EP1C3T100C8N

The EP1C3T100C8N is an Intel Cyclone® family FPGA provided in a 100‑pin TQFP (14×14) surface‑mount package. It delivers a compact, low‑voltage FPGA option with a balanced mix of logic, embedded memory, and I/O for commercial embedded designs.

Designed for data‑path and interfacing applications, this Cyclone device leverages the family architecture to provide on‑chip RAM, programmable logic resources, and clocking support suitable for memory interfaces and high‑speed I/O-oriented functions.

Key Features

• Logic Capacity — 2,910 logic elements (LEs) to implement control, glue logic, and mid‑range programmable functions.
• Embedded Memory — 59,904 bits of on‑chip RAM for FIFOs, small buffers, and state storage.
• I/O and Package — 65 user I/O pins in a 100‑TQFP (14×14) surface‑mount package, enabling compact board integration.
• Clocking — Family data indicates support for on‑device PLLs; the EP1C3 device provides 1 PLL for clock multiplication and phase alignment.
• Power — Operates from a core supply range of 1.425 V to 1.575 V, suitable for low‑voltage FPGA deployments.
• Operating Range — Commercial temperature grade with specified operating range of 0 °C to 85 °C.
• Mounting and Compliance — Surface mount device with RoHS compliance for regulatory and manufacturing compatibility.

Typical Applications

• Data‑path processing — Use the device’s logic and embedded RAM to implement data buffering, protocol handling, and intermediate processing in compact systems.
• Memory interface controllers — Suitable for implementing controllers and interface logic for external memories (DDR SDRAM, SDR SDRAM, and FCRAM are supported by the Cyclone family).
• High‑speed I/O bridging — Supports high‑speed differential and single‑ended I/O standards at the family level, enabling LVDS and other interfaces for communication and sensor links.
• PCI and peripheral interfacing — Can be deployed for PCI bus interfacing and glue logic between ASSP/ASIC components and system peripherals.

Unique Advantages

• Compact package with usable I/O: 100‑TQFP (14×14) format balances board space and accessibility with 65 I/O pins for flexible integration.
• Right‑sized logic and memory: 2,910 logic elements paired with 59,904 bits of embedded RAM provide a mid‑range resource set for many control and interface tasks.
• Low‑voltage operation: Core supply from 1.425 V to 1.575 V supports low‑power system architectures while aligning with the Cyclone family process.
• Clocking flexibility: On‑device PLL support enables clock multiplication and phase adjustments for synchronized multi‑domain designs.
• Commercial grade and RoHS compliant: Specified for 0 °C to 85 °C operation and compliant with RoHS requirements for conventional commercial applications.

Why Choose EP1C3T100C8N?

The EP1C3T100C8N places Cyclone family functionality into a compact 100‑TQFP package with a balanced set of logic elements, embedded RAM, and accessible I/O. Its low core voltage and on‑device clock resources make it well suited for commercial embedded designs that require moderate logic density, memory buffering, and flexible interfacing.

This device is a practical choice for engineers seeking a cost‑effective, vendor‑supported FPGA solution for memory interfaces, data‑path processing, and peripheral bridging where commercial temperature operation and surface‑mount packaging are required.

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