EP1C12Q240I7

The EP1C12Q240I7 is a Cyclone® family field programmable gate array (FPGA) offered in a 240‑pin BFQFP package for surface‑mount applications. It combines a mid‑range logic capacity with on‑chip embedded RAM and industry‑rated operating conditions for a range of embedded and data‑path designs.

Built on the Cyclone architecture, the device targets applications requiring flexible I/O, moderate embedded memory, and determinable power and temperature envelopes. Key electrical and thermal parameters include a 1.425 V–1.575 V core supply range and an operating temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  12,060 logic elements provide mid‑range programmable logic resources for glue logic, protocol bridging, and custom datapath functions.
• Embedded Memory  Approximately 0.24 Mbits (239,616 bits) of on‑chip RAM for FIFOs, buffers, and small local storage.
• I/O Resources  173 user I/O pins available in the 240‑pin package to support multiple parallel interfaces and mixed signal connections.
• Clocking  Two phase‑locked loops (PLLs) per device for clock multiplication and phase shifting to support complex clocking schemes.
• Voltage and Power  Core supply range of 1.425 V to 1.575 V, enabling predictable power planning for system integrators.
• Package and Mounting  240‑pin BFQFP package (supplier device package: 240‑PQFP, 32×32); surface‑mount friendly for standard PCB assembly.
• Temperature Grade  Industrial operating range from −40 °C to 100 °C for reliable operation in demanding environments.
• Standards and I/O Options (Family Level)  Cyclone family devices support a range of I/O standards and high‑speed LVDS signaling for demanding interface requirements.
• RoHS Compliance  Device is RoHS compliant, supporting lead‑free assembly practices.

Typical Applications

• Data‑path processing  Mid‑density programmable logic for packet processing, protocol conversion, and custom datapath acceleration.
• Memory interface and buffering  On‑chip RAM and PLLs facilitate buffering, FIFO implementations, and timing control when interfacing with external memory.
• Industrial control  Industrial temperature rating and flexible I/O make the device suitable for PLCs, motor controllers, and sensor aggregation.
• High‑speed I/O bridging  Multiple user I/Os and family‑level LVDS support enable board‑level bridging between parallel and serial interfaces.

Unique Advantages

• Balanced logic and memory  12,060 logic elements paired with ~239,616 bits of embedded RAM provide a balanced resource profile for many mid‑range designs.
• Deterministic power envelope  A narrow core voltage window (1.425 V–1.575 V) simplifies power‑supply design and thermal budgeting.
• Industrial reliability  Rated for −40 °C to 100 °C operation to meet the needs of industrial deployments and extended temperature applications.
• Flexible packaging  240‑pin BFQFP surface‑mount package supports standard PCB assembly and makes the device straightforward to integrate on production boards.
• Clocking versatility  Two integrated PLLs offer clock multiplication and phase control options for complex timing architectures.
• Regulatory compliance  RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose EP1C12Q240I7?

The EP1C12Q240I7 delivers a practical combination of logic capacity, embedded memory, and I/O count in a production‑ready surface‑mount package. Its industrial temperature rating and well‑defined supply requirements make it a predictable choice for embedded and data‑path applications where reliability and integration matter.

This Cyclone device suits engineering teams building mid‑range programmable solutions that require on‑chip RAM, multiple clocking options, and flexible I/O while maintaining clear supply and thermal specifications. It offers scalability within the Cyclone family and straightforward integration into existing PCB and assembly workflows.

Request a quote or submit a purchase inquiry to receive pricing and availability for the EP1C12Q240I7. Our team can provide lead‑time details and support for volume sourcing and design‑in questions.