EP1C20F400C6N
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 301 294912 20060 400-BGA |
|---|---|
| Quantity | 209 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 400-FBGA (21x21) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-BGA | Number of I/O | 301 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2006 | Number of Logic Elements/Cells | 20060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of EP1C20F400C6N – Cyclone® Field Programmable Gate Array (FPGA), 20,060 LEs, 294,912‑bit RAM, 301 I/O, 400‑BGA
The EP1C20F400C6N is an Intel Cyclone® family SRAM-based FPGA optimized for cost-sensitive data-path and system-interfacing applications. It combines a high logic capacity with on-chip embedded memory and flexible I/O in a compact 400‑BGA package.
Built on a 1.5‑V process and designed for surface-mount assembly, this commercial‑grade device targets applications that require significant programmable logic (20,060 logic elements), substantial embedded memory (approximately 294,912 bits), and up to 301 user I/O pins while operating within a 0 °C to 85 °C range.
Key Features
- Logic Capacity 20,060 logic elements provide substantial programmable fabric for mid-range FPGA designs.
- Embedded Memory Approximately 294,912 bits of on-chip RAM to support data buffering, FIFOs, and small on-chip data structures.
- I/O Density and Flexibility Up to 301 user I/O pins enable broad peripheral and board-level interfacing from a single device.
- Clocking Resources Family documentation specifies up to two PLLs for clock multiplication and phase shifting to support diverse timing architectures.
- Package and Mounting 400‑BGA (supplier package: 400‑FBGA, 21×21) in a surface-mount form factor for space-efficient PCB layouts.
- Power Supply Core voltage supply specified between 1.425 V and 1.575 V for device operation.
- Operating Grade and Temperature Commercial grade with an operating range of 0 °C to 85 °C.
- Protocol and I/O Standard Support (Series-level) Cyclone family documentation lists support for LVTTL, LVCMOS, SSTL‑2, SSTL‑3, LVDS, and PCI signaling options for systems that require common memory and high-speed I/O interfaces.
- Compliance RoHS‑compliant for lead-free assembly and environmental compliance.
Typical Applications
- Data‑Path and Packet Processing Leverages the on‑chip RAM and logic capacity to implement buffering, parsing, and custom datapath operations.
- Memory Interface and Controllers Suitable for designs requiring DDR/SDR memory interfaces and board-level memory timing control using the device’s clocking resources.
- System Glue and ASIC/ASSP Interfacing Acts as a programmable bridge between peripherals, ASSPs, or ASICs using abundant I/O and supported interface standards.
- High‑Speed Serial and Parallel I/O Supports LVDS and other family-level I/O standards for moderate-rate serial links and parallel data lanes.
- Compact Embedded Systems 400‑BGA package and surface-mount compatibility make it appropriate for space-constrained boards in commercial products.
Unique Advantages
- High Logic and Memory Integration: 20,060 logic elements combined with approximately 294,912 bits of embedded memory reduce external component count for many mid-range designs.
- Broad I/O Capability: 301 user I/O pins provide design flexibility for multi‑interface systems and dense board-level connectivity.
- Deterministic Clocking: Up to two PLLs give designers options for clock multiplication and phase control without external clocking ICs.
- Compact, Surface‑Mount Package: 400‑BGA (400‑FBGA, 21×21) enables high‑density PCB layouts while maintaining significant I/O counts.
- Commercial‑Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product cycles.
- Cost‑Effective Series Characteristics: Cyclone family traits emphasize a balance of integration and cost for data-path and interface-focused applications.
Why Choose EP1C20F400C6N?
The EP1C20F400C6N delivers a balanced combination of mid-range programmable logic, on-chip memory, and a high I/O count in a compact 400‑BGA package—making it suitable for designers needing substantial logic and memory without a large FPGA footprint. Its commercial temperature rating and RoHS compliance align it to standard product lifecycles in consumer, communications, and embedded systems.
For teams building data-path processing, memory interfaces, or system glue logic, this Cyclone® family device provides a cost-effective, integrated platform with documented family-level support for common I/O standards and clocking resources, enabling scalable designs and migration within the family.
Request a quote or submit a parts inquiry to receive pricing and availability information for EP1C20F400C6N.

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