EP1C3T144A8N

The EP1C3T144A8N is an Intel Cyclone® family FPGA provided in a 144-pin LQFP/TQFP surface-mount package. It implements a 1.5‑V, 0.13‑µm SRAM-based Cyclone architecture and targets cost‑sensitive data‑path and system‑logic applications that require on‑chip RAM and flexible I/O.

With 2,910 logic elements, roughly 59,904 bits of embedded RAM and 104 user I/O pins, this device is positioned for compact, automotive‑qualified designs where a small-footprint, configurable logic element is required.

Key Features

• Core Logic  Approximately 2,910 logic elements provide the configurable fabric for custom logic, glue functions, and moderate-density datapath implementations.
• Embedded Memory  Approximately 59,904 bits of on‑chip RAM for FIFOs, small buffers, and state storage.
• I/O  Up to 104 user I/O pins to support a variety of peripheral interfaces and board-level signaling.
• Power  Core supply range specified at 1.425 V to 1.575 V consistent with the Cyclone 1.5‑V process.
• Package & Mounting  144‑pin LQFP/TQFP surface‑mount package (supplier package listed as 144‑TQFP 20×20), suitable for compact PCB layouts.
• Qualification & Grade  Automotive grade with AEC‑Q100 qualification noted in the product data.
• Operating Conditions  Specified operating temperature range from 0 °C to 85 °C and RoHS compliance for environmental conformance.
• Family-Level Capabilities  Part of the Cyclone FPGA family; device-level architecture and configuration features follow the Cyclone device handbook.

Typical Applications

• Data‑path and protocol bridging  Use the programmable logic and on‑chip RAM to implement protocol adapters, bus interfaces and custom data path logic.
• Memory interface logic  Implement DDR/SDR memory controllers or glue logic for external memory interfaces at the system level (family documentation provides memory support guidance).
• ASSP/ASIC interfacing  Provide flexible I/O and programmable timing to interface ASSPs or ASICs for board‑level integration and signal conditioning.
• Automotive electronic modules  Automotive‑grade qualification (AEC‑Q100) makes the device suitable for design into automotive subsystems that require configurable logic.

Unique Advantages

• Automotive‑qualified silicon: AEC‑Q100 qualification and automotive grade designation support integration into automotive modules requiring qualified components.
• Compact, surface‑mount package: 144‑pin LQFP/TQFP (20×20) keeps board area low while providing ample I/O for moderate complexity designs.
• Balanced logic and memory: Nearly 2,910 logic elements combined with ~59,904 bits of embedded RAM make the device suitable for control logic, small FIFOs and buffering without external SRAM in many designs.
• Flexible I/O count: 104 user I/O pins enable diverse peripheral connections and board‑level signal routing options.
• Standardized core voltage: 1.425 V to 1.575 V supply window aligns with the documented Cyclone 1.5‑V process for predictable power design.
• RoHS compliant: Environmentally compliant manufacturing reduces regulatory risk for global product deployment.

Why Choose EP1C3T144A8N?

The EP1C3T144A8N delivers a compact, automotive‑qualified Cyclone FPGA option for designs that require configurable logic, modest embedded memory, and a substantial I/O count in a small surface‑mount package. Its alignment with the Cyclone family architecture provides predictable integration into systems that need configurable datapath and interface logic.

This device is well suited for engineers and designers building automotive modules, board‑level interface logic, or data‑path functions where qualification, package density and a clear power specification are important. Long‑term value derives from the Cyclone family ecosystem and documentation that support migration and design reuse across related densities.

If you would like pricing, availability or to submit a request for quote for EP1C3T144A8N, please request a quote or submit your RFQ and our team will respond with next steps.