EP1C20F324I7N

The EP1C20F324I7N is an Intel Cyclone family SRAM-based FPGA featuring 20,060 logic elements and approximately 0.295 Mbits (294,912 bits) of on-chip RAM. Designed for cost-sensitive, data-path and memory-interface applications, this device combines substantial logic density with embedded memory and clocking resources.

With industrial-grade operating range and a compact 324-ball BGA package, the EP1C20F324I7N suits embedded and system-level designs that require a balance of integration, I/O count, and low-voltage operation.

Key Features

• Logic Capacity — 20,060 logic elements to implement complex combinational and sequential logic functions.
• Embedded Memory — Approximately 0.295 Mbits (294,912 bits) of on-chip RAM for buffering, FIFOs, and data-path storage.
• Clocking Resources — Cyclone family features up to two PLLs for clock multiplication and phase shifting (family-level capability referenced in the Cyclone device handbook).
• I/O — 233 user I/O pins to support multiple external interfaces and board-level connectivity.
• Interface Support (family-level) — Cyclone devices support standards including LVDS (high- and low-speed), and have dedicated support for DDR SDRAM and PCI timings as described in the Cyclone handbook.
• Package & Mounting — 324-BGA (324-FBGA, 19×19) surface-mount package for high-density PCB layouts.
• Power — Core supply range 1.425 V to 1.575 V to match low-voltage system rails.
• Industrial Temperature Grade — Operating temperature range −40 °C to 100 °C for industrial environments.
• Compliance — RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Data-path processing — Implement packet handling, packet classification, or custom datapaths using the device's 20,060 logic elements and embedded RAM for intermediate storage.
• Memory interface controllers — Build DDR SDRAM or FCRAM interfaces leveraging the Cyclone family’s dedicated memory interface support and on-chip clocking.
• High-speed serial and parallel I/O — Support LVDS and other high-speed signaling standards (family-level support) for video, sensor, or link-level interfaces.
• Embedded system glue and prototyping — Use as a flexible control and glue-logic FPGA in industrial control, test equipment, or prototype platforms requiring many I/Os and reprogrammability.

Unique Advantages

• High logic integration: 20,060 logic elements allow consolidation of multiple functions and reduce BOM by replacing discrete components.
• Significant on-chip memory: Approximately 0.295 Mbits of embedded RAM supports buffering and temporary data storage without external memory for many use cases.
• Industrial robustness: −40 °C to 100 °C operating range and industrial grade classification enable deployment in demanding environments.
• Compact, board-friendly package: 324-BGA (19×19 FBGA) balances pin count and PCB footprint for dense system designs.
• Low-voltage core operation: 1.425 V to 1.575 V supply range aligns with modern low-voltage power domains.
• Standards-oriented family features: Cyclone family-level support for LVDS, DDR memory interfaces, and PCI timing simplifies integration with common subsystems.

Why Choose EP1C20F324I7N?

The EP1C20F324I7N combines a high logic element count and substantial embedded RAM with industrial-grade temperature capability and a compact 324-BGA footprint. It is positioned for designers who need a programmable, integrated solution for data-path, memory-interface, and high-I/O embedded applications while maintaining low-voltage operation.

As a member of the Cyclone FPGA family, this device benefits from family-level architecture and resources that aid migration and design portability across Cyclone densities, offering scalability and ecosystem support for medium-complexity FPGA designs.

Request a quote or submit an inquiry for pricing and availability to evaluate EP1C20F324I7N for your next design.