EP1C12F324I7N

The EP1C12F324I7N is a Cyclone® family FPGA from Intel, offering a mid-range programmable logic device optimized for data-path and control applications. It combines 12,060 logic elements with on-chip embedded memory and a broad I/O complement to support interface, processing, and glue-logic functions in industrial designs.

Designed on the Cyclone architecture, the device supports features commonly used in system design such as dedicated PLLs, flexible I/O standards, and package options that facilitate vertical migration within the Cyclone family.

Key Features

• Logic Capacity  12,060 logic elements provide the programmable fabric for implementing custom logic, state machines, and data-path processing.
• Embedded Memory  Approximately 0.24 Mbits of total on-chip RAM (239,616 bits) for FIFOs, buffers, and local data storage.
• I/O Resources  249 user I/O pins accommodate parallel interfaces, control signals, and multiple peripheral connections.
• Clocking  Two PLLs are available for clock multiplication and phase adjustment to support timing-critical designs.
• Power  Core supply voltage ranges from 1.425 V to 1.575 V, supporting designs that require a specified 1.5 V class core rail.
• Package & Mounting  324-ball BGA (324-FBGA, 19×19) in a surface-mount package for compact board integration and reliable signal routing.
• Industrial Temperature  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliance  Device is RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• Data-path Processing  Implement custom packet processing, protocol bridging, or bit-manipulation logic using the device’s logic elements and on-chip RAM.
• Memory Interfaces  Use the available PLLs and embedded memory to support external memory interfaces and buffering in systems that require synchronized data transfer.
• Peripheral and Interface Glue Logic  Integrate parallel interfaces, control logic, and timing-critical adapters between ASSPs/ASICs and system components using the device’s 249 I/O pins.
• Industrial Control  Leverage the industrial operating temperature range and surface-mount BGA packaging for motor control, factory automation, and embedded controller designs.

Unique Advantages

• Balanced Logic and Memory:  12,060 logic elements combined with ~0.24 Mbits of embedded RAM enable mixed control and data buffering in a single device.
• Generous I/O Count:  249 user I/Os reduce the need for external GPIO expanders and simplify board-level interconnect for multi-signal systems.
• Industrial Temperature Rating:  −40 °C to 100 °C operation helps ensure reliability in demanding ambient conditions.
• Compact, High-Density Package:  324-FBGA (19×19) provides a space-efficient solution for dense system boards while supporting robust signal routing.
• Configurable Clocking:  Two PLLs support flexible clock domain creation and timing optimization for synchronized data transfers.
• Standards-Conscious Family Features:  As a Cyclone family device, it benefits from documented support for common I/O standards and migration options across device densities.

Why Choose EP1C12F324I7N?

The EP1C12F324I7N positions itself as a practical, mid-density Cyclone FPGA option that combines 12,060 logic elements, a sizeable pool of on-chip RAM, and 249 user I/Os in a compact 324-ball FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for production systems requiring reliable operation across a broad temperature range.

Designers targeting data-path processing, interface bridging, or embedded control can leverage the device’s clocking resources and on-chip memory to consolidate functionality, reduce external components, and simplify board design. The device’s Cyclone-family heritage and referenced design flow support help streamline pin migration and design portability within the family.

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