EP1C12F324C6
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA |
|---|---|
| Quantity | 1,041 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 249 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1206 | Number of Logic Elements/Cells | 12060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP1C12F324C6 – Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA
The EP1C12F324C6 is a Cyclone® series field programmable gate array offering a mid-range logic density and on-chip memory for data-path and interface-centric applications. Built on the Cyclone architecture, this device provides approximately 12,060 logic elements and roughly 239,616 bits of embedded RAM, making it suitable for control, buffering, and glue-logic roles in commercial designs.
With a 324‑ball BGA package and 249 user I/O pins, the device targets board-level designs that require a balance of I/O bandwidth and programmable logic capacity while operating within a commercial temperature range.
Key Features
- Logic Capacity Approximately 12,060 logic elements provide the programmable fabric for custom logic, state machines, and data-path processing.
- Embedded Memory Total on-chip memory of 239,616 bits (approximately 0.24 Mbits) for FIFOs, buffers, and small data stores.
- I/O Density 249 user I/O pins support extensive board-level interfacing and peripheral connections.
- Clocking and Timing Cyclone family features include up to two PLLs and multiple global clock resources to support synchronous designs and clock management.
- Interface Support (Family) Cyclone devices support common I/O standards and high-speed LVDS signaling up to family-supported rates, enabling high-speed serial and parallel interfacing where required.
- Package and Mounting 324‑FBGA (19 × 19) package in a surface-mount form factor for compact board layouts.
- Power Device supply range: 1.425 V to 1.575 V, allowing integration with standard 1.5‑V systems.
- Operating Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental RoHS‑compliant for worldwide electronics manufacturing requirements.
Typical Applications
- Data-Path Processing Implement packet handling, protocol translation, or custom data pipelines using the device's logic resources and on-chip memory.
- Memory Interface Control Use the Cyclone architecture's memory interface support and clocking resources to manage DDR/SDR front-ends and buffering logic.
- High‑I/O Embedded Systems Leverage 249 I/O pins for multi‑channel sensor aggregation, board-level peripheral control, and system glue logic.
- Prototyping and IP Integration Ideal for integrating IP cores and validating logic prior to ASIC transition, with family support for standard configuration and tool flows.
Unique Advantages
- Balanced Logic and Memory: Combines approximately 12,060 logic elements with roughly 0.24 Mbits of embedded memory to support mixed control and buffering functions on a single device.
- High I/O Count in Compact Package: 249 user I/Os in a 324‑FBGA package enable dense connectivity without a large PCB footprint.
- Flexible Clocking: Family-level support for up to two PLLs and multiple global clocks simplifies clock domain management and timing closure.
- Commercial Temperature Suitability: Specified for 0 °C to 85 °C operation to match commercial product requirements.
- RoHS Compliance: Meets environmental compliance expectations for modern electronics manufacturing.
- Supported Tool Flow: As part of the Cyclone device family, the device is supported by the Cyclone design documentation and associated tool capabilities for pin migration and device configuration.
Why Choose EP1C12F324C6?
The EP1C12F324C6 positions itself as a versatile, mid-density Cyclone FPGA that balances programmable logic, embedded RAM, and high I/O capacity in a compact BGA package. It is well suited for commercial designs that require robust interfacing, on‑chip buffering, and flexible clock management without moving to the highest-density devices.
Designers and teams targeting data-path functions, board-level protocol bridging, or prototype-to-production migrations can leverage the Cyclone family support and the device's measurable specifications—logic elements, memory, I/O count, and operating conditions—to build reliable, scalable solutions.
Request a quote or submit a parts inquiry to get pricing and availability for EP1C12F324C6 and to discuss how this Cyclone FPGA can fit into your next design.

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