EP1C20F324C8

IC FPGA 233 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA

Quantity 1,586 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O233Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2006Number of Logic Elements/Cells20060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of EP1C20F324C8 – Cyclone® Field Programmable Gate Array (FPGA), 20,060 logic elements, 324-BGA

The EP1C20F324C8 is a Cyclone® FPGA from Intel, offering 20,060 logic elements, approximately 0.295 Mbits (294,912 bits) of on-chip RAM, and 233 user I/O pins in a 324-ball FBGA (19×19) package. Designed for commercial-grade designs, the device is surface-mount, RoHS-compliant and operates over a 0 °C to 85 °C temperature range with a core supply range of 1.425 V to 1.575 V.

As a member of the Cyclone family, this device incorporates on-chip memory blocks and dedicated clocking resources to address data-path and general-purpose FPGA requirements in cost-sensitive applications.

Key Features

  • Core Logic 20,060 logic elements provide the programmable fabric for implementing complex combinational and sequential logic.
  • Embedded Memory Approximately 0.295 Mbits of on-chip RAM (294,912 bits) and 64 M4K RAM blocks (128 × 36 bits) for buffering, lookup tables, and state storage.
  • I/O Capacity 233 user I/O pins in a 324-FBGA (19×19) package to support multiple peripheral interfaces and board-level connectivity.
  • Clocking Up to two PLLs and multiple global clock resources enable clock multiplication and phase control for synchronous designs.
  • Package & Mounting 324-ball fine-pitch BGA (324-FBGA, 19×19), surface-mount package optimized for space-constrained PCBs.
  • Power & Environmental Core supply range 1.425 V to 1.575 V; commercial operating temperature 0 °C to 85 °C; RoHS-compliant.
  • Design Ecosystem Part of the Cyclone family, which supports common configuration options and IP cores for efficient design migration and reuse.

Typical Applications

  • Data-path Processing On-chip memory and dedicated clocking make the device suitable for signal and data-path processing tasks that require moderate logic density.
  • Memory Interfaces Embedded memory and PLLs support designs that interface with external synchronous memories and buffer management.
  • Peripheral Bridging and Protocol Handling Ample I/O pin count enables implementation of peripheral interfaces, protocol translation, and glue-logic functions on compact PCBs.
  • Prototyping and Development Commercial-grade FPGA for evaluating logic architectures, IP cores, and system integration prior to volume designs.

Unique Advantages

  • Substantial Logic Resources: 20,060 logic elements allow implementation of sizeable custom logic and control functions within a single device, reducing board-level component count.
  • Integrated On-Chip Memory: Nearly 0.295 Mbits of embedded RAM and 64 M4K blocks simplify buffering and state storage without external memory for many use cases.
  • Flexible Clocking: Up to two PLLs and multiple global clock lines provide flexible clock-management options for timing-critical designs.
  • Compact Packaging: 324-FBGA (19×19) combines high I/O density with a compact footprint for space-constrained applications.
  • Commercial-Grade and RoHS-Compliant: Designed for commercial temperature ranges and compliant with RoHS requirements to meet standard electronics manufacturing practices.

Why Choose EP1C20F324C8?

The EP1C20F324C8 positions itself as a commercially graded, highly integrated Cyclone FPGA offering a balance of logic density, embedded memory, and flexible I/O in a compact FBGA package. Its combination of 20,060 logic elements, substantial on-chip RAM, and dedicated clocking resources makes it well suited for data-path functions, peripheral interfacing, and mid-complexity system designs where board space and part count matter.

For engineering teams seeking a Cyclone-family solution that supports migration within the family and leverages available IP cores, this device provides a pragmatic option for prototyping and production in commercial applications while keeping power and packaging constraints in mind.

Request a quote or submit a procurement inquiry to receive pricing and availability information for EP1C20F324C8.

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