EP1C12F324C6

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

Quantity 1,041 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F324C6 – Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

The EP1C12F324C6 is a Cyclone® series field programmable gate array offering a mid-range logic density and on-chip memory for data-path and interface-centric applications. Built on the Cyclone architecture, this device provides approximately 12,060 logic elements and roughly 239,616 bits of embedded RAM, making it suitable for control, buffering, and glue-logic roles in commercial designs.

With a 324‑ball BGA package and 249 user I/O pins, the device targets board-level designs that require a balance of I/O bandwidth and programmable logic capacity while operating within a commercial temperature range.

Key Features

  • Logic Capacity  Approximately 12,060 logic elements provide the programmable fabric for custom logic, state machines, and data-path processing.
  • Embedded Memory  Total on-chip memory of 239,616 bits (approximately 0.24 Mbits) for FIFOs, buffers, and small data stores.
  • I/O Density  249 user I/O pins support extensive board-level interfacing and peripheral connections.
  • Clocking and Timing  Cyclone family features include up to two PLLs and multiple global clock resources to support synchronous designs and clock management.
  • Interface Support (Family)  Cyclone devices support common I/O standards and high-speed LVDS signaling up to family-supported rates, enabling high-speed serial and parallel interfacing where required.
  • Package and Mounting  324‑FBGA (19 × 19) package in a surface-mount form factor for compact board layouts.
  • Power  Device supply range: 1.425 V to 1.575 V, allowing integration with standard 1.5‑V systems.
  • Operating Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental  RoHS‑compliant for worldwide electronics manufacturing requirements.

Typical Applications

  • Data-Path Processing  Implement packet handling, protocol translation, or custom data pipelines using the device's logic resources and on-chip memory.
  • Memory Interface Control  Use the Cyclone architecture's memory interface support and clocking resources to manage DDR/SDR front-ends and buffering logic.
  • High‑I/O Embedded Systems  Leverage 249 I/O pins for multi‑channel sensor aggregation, board-level peripheral control, and system glue logic.
  • Prototyping and IP Integration  Ideal for integrating IP cores and validating logic prior to ASIC transition, with family support for standard configuration and tool flows.

Unique Advantages

  • Balanced Logic and Memory: Combines approximately 12,060 logic elements with roughly 0.24 Mbits of embedded memory to support mixed control and buffering functions on a single device.
  • High I/O Count in Compact Package: 249 user I/Os in a 324‑FBGA package enable dense connectivity without a large PCB footprint.
  • Flexible Clocking: Family-level support for up to two PLLs and multiple global clocks simplifies clock domain management and timing closure.
  • Commercial Temperature Suitability: Specified for 0 °C to 85 °C operation to match commercial product requirements.
  • RoHS Compliance: Meets environmental compliance expectations for modern electronics manufacturing.
  • Supported Tool Flow: As part of the Cyclone device family, the device is supported by the Cyclone design documentation and associated tool capabilities for pin migration and device configuration.

Why Choose EP1C12F324C6?

The EP1C12F324C6 positions itself as a versatile, mid-density Cyclone FPGA that balances programmable logic, embedded RAM, and high I/O capacity in a compact BGA package. It is well suited for commercial designs that require robust interfacing, on‑chip buffering, and flexible clock management without moving to the highest-density devices.

Designers and teams targeting data-path functions, board-level protocol bridging, or prototype-to-production migrations can leverage the Cyclone family support and the device's measurable specifications—logic elements, memory, I/O count, and operating conditions—to build reliable, scalable solutions.

Request a quote or submit a parts inquiry to get pricing and availability for EP1C12F324C6 and to discuss how this Cyclone FPGA can fit into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up