EP1C20F324C7N

IC FPGA 233 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA

Quantity 497 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O233Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2006Number of Logic Elements/Cells20060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits294912

Overview of EP1C20F324C7N – Cyclone® Field Programmable Gate Array (FPGA) IC 233 294912 20060 324-BGA

The EP1C20F324C7N is a Cyclone® series FPGA offering 20,060 logic elements and approximately 294,912 bits of embedded memory in a compact 324-ball FineLine BGA (19 × 19) package. Designed for cost-sensitive data-path and system interface applications, this commercial-grade device integrates high logic density, substantial on-chip RAM, and flexible I/O capacity for board-level integration.

Built on the Cyclone family architecture, this device supports series features such as multi-standard I/O and clocking resources while operating from a 1.425 V to 1.575 V supply and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  20,060 logic elements provide significant gate density for mid-range FPGA designs and complex data-path functions.
  • On-chip Memory  Approximately 294,912 bits (~0.295 Mbits) of embedded RAM to support buffering, FIFOs, and small on-chip data structures.
  • I/O Resources  233 user I/O pins support a wide range of board interfaces and external device connections.
  • Clocking  Cyclone family devices include up to two phase-locked loops (PLLs) for clock multiplication and phase shifting, enabling flexible timing architectures.
  • Power  Single-core voltage operation with a specified supply range of 1.425 V to 1.575 V to match system power rails.
  • Package and Mounting  324-FBGA (19 × 19) surface-mount package minimizes board area while providing robust pin count for mid-density designs.
  • Operating Conditions  Commercial grade: 0 °C to 85 °C.
  • Compliance  RoHS compliant to meet modern environmental requirements.

Typical Applications

  • Data-path Processing  Use the device’s high logic element count and on-chip RAM to implement packet processing, protocol handling, and mid-throughput data-path functions.
  • Memory Interface and Controllers  Suitable for designs that require on-board buffering and interfaces to external memories such as DDR SDRAM or other synchronous memory types supported by the Cyclone family.
  • Assisted ASIC/ASSP Interfacing  Provides programmable glue logic, protocol translation, and bridging functions when integrating ASSPs or ASICs into system designs.
  • High-speed Serial and Parallel I/O  With extensive I/O availability, the device works well where diverse signaling standards and multiple external peripherals must be supported.

Unique Advantages

  • High logic density: 20,060 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
  • Substantial embedded RAM: Nearly 295 Kibits of on-chip memory reduces external memory dependence for buffering and small data structures.
  • Flexible clocking: Up to two PLLs in the Cyclone family support clock domain generation and phase adjustment for synchronized system operation.
  • Compact, high-pin package: The 324-FBGA (19 × 19) footprint delivers a high I/O count (233 pins) in a small area for space-constrained designs.
  • Commercial temperature grading: Rated for 0 °C to 85 °C operation to match a broad range of consumer and industrial-adjacent applications.
  • Design and migration support: Cyclone family documentation and tool references (e.g., Quartus II) facilitate pin migration and design portability across densities in the family.

Why Choose EP1C20F324C7N?

The EP1C20F324C7N positions itself as a practical mid-density Cyclone FPGA for designs that need a balance of logic capacity, embedded memory, and I/O flexibility in a compact surface-mount package. Its combination of 20,060 logic elements, roughly 294,912 bits of RAM, and 233 I/O pins enables integration of interface logic, buffering, and programmable control functions into a single device, simplifying BOM and board routing.

Engineers targeting commercial products that require scalable migration across the Cyclone family benefit from the architecture and tool support detailed for the family, while RoHS compliance and standard commercial temperature rating ensure straightforward integration into many consumer and enterprise applications.

Request a quote or submit an inquiry today to discuss availability, pricing, and lead times for the EP1C20F324C7N.

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