EP1C12F324C8

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

Quantity 1,563 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F324C8 – Cyclone® Field Programmable Gate Array (FPGA) 324-BGA

The EP1C12F324C8 is a Cyclone® series field programmable gate array (FPGA) in a 324-ball BGA package designed for commercial applications. It delivers a balance of programmable logic, embedded memory, and flexible I/O capability suitable for data-path and interface-focused designs.

Built on the Cyclone device architecture, this device targets designers who need mid-range logic density with integrated memory, clocking resources, and multiple I/O standards to support system-level interfacing and peripheral connectivity.

Key Features

  • Logic Capacity  Approximately 12,060 logic elements provide the programmable fabric to implement mid-range logic, control, and datapath functions.
  • Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for FIFOs, buffering, and local data storage.
  • I/O Count and Standards  249 user I/Os with family-level support for LVTTL, LVCMOS, SSTL-2, SSTL-3 and LVDS I/O standards, enabling interface flexibility for diverse peripherals and memory.
  • Clocking  Family documentation indicates up to two PLLs for clock multiplication and phase shifting to support multiple clock domains and timing management.
  • Voltage and Thermal  Core supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
  • Package & Mounting  324-FBGA (19 × 19 mm) surface-mount package (324-BGA case) for compact board integration.
  • Compliance  RoHS compliant; commercial-grade device classification.

Typical Applications

  • Data-path and Bridge Logic  Implement mid-density datapath processing, protocol bridging, and glue logic where integrated memory and flexible I/O simplify board design.
  • Memory Interface Control  Supports external memory interfacing scenarios referenced by the Cyclone family, including DDR SDRAM and other synchronous memory types for buffering and system memory control.
  • High-speed Serial and Parallel I/O  Use LVDS-capable I/O and standard parallel interfaces to connect high-speed sensors, serializers/deserializers, or peripheral buses.
  • Clock Domain Management  On-chip PLLs enable multi-clock designs requiring clock multiplication, phase shifting, or clock distribution across logic blocks.

Unique Advantages

  • Balanced Logic and Memory  Combines roughly 12k logic elements with ~0.24 Mbits of embedded RAM to support control-intensive and data-buffering functions in a single device.
  • Flexible I/O Support  High I/O count and support for multiple I/O standards let you interface to a wide range of peripherals and memory technologies without external translators.
  • Integrated Clocking  On-chip PLL resources help manage multiple clock domains and simplify timing closure for system designs.
  • Compact Surface-Mount Package  324-FBGA (19 × 19 mm) package allows dense board designs while keeping a high I/O count accessible.
  • Commercial-Grade Operating Range  Specification for 0 °C to 85 °C operation aligns with general-purpose commercial applications.
  • RoHS Compliant  Meets RoHS requirements for use in regulated assemblies.

Why Choose EP1C12F324C8?

The EP1C12F324C8 provides a practical mid-range FPGA option for designers needing a compact, programmable platform with a solid mix of logic, embedded memory, and a broad complement of I/O. Its Cyclone architecture delivers integration suitable for data-path handling, memory interfacing, and multi-clock systems while fitting into space-constrained board layouts via the 324-FBGA package.

This device is ideal for commercial-product development where predictable operating temperature and supply ranges, along with RoHS compliance and family-level support for common I/O standards and clocking features, contribute to scalable designs and streamlined integration.

Request a quote today for pricing and availability, or submit your requirements to receive a tailored response for procurement and lead-time information.

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