EP1C12F324C7
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA |
|---|---|
| Quantity | 1,358 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 249 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1206 | Number of Logic Elements/Cells | 12060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP1C12F324C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA
The EP1C12F324C7 is an Intel Cyclone® SRAM-based FPGA offering a balanced combination of programmable logic, on-chip memory, and a high I/O count in a compact ball-grid array. Designed for data-path and system-integration applications, this commercial-grade device targets designs that require moderate logic capacity, embedded memory, and flexible I/O connectivity.
Built on the Cyclone family architecture, the device provides determinable logic capacity, dedicated clocking resources, and support for common I/O standards to simplify interfacing with external memories and ASSP/ASIC components.
Key Features
- Programmable Logic Capacity 12,060 logic elements (LEs) deliver the device’s core programmable functionality for glue logic, control, and data-path functions.
- On‑chip Memory Approximately 0.24 Mbits of embedded memory (239,616 total RAM bits) for FIFOs, buffers, and small on-chip data storage.
- I/O and Interface Flexibility 249 user I/O pins support a variety of interface needs; Cyclone family devices support common standards including LVTTL, LVCMOS, SSTL-2, SSTL-3 and LVDS.
- Clocking Resources Dedicated PLL resources (2 PLLs for the EP1C12 device) enable clock multiplication and phase adjustment for synchronous designs.
- Package and Mounting 324-ball BGA in a 324-FBGA (19 × 19) footprint, surface-mount package suitable for compact PCBs and automated assembly.
- Power and Temperature Core voltage supply range 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C to match typical industrial and embedded product environments.
- Compliance RoHS compliant material and assembly.
Typical Applications
- Memory Interface and Controller Implement DDR/SDR interface logic and memory controllers using the device’s on-chip RAM and clocking resources for buffering and timing adjustments.
- System Glue Logic Bridge and interface ASSP/ASIC components, multiplexing and protocol adaptation tasks using the available logic and abundant I/O.
- Data-Path Processing Handle moderate-throughput data-path functions—such as packet framing, buffering, and routing—leveraging embedded RAM and programmable logic.
- Embedded Control and Peripheral Management Centralize control logic, timers, and peripheral interfaces for embedded products that require flexible I/O and reprogrammability.
Unique Advantages
- Balanced Logic and Memory: 12,060 logic elements combined with approximately 0.24 Mbits of on-chip RAM allow compact implementation of control and data buffering without external memories for many use cases.
- High I/O Count in a Compact Package: 249 user I/Os in a 324-FBGA (19 × 19) package enable dense connectivity while conserving board space.
- Flexible Clocking: Two on-device PLLs support clock multiplication and phase shifting to meet diverse synchronous timing requirements.
- Commercial Temperature Range: Rated for 0 °C to 85 °C operation, suitable for mainstream embedded and consumer applications.
- Standards Support: Cyclone family support for LVTTL, LVCMOS, SSTL-2/3 and LVDS I/O standards helps simplify interfacing with modern memory and communication components.
- RoHS Compliance: Material and assembly compliance supports environmentally conscious product design.
Why Choose EP1C12F324C7?
The EP1C12F324C7 provides a capable, commercially graded Cyclone FPGA option when you need a mid-range mix of logic, embedded memory, and a high I/O count in a compact BGA package. Its combination of 12,060 logic elements, approximately 0.24 Mbits of RAM, two PLLs, and 249 user I/Os makes it well suited for system integration tasks, memory interface logic, and embedded control functions where reprogrammability and I/O flexibility matter.
Choose this device when your design requires a proven Cyclone architecture with clear electrical and thermal operating parameters, compact 324-FBGA packaging, and RoHS-compliant construction for streamlined production and assembly.
Request a quote or submit a pricing inquiry to evaluate the EP1C12F324C7 for your next design and receive component availability and lead-time information.

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