  • Balanced Logic and Memory: Combines roughly 4,000 logic elements with approximately 78 Kbits of RAM to support common mid-range FPGA functions without excessive external memory.
  • High I/O Density: 249 user I/Os enable consolidation of multiple interfaces and peripherals onto a single IC, reducing board-level complexity.
  • Compact, Surface-Mount BGA: 324-ball FBGA (19 × 19) package provides a space-efficient solution for tightly packed PCBs and modern form-factor requirements.
  • Low-Voltage Operation: 1.425 V to 1.575 V supply range supports low-voltage system architectures while aligning with Cyclone family process characteristics.
  • RoHS-Compliant: Manufactured to meet RoHS requirements for lead-free assembly and environmental compliance.
  • Vertical Migration Within Family: Compatibility with Cyclone family migration practices facilitates design scaling across densities and package options.

Why Choose EP1C4F324C8N?

The EP1C4F324C8N positions itself as a practical mid-density Cyclone FPGA option for commercial embedded designs that need a balance of logic capacity, embedded memory, and high I/O count in a compact FBGA footprint. Its low-voltage operation and RoHS-compliant package make it suitable for modern board-level integration where space and regulatory compliance matter.

This device is a good fit for engineers building data-path logic, memory interface controllers, peripheral bridges, and custom control or signal-processing functions who require predictable, documented Cyclone family behavior and migration pathways to other family densities.

Request a quote or submit a purchase inquiry to receive pricing, availability, and additional integration support for EP1C4F324C8N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up