EP1C20F400C6N

IC FPGA 301 I/O 400FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 301 294912 20060 400-BGA

Quantity 209 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package400-FBGA (21x21)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-BGANumber of I/O301Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2006Number of Logic Elements/Cells20060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of EP1C20F400C6N – Cyclone® Field Programmable Gate Array (FPGA), 20,060 LEs, 294,912‑bit RAM, 301 I/O, 400‑BGA

The EP1C20F400C6N is an Intel Cyclone® family SRAM-based FPGA optimized for cost-sensitive data-path and system-interfacing applications. It combines a high logic capacity with on-chip embedded memory and flexible I/O in a compact 400‑BGA package.

Built on a 1.5‑V process and designed for surface-mount assembly, this commercial‑grade device targets applications that require significant programmable logic (20,060 logic elements), substantial embedded memory (approximately 294,912 bits), and up to 301 user I/O pins while operating within a 0 °C to 85 °C range.

Key Features

  • Logic Capacity  20,060 logic elements provide substantial programmable fabric for mid-range FPGA designs.
  • Embedded Memory  Approximately 294,912 bits of on-chip RAM to support data buffering, FIFOs, and small on-chip data structures.
  • I/O Density and Flexibility  Up to 301 user I/O pins enable broad peripheral and board-level interfacing from a single device.
  • Clocking Resources  Family documentation specifies up to two PLLs for clock multiplication and phase shifting to support diverse timing architectures.
  • Package and Mounting  400‑BGA (supplier package: 400‑FBGA, 21×21) in a surface-mount form factor for space-efficient PCB layouts.
  • Power Supply  Core voltage supply specified between 1.425 V and 1.575 V for device operation.
  • Operating Grade and Temperature  Commercial grade with an operating range of 0 °C to 85 °C.
  • Protocol and I/O Standard Support (Series-level)  Cyclone family documentation lists support for LVTTL, LVCMOS, SSTL‑2, SSTL‑3, LVDS, and PCI signaling options for systems that require common memory and high-speed I/O interfaces.
  • Compliance  RoHS‑compliant for lead-free assembly and environmental compliance.

Typical Applications

  • Data‑Path and Packet Processing  Leverages the on‑chip RAM and logic capacity to implement buffering, parsing, and custom datapath operations.
  • Memory Interface and Controllers  Suitable for designs requiring DDR/SDR memory interfaces and board-level memory timing control using the device’s clocking resources.
  • System Glue and ASIC/ASSP Interfacing  Acts as a programmable bridge between peripherals, ASSPs, or ASICs using abundant I/O and supported interface standards.
  • High‑Speed Serial and Parallel I/O  Supports LVDS and other family-level I/O standards for moderate-rate serial links and parallel data lanes.
  • Compact Embedded Systems  400‑BGA package and surface-mount compatibility make it appropriate for space-constrained boards in commercial products.

Unique Advantages

  • High Logic and Memory Integration: 20,060 logic elements combined with approximately 294,912 bits of embedded memory reduce external component count for many mid-range designs.
  • Broad I/O Capability: 301 user I/O pins provide design flexibility for multi‑interface systems and dense board-level connectivity.
  • Deterministic Clocking: Up to two PLLs give designers options for clock multiplication and phase control without external clocking ICs.
  • Compact, Surface‑Mount Package: 400‑BGA (400‑FBGA, 21×21) enables high‑density PCB layouts while maintaining significant I/O counts.
  • Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product cycles.
  • Cost‑Effective Series Characteristics: Cyclone family traits emphasize a balance of integration and cost for data-path and interface-focused applications.

Why Choose EP1C20F400C6N?

The EP1C20F400C6N delivers a balanced combination of mid-range programmable logic, on-chip memory, and a high I/O count in a compact 400‑BGA package—making it suitable for designers needing substantial logic and memory without a large FPGA footprint. Its commercial temperature rating and RoHS compliance align it to standard product lifecycles in consumer, communications, and embedded systems.

For teams building data-path processing, memory interfaces, or system glue logic, this Cyclone® family device provides a cost-effective, integrated platform with documented family-level support for common I/O standards and clocking resources, enabling scalable designs and migration within the family.

Request a quote or submit a parts inquiry to receive pricing and availability information for EP1C20F400C6N.

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