EP1C20F400C6

The EP1C20F400C6 is a Cyclone® family field-programmable gate array (FPGA) offered in a 400‑ball FineLine BGA package. It delivers a high-density, low-voltage SRAM-based architecture suitable for data-path and interface-focused designs.

Designed for commercial-temperature applications, this device combines 20,060 logic elements, approximately 0.295 Mbits of embedded RAM, and 301 user I/Os in a compact surface-mount 400‑FBGA (21×21) footprint, providing a balance of integration and board-space efficiency.

Key Features

• Logic Capacity — 20,060 logic elements provide substantial programmable fabric for complex combinational and sequential logic implementations.
• Embedded Memory — Total on-chip RAM of 294,912 bits (approximately 0.295 Mbits) for data buffering, state storage, and small on-chip memory structures.
• I/O Density — Up to 301 user I/O pins to support multiple parallel interfaces and external device connectivity.
• Cyclone® Family Architecture — Based on a 1.5‑V, 0.13‑µm SRAM process with family features such as up to two PLLs, global clock resources, and support for external memory interfaces.
• Voltage and Power — Device supply voltage range specified at 1.425 V to 1.575 V for core operation.
• Package and Mounting — 400‑FBGA (21×21) package, surface-mount mounting type, optimized for compact PCB designs.
• Operating Temperature — Commercial grade, specified operating range from 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Communications Interfaces — Implement protocol bridging and parallel interface logic using the high I/O count and embedded memory for buffering.
• Data-Path Processing — Use programmable logic and on-chip RAM for packet parsing, custom datapaths, and control logic in mid-range systems.
• Memory Controller Front-Ends — Leverage Cyclone family support for external memory interfaces and PLLs to implement DDR/SDR interface logic and timing control.
• Embedded System Glue Logic — Consolidate multiple ASSPs or ASIC interfaces and custom peripherals into a single FPGA to reduce board-level BOM and simplify routing.

Unique Advantages

• High Integration: 20,060 logic elements and substantial on-chip RAM reduce the need for external glue logic and discrete memory components.
• Flexible I/O Capability: 301 I/O pins accommodate a wide range of parallel interfaces and multi-device connectivity without sacrificing package compactness.
• Compact Surface-Mount Package: 400‑FBGA (21×21) delivers high pin count in a space-efficient form factor for dense PCBs and embedded assemblies.
• Family-Level Feature Set: Cyclone family features such as up to two PLLs, global clock lines, and external memory support enable robust clocking and memory interface options.
• Commercial-Temperature Operation: Specified 0 °C to 85 °C range suitable for a wide variety of industrial and consumer applications within commercial limits.
• Regulatory Compliance: RoHS compliance supports lead‑free manufacturing and standard environmental requirements.

Why Choose EP1C20F400C6?

The EP1C20F400C6 brings Cyclone family architecture into a high-density FPGA package that balances programmable logic capacity, embedded memory, and a large I/O complement in a compact 400‑FBGA footprint. Its defined core voltage range and commercial temperature rating make it suitable for systems that require a programmable, board‑level integration point for data-path, interface, and control logic.

This device is well suited to engineers and procurement teams looking for a proven Cyclone family FPGA with substantial logic resources and flexible I/O for mid-range embedded and interface applications. The combination of on-chip RAM, PLL resources, and family-level memory-interface support provides scalability and design reuse across Cyclone-based designs.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the EP1C20F400C6.