EP1C12F256C8EC

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

Quantity 509 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F256C8EC – Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

The EP1C12F256C8EC is a Cyclone® family SRAM-based FPGA offering 12,060 logic elements and approximately 0.24 Mbits of embedded memory. It is targeted at cost-sensitive data-path and control applications that benefit from on-chip programmable logic, embedded RAM, and flexible I/O.

Built for commercial-temperature designs, this surface-mount device comes in a 256-ball BGA package (256-FBGA, 17×17) with 185 user I/O pins and a specified VCC range of 1.425 V to 1.575 V. The device is RoHS compliant.

Key Features

  • Logic Capacity — 12,060 logic elements provide substantial programmable logic resources for mid-range FPGA designs.
  • Embedded Memory — 239,616 total RAM bits, approximately 0.24 Mbits of on-chip embedded memory for FIFOs, buffers, and local storage.
  • I/O and Interfacing — 185 available user I/O pins in a compact 256-BGA package to support multiple external interfaces and peripherals.
  • Clocking — Cyclone family devices include up to two PLLs per device for clock multiplication and phase control (family-level feature applicable to EP1C12 devices).
  • Power — Nominal core supply specified between 1.425 V and 1.575 V, enabling predictable power rail design and decoupling requirements.
  • Package & Mounting — 256-ball FineLine BGA (256-FBGA, 17×17) in a surface-mount form factor suitable for compact PCB layouts.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial applications.
  • Regulatory — RoHS compliant for lead-free manufacturing and assembly processes.
  • Cyclone Family Capabilities — Family-level features include support for external memory interfaces (DDR SDRAM, FCRAM), multiple I/O standards, and high-speed LVDS options, enabling a range of system-level configurations (family-level capabilities).

Typical Applications

  • Data-path processing — Mid-range signal processing and data-path functions that require on-chip logic and embedded RAM for buffering and pipelining.
  • Memory interface controllers — Designs that implement controllers or bridges for external memories using the Cyclone family’s memory interface support.
  • Protocol bridging and I/O aggregation — Concentrating multiple peripheral interfaces and protocol conversion in a programmable logic device with abundant I/O.
  • Embedded control and state machines — Offloading deterministic control tasks and timing-critical logic to on-chip programmable fabric in commercial applications.

Unique Advantages

  • Balanced mid-range capacity: 12,060 logic elements and ~0.24 Mbits of RAM provide a strong balance of logic and memory for many embedded designs without excessive cost or board area.
  • Compact package footprint: The 256-FBGA (17×17) package enables high I/O density in a space-efficient surface-mount form factor.
  • Predictable power requirements: Clearly defined supply range (1.425 V–1.575 V) simplifies power-supply design and verification.
  • Commercial-temperature suitability: Rated 0 °C to 85 °C for standard commercial applications and environments.
  • RoHS compliant: Supports modern lead-free assembly and manufacturing requirements.
  • Family-level system features: Access to Cyclone family capabilities such as PLLs, memory-interface support, and multiple I/O standards helps accelerate design reuse and migration across device densities.

Why Choose EP1C12F256C8EC?

The EP1C12F256C8EC positions itself as a practical, mid-range Cyclone FPGA option for commercial embedded and data-path applications that need a mix of logic, on-chip memory, and flexible I/O in a compact BGA package. Its specification set — 12,060 logic elements, 239,616 RAM bits, 185 user I/Os, and supportable Cyclone family features like PLLs and memory interfaces — makes it suitable for designers seeking programmable acceleration, interface consolidation, or custom control logic without escalating cost or board space.

For teams planning designs that may evolve across Cyclone densities, this device aligns with the family’s migration and integration approach, helping protect design effort while delivering the resources required for many mid-range FPGA applications.

Request a quote or submit an RFQ to check availability, pricing, and lead times for EP1C12F256C8EC. Our team can provide manufacturing, ordering, and technical support information to help you move from evaluation to production.

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