EP1C12F256C8N

The EP1C12F256C8N is a Cyclone® family FPGA offering a mid-range integration point with 12,060 logic elements and approximately 239,616 bits of embedded RAM. The Cyclone family is based on a 1.5‑V, 0.13‑µm, all-layer copper SRAM process and is positioned for cost-effective data-path and interface applications.

This device provides a balance of logic density, on-chip memory and I/O capacity—185 user I/O pins—delivered in a 256‑FBGA (17 × 17) surface-mount package. Key characteristics include dual PLLs for clocking, a defined operating voltage window, and commercial temperature grade for general embedded and system designs.

Key Features

• Logic Capacity  Provides 12,060 logic elements for implementing mid-range digital designs and control logic.
• Embedded Memory  Approximately 239,616 bits of on-chip RAM to support buffering, FIFOs and local data storage.
• I/O and Interface Support  185 user I/O pins enable connectivity to peripherals, memory interfaces and external logic.
• Clocking  Includes two PLLs (as specified for the EP1C12 device) to support clock multiplication and phase control for multi-clock designs.
• Process and Device Family  Cyclone family architecture built on a 1.5‑V, 0.13‑µm SRAM process, intended for cost-effective data-path applications.
• Package & Mounting  256‑FBGA (17 × 17) / 256‑BGA package in a surface-mount form factor for compact board integration.
• Power and Temperature  Nominal supply range 1.425 V to 1.575 V; commercial operating temperature range 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory alignment in common commercial applications.

Typical Applications

• High-speed data-path processing  Use the device’s logic density and embedded RAM for packet processing, buffering and custom datapath functions.
• Memory interface and controllers  On-chip RAM and I/O capacity support designs that interface to external DDR/SDR memory and fast-cycle memory devices.
• Peripheral and ASIC/ASSP bridging  185 I/O pins and flexible I/O standards (Cyclone family capability) enable glue-logic, protocol conversion and peripheral interfacing.
• Clocked systems and timing control  Two PLLs allow clock multiplication and phase adjustments for multi-clock system requirements.

Unique Advantages

• Balanced integration: 12,060 logic elements and ~239,616 bits of embedded RAM combine to reduce external logic and simplify board-level design.
• Compact board footprint: 256‑FBGA (17 × 17) surface-mount package enables high-density mounting while preserving substantial I/O count.
• Predictable power domain: Tight supply window (1.425 V–1.575 V) provides consistent operating conditions for system power architecture.
• Commercial temperature rating: 0 °C–85 °C rating suits general embedded and consumer-facing applications.
• Clocking flexibility: Two PLLs support clock multiplication and phase shifting to meet multi-clock and timing-critical requirements.
• Family-level migration: Cyclone family support for vertical migration and design portability across device densities simplifies future scaling and re-use.

Why Choose EP1C12F256C8N?

The EP1C12F256C8N offers a practical combination of logic, memory and I/O for designers targeting mid-range FPGA-based systems. Its Cyclone family heritage delivers a cost-conscious FPGA option built on a 1.5‑V SRAM process with features aimed at data-path and interface-centric designs.

This device is well suited for teams needing a scalable, commercially graded FPGA with on-chip memory and dual PLL clocking, packaged in a compact 256‑FBGA for space-constrained boards. Family-level design flow support and migration paths further help protect development investment as requirements evolve.

Request a quote or contact sales to obtain pricing, availability and lead-time information for EP1C12F256C8N.