EP1C20F324C8
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA |
|---|---|
| Quantity | 1,586 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 233 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2006 | Number of Logic Elements/Cells | 20060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of EP1C20F324C8 – Cyclone® Field Programmable Gate Array (FPGA), 20,060 logic elements, 324-BGA
The EP1C20F324C8 is a Cyclone® FPGA from Intel, offering 20,060 logic elements, approximately 0.295 Mbits (294,912 bits) of on-chip RAM, and 233 user I/O pins in a 324-ball FBGA (19×19) package. Designed for commercial-grade designs, the device is surface-mount, RoHS-compliant and operates over a 0 °C to 85 °C temperature range with a core supply range of 1.425 V to 1.575 V.
As a member of the Cyclone family, this device incorporates on-chip memory blocks and dedicated clocking resources to address data-path and general-purpose FPGA requirements in cost-sensitive applications.
Key Features
- Core Logic 20,060 logic elements provide the programmable fabric for implementing complex combinational and sequential logic.
- Embedded Memory Approximately 0.295 Mbits of on-chip RAM (294,912 bits) and 64 M4K RAM blocks (128 × 36 bits) for buffering, lookup tables, and state storage.
- I/O Capacity 233 user I/O pins in a 324-FBGA (19×19) package to support multiple peripheral interfaces and board-level connectivity.
- Clocking Up to two PLLs and multiple global clock resources enable clock multiplication and phase control for synchronous designs.
- Package & Mounting 324-ball fine-pitch BGA (324-FBGA, 19×19), surface-mount package optimized for space-constrained PCBs.
- Power & Environmental Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C; RoHS-compliant.
- Design Ecosystem Part of the Cyclone family, which supports common configuration options and IP cores for efficient design migration and reuse.
Typical Applications
- Data-path Processing On-chip memory and dedicated clocking make the device suitable for signal and data-path processing tasks that require moderate logic density.
- Memory Interfaces Embedded memory and PLLs support designs that interface with external synchronous memories and buffer management.
- Peripheral Bridging and Protocol Handling Ample I/O pin count enables implementation of peripheral interfaces, protocol translation, and glue-logic functions on compact PCBs.
- Prototyping and Development Commercial-grade FPGA for evaluating logic architectures, IP cores, and system integration prior to volume designs.
Unique Advantages
- Substantial Logic Resources: 20,060 logic elements allow implementation of sizeable custom logic and control functions within a single device, reducing board-level component count.
- Integrated On-Chip Memory: Nearly 0.295 Mbits of embedded RAM and 64 M4K blocks simplify buffering and state storage without external memory for many use cases.
- Flexible Clocking: Up to two PLLs and multiple global clock lines provide flexible clock-management options for timing-critical designs.
- Compact Packaging: 324-FBGA (19×19) combines high I/O density with a compact footprint for space-constrained applications.
- Commercial-Grade and RoHS-Compliant: Designed for commercial temperature ranges and compliant with RoHS requirements to meet standard electronics manufacturing practices.
Why Choose EP1C20F324C8?
The EP1C20F324C8 positions itself as a commercially graded, highly integrated Cyclone FPGA offering a balance of logic density, embedded memory, and flexible I/O in a compact FBGA package. Its combination of 20,060 logic elements, substantial on-chip RAM, and dedicated clocking resources makes it well suited for data-path functions, peripheral interfacing, and mid-complexity system designs where board space and part count matter.
For engineering teams seeking a Cyclone-family solution that supports migration within the family and leverages available IP cores, this device provides a pragmatic option for prototyping and production in commercial applications while keeping power and packaging constraints in mind.
Request a quote or submit a procurement inquiry to receive pricing and availability information for EP1C20F324C8.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018