EP1C3T100C6N

The EP1C3T100C6N is a Cyclone® family SRAM-based FPGA provided in a 100-TQFP (14×14) surface-mount package. It integrates 2,910 logic elements and 59,904 bits of on-chip RAM to address low- to mid-density logic, memory buffering and I/O-centric designs.

Designed for commercial-temperature applications, the device operates from a core supply of 1.425 V to 1.575 V and is RoHS compliant, making it suitable for cost-sensitive data-path, interface, and control applications.

Key Features

• Logic Capacity  2,910 logic elements provide usable combinational and registered logic resources for glue logic, state machines and moderate DSP/control functions.
• Embedded Memory  59,904 total RAM bits of on-chip memory for FIFOs, buffering and small data tables.
• I/O Count and Standards  65 user I/O pins in the 100-TQFP package support common parallel interfacing tasks for sensors, peripherals and external devices.
• Clocking Resources  Integrated PLL resources (1 PLL for this device) provide clock multiplication and phase alignment for system timing requirements.
• Package and Mounting  100-TQFP (14×14) surface-mount package offers a compact footprint for board-level integration and standard assembly.
• Supply and Temperature  Core voltage range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental compliance in commercial applications.
• Family-Level Capabilities  As part of the Cyclone family, the device benefits from architecture features such as support for multiple I/O standards and external memory interfaces referenced in the Cyclone documentation.

Typical Applications

• Data-path and buffering  Use the on-chip RAM and logic resources to implement data FIFOs, packet buffering and moderate-width datapaths.
• Interface bridging  Implement protocol conversion and timing glue between peripherals with the available I/O and PLL-assisted clocking.
• Embedded control and state machines  Implement control logic, user interfaces and finite-state controllers where moderate logic density is required.
• Prototyping and mid-density FPGA designs  Suitable for development platforms and production designs that require a compact TQFP package and a balance of logic and memory.

Unique Advantages

• Balanced logic and memory mix  2,910 logic elements combined with nearly 60 kbits of RAM allow implementation of common control and buffering functions without external SRAM in many cases.
• Compact, assembly-friendly package  The 100-TQFP (14×14) surface-mount package enables easier board-level routing and standard assembly processes compared with larger BGA options.
• Deterministic supply and thermal profile  A defined core voltage range (1.425 V–1.575 V) and commercial temperature rating simplify power sequencing and thermal planning for mainstream electronics.
• Tooling and migration support  Being part of the Cyclone family provides device migration and toolchain continuity documented in the Cyclone device literature, useful for scaling designs across densities.
• Environmentally compliant  RoHS compliance supports product designs targeting global environmental requirements for commercial electronics.

Why Choose EP1C3T100C6N?

The EP1C3T100C6N delivers a practical combination of logic elements, embedded RAM and I/O in a compact 100-TQFP package for commercial-temperature applications. It is well suited to designers who need a mid-density FPGA solution for data-path tasks, interface logic, and embedded control without moving to larger package formats.

With family-level support documented for clocking, external memory interfaces and migration pathways, this Cyclone device offers a predictable platform for designs that may scale within the Cyclone product family while maintaining a straightforward BOM and assembly footprint.

Request a quote or submit an inquiry for pricing and availability of EP1C3T100C6N.