EP1C3T100C7

The EP1C3T100C7 is an Intel Cyclone® field programmable gate array (FPGA) device in a 100-pin TQFP (14×14) surface-mount package. It integrates 2,910 logic elements and approximately 0.06 Mbits of embedded memory to address compact data-path and control applications.

Designed as a cost-effective Cyclone device, this part supports common FPGA roles such as memory interfacing, clock management and general-purpose programmable logic for commercial temperature applications.

Key Features

• Core Logic  Provides 2,910 logic elements for implementing combinational and sequential logic, custom state machines, and glue-logic functions.
• Embedded Memory  Includes 59,904 total RAM bits (approximately 0.06 Mbits) for on-chip buffering and small data structures.
• I/O and Interfaces  65 user I/O pins support a variety of external interfaces and peripheral connections common to Cyclone devices.
• Clocking  Device-level clocking resources include one PLL, enabling clock multiplication and phase shifting for timing control.
• Power  Core supply voltage specified at 1.425 V to 1.575 V to match the device’s defined operating range.
• Package & Mounting  100-pin TQFP (14×14) surface-mount package for compact PCB footprints and straightforward assembly.
• Operating Conditions  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting lead-free manufacturing flows.

Typical Applications

• Memory interface controllers  Suitable for implementing DDR SDRAM and FCRAM interface logic and data-path buffering driven by the device’s on-chip RAM and clocking resources.
• Data-path processing  Use in compact data-path applications where moderate logic density and embedded RAM are required for buffering and packet handling.
• Protocol bridging and peripheral control  Ideal for glue-logic roles and custom peripheral interfaces using the device’s 65 I/O pins.
• Clock management  Clock multiplication and phase shifting enabled by the on-chip PLL support timing-sensitive designs.

Unique Advantages

• Balanced integration: 2,910 logic elements paired with on-chip RAM provide a good mix of logic and memory for mid-density designs, reducing the need for external components.
• Compact packaging: 100-TQFP (14×14) surface-mount package simplifies PCB layout while keeping a small board footprint.
• Defined supply window: Narrow core voltage range (1.425 V–1.575 V) supports stable, repeatable power delivery and design planning.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet typical commercial electronics requirements.
• RoHS compliant: Supports lead-free manufacturing processes and environmental compliance.

Why Choose EP1C3T100C7?

The EP1C3T100C7 delivers a pragmatic combination of logic density, on-chip memory, and I/O capability in a compact 100-TQFP package. It is positioned for designers seeking a cost-effective Cyclone FPGA solution for mid-density logic, memory interface control, and peripheral bridging in commercial temperature environments.

With defined supply and temperature specifications and RoHS compliance, this device provides predictable electrical and environmental behavior for production designs, backed by the Cyclone family feature set for clocking and memory interfacing.

Request a quote today to include the EP1C3T100C7 in your design and procurement planning.