EP1C3T100I7N

The EP1C3T100I7N is an Intel Cyclone® family field programmable gate array (FPGA) supplied in a 100‑pin TQFP package. It is built on a 1.5‑V, 0.13‑µm SRAM process and targets cost‑sensitive data‑path and interface applications that require flexible logic, embedded memory, and a compact package.

With 2,910 logic elements, approximately 59,904 bits of on‑chip RAM, and support for common I/O standards, this device is suited for industrial designs requiring a small, surface‑mount FPGA with extended temperature operation.

Key Features

• Core Logic — 2,910 logic elements providing programmable logic capacity for glue logic, peripheral control, and mid‑range datapath functions.
• Embedded Memory — Approximately 59,904 bits of on‑chip RAM implemented across 13 M4K RAM blocks for buffering, FIFOs, and small lookup tables.
• Clocking — Device supports integrated PLL resources (1 PLL) for clock multiplication and phase adjustment in timing‑sensitive designs.
• I/O and Interfaces — 65 user I/O pins available; Cyclone family support covers LVTTL, LVCMOS, SSTL‑2, SSTL‑3 and high‑speed LVDS options for interfacing with external devices.
• Power — Core supply range specified at 1.425 V to 1.575 V, matching the Cyclone family 1.5‑V process requirement.
• Package and Mounting — 100‑pin TQFP (14 × 14 mm) surface‑mount package for easy PCB integration and conservative board footprint.
• Temperature and Grade — Industrial grade operation from −40 °C to 100 °C for deployment in industrial control and automation environments.
• Compliance — RoHS‑compliant manufacturing.

Typical Applications

• Data‑Path and Signal Processing — Implement buffering, packet handling, or protocol bridging using the device’s logic and embedded RAM.
• Memory Interfaces — Use the Cyclone device’s DDR/SDR support capabilities when interfacing with external SDRAM or FCRAM in small form‑factor designs.
• Industrial Control — Reliable logic and I/O in industrial temperature ranges make it suitable for motor control, sensor aggregation, and factory automation subsystems.
• Peripheral and ASIC/ASSP Interfacing — Provide glue logic, bus bridging, and custom interface logic for companion ASICs or ASSPs.

Unique Advantages

• Compact, Surface‑Mount Package: 100‑pin TQFP (14 × 14 mm) delivers a balance of I/O count and board area efficiency for space‑constrained designs.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Integrated Memory Resources: Nearly 60 Kbits of embedded RAM across dedicated M4K blocks simplifies FIFO and buffer implementation without external memory for small datasets.
• Family Ecosystem: Part of the Cyclone FPGA family with documented architecture and configuration flows, enabling migration or scaling within the same device family.
• Flexible I/O Support: 65 user I/O pins and family support for common I/O standards help interface to a wide range of peripherals and memory devices.

Why Choose EP1C3T100I7N?

The EP1C3T100I7N provides a practical combination of programmable logic, embedded memory, and industrial temperature capability in a compact 100‑TQFP package. Its 2,910 logic elements and roughly 59,904 bits of RAM make it suitable for mid‑range control, interface, and data‑path tasks where board space and power are constrained but predictable industrial operation is required.

This Cyclone‑family device is a good fit for engineering teams seeking a proven FPGA architecture with documented configuration and design support, enabling straightforward integration into industrial controls, memory interface front‑ends, and peripheral bridging roles.

Request a quote or submit a procurement inquiry to receive pricing, lead‑time, and availability information for EP1C3T100I7N.