EP1C12F324C7

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

Quantity 1,358 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F324C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

The EP1C12F324C7 is an Intel Cyclone® SRAM-based FPGA offering a balanced combination of programmable logic, on-chip memory, and a high I/O count in a compact ball-grid array. Designed for data-path and system-integration applications, this commercial-grade device targets designs that require moderate logic capacity, embedded memory, and flexible I/O connectivity.

Built on the Cyclone family architecture, the device provides determinable logic capacity, dedicated clocking resources, and support for common I/O standards to simplify interfacing with external memories and ASSP/ASIC components.

Key Features

  • Programmable Logic Capacity 12,060 logic elements (LEs) deliver the device’s core programmable functionality for glue logic, control, and data-path functions.
  • On‑chip Memory Approximately 0.24 Mbits of embedded memory (239,616 total RAM bits) for FIFOs, buffers, and small on-chip data storage.
  • I/O and Interface Flexibility 249 user I/O pins support a variety of interface needs; Cyclone family devices support common standards including LVTTL, LVCMOS, SSTL-2, SSTL-3 and LVDS.
  • Clocking Resources Dedicated PLL resources (2 PLLs for the EP1C12 device) enable clock multiplication and phase adjustment for synchronous designs.
  • Package and Mounting 324-ball BGA in a 324-FBGA (19 × 19) footprint, surface-mount package suitable for compact PCBs and automated assembly.
  • Power and Temperature Core voltage supply range 1.425 V to 1.575 V and commercial operating temperature from 0 °C to 85 °C to match typical industrial and embedded product environments.
  • Compliance RoHS compliant material and assembly.

Typical Applications

  • Memory Interface and Controller Implement DDR/SDR interface logic and memory controllers using the device’s on-chip RAM and clocking resources for buffering and timing adjustments.
  • System Glue Logic Bridge and interface ASSP/ASIC components, multiplexing and protocol adaptation tasks using the available logic and abundant I/O.
  • Data-Path Processing Handle moderate-throughput data-path functions—such as packet framing, buffering, and routing—leveraging embedded RAM and programmable logic.
  • Embedded Control and Peripheral Management Centralize control logic, timers, and peripheral interfaces for embedded products that require flexible I/O and reprogrammability.

Unique Advantages

  • Balanced Logic and Memory: 12,060 logic elements combined with approximately 0.24 Mbits of on-chip RAM allow compact implementation of control and data buffering without external memories for many use cases.
  • High I/O Count in a Compact Package: 249 user I/Os in a 324-FBGA (19 × 19) package enable dense connectivity while conserving board space.
  • Flexible Clocking: Two on-device PLLs support clock multiplication and phase shifting to meet diverse synchronous timing requirements.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation, suitable for mainstream embedded and consumer applications.
  • Standards Support: Cyclone family support for LVTTL, LVCMOS, SSTL-2/3 and LVDS I/O standards helps simplify interfacing with modern memory and communication components.
  • RoHS Compliance: Material and assembly compliance supports environmentally conscious product design.

Why Choose EP1C12F324C7?

The EP1C12F324C7 provides a capable, commercially graded Cyclone FPGA option when you need a mid-range mix of logic, embedded memory, and a high I/O count in a compact BGA package. Its combination of 12,060 logic elements, approximately 0.24 Mbits of RAM, two PLLs, and 249 user I/Os makes it well suited for system integration tasks, memory interface logic, and embedded control functions where reprogrammability and I/O flexibility matter.

Choose this device when your design requires a proven Cyclone architecture with clear electrical and thermal operating parameters, compact 324-FBGA packaging, and RoHS-compliant construction for streamlined production and assembly.

Request a quote or submit a pricing inquiry to evaluate the EP1C12F324C7 for your next design and receive component availability and lead-time information.

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