EP1C20F324C8N

IC FPGA 233 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA

Quantity 1,349 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O233Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2006Number of Logic Elements/Cells20060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of EP1C20F324C8N – Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA

The EP1C20F324C8N is an Intel Cyclone® family FPGA offering a high-density, SRAM-based programmable fabric. It combines 20,060 logic elements with embedded memory and flexible I/O in a compact 324-FBGA (19×19) package for commercial-grade embedded designs.

Built on the Cyclone architecture, this device targets data-path and system-interfacing applications that benefit from integrated on-chip memory, multiple clocking resources, and support for industry I/O standards referenced in the Cyclone family data. It is optimized for designs that require a balance of logic density, memory, and I/O capability in a surface-mount BGA package.

Key Features

  • Logic Capacity  20,060 logic elements, providing substantial gate-level resources for medium- to high-complexity FPGA designs.
  • Embedded Memory  Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for local buffering, state storage, and small data structures.
  • I/O Count and Standards  233 user I/Os available in the 324-FBGA package; Cyclone family support includes LVTTL, LVCMOS, SSTL-2, SSTL-3, and high-speed LVDS as described in the Cyclone documentation.
  • Clocking Resources  Up to two PLLs per device (as defined for the Cyclone EP1C20 device), enabling clock multiplication, phase shifting, and flexible clock domain management.
  • Power Supply  Core voltage range specified at 1.425 V to 1.575 V for the device core supply.
  • Package and Mounting  324-ball FBGA (19×19) package in a surface-mount form factor to minimize board footprint while providing high I/O density.
  • Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Standards and Interfaces  Cyclone devices support interfacing options relevant to memory and peripheral standards (for example, DDR SDRAM and PCI rates cited in the Cyclone family documentation).
  • RoHS Compliance  RoHS-compliant for environmental and manufacturing compatibility.

Typical Applications

  • Data-path processing  Use the 20,060 logic elements and embedded RAM to implement medium-complexity datapath functions, protocol processing, and custom accelerators.
  • Memory interface controllers  Leverage Cyclone family memory and I/O support to build controllers for external memories such as DDR SDRAM and FCRAM.
  • Bridge and peripheral interfaces  High I/O count and family-level support for PCI and LVDS enable bridging between ASIC/ASSP peripherals and system logic.
  • Embedded system integration  Compact 324-FBGA package and integrated clocking make the device suitable for space-constrained embedded PCBs where programmable logic is required.

Unique Advantages

  • High logic density: 20,060 logic elements reduce the need for multiple devices and simplify partitioning of complex functions.
  • Integrated on-chip RAM: Approximately 0.295 Mbits of embedded memory provides deterministic, low-latency storage for buffering and state machines.
  • Flexible, high-density I/O: 233 I/Os in a 324-FBGA package enable rich external interfacing without large package footprints.
  • Built-in clocking: Up to two PLLs per device allow local clock generation and phase control for multi-clock designs.
  • Compact surface-mount packaging: The 324-FBGA (19×19) delivers high pin count in a board-friendly form factor to save PCB area.
  • Commercial-ready and compliant: Commercial operating range (0 °C to 85 °C) and RoHS compliance support general-purpose product development and manufacturing.

Why Choose EP1C20F324C8N?

The EP1C20F324C8N positions itself as a balanced Cyclone FPGA solution for designers needing substantial logic resources, embedded memory, and a high I/O count in a compact BGA package. Its defined core voltage range, on-chip clocking, and family-level interface support make it suitable for data-path, memory-controller, and system-integration roles in commercial electronic products.

Engineers benefit from the Cyclone device lineage and supporting development tools and IP ecosystems cited in the Cyclone documentation, enabling migration and reuse across device densities and simplifying integration into larger designs.

Request a quote or submit an inquiry to receive pricing and availability for EP1C20F324C8N and to discuss how this FPGA can fit your next design.

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