EP1C12F256C6N

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

Quantity 881 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F256C6N – Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

The EP1C12F256C6N is a Cyclone® family field programmable gate array (FPGA) from Intel, offering a mid-range integration point with 12,060 logic elements and 239,616 bits of embedded RAM. It implements Cyclone series architectural features and is targeted at data-path and embedded system applications that require flexible logic, on-chip memory, and a moderate I/O count.

Built for commercial-grade applications, this device provides on-chip memory and peripheral interfacing options suitable for memory interfaces, peripheral bridges, and general-purpose programmable logic roles within consumer and commercial electronic products.

Key Features

  • Core Density  12,060 logic elements (LEs) providing mid-range programmable logic capacity for combinational and sequential functions.
  • Embedded Memory  239,616 total RAM bits (approximately 0.24 Mbits) implemented via 52 M4K RAM blocks for buffering, FIFOs, and small data structures.
  • I/O and Interfaces  Up to 185 user I/O pins to support peripheral connectivity and board-level interfaces; family-level support includes LVTTL, LVCMOS, SSTL-2, SSTL-3 and LVDS I/O standards as documented for Cyclone devices.
  • Clocking  Up to two PLLs per device to enable clock multiplication and phase shifting for custom timing domains.
  • Power Supply  Core voltage supply range 1.425 V to 1.575 V.
  • Package & Mounting  256-ball FineLine BGA (256-FBGA, 17 × 17) in a surface-mount form factor for compact board integration.
  • Operating Range & Grade  Commercial temperature rating with specified operating temperature from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Data-path and Memory Interfaces  Use the device’s embedded RAM and PLL resources to implement DDR/FCRAM interface logic and buffering for memory subsystems.
  • Peripheral Bridges and Protocol Glue  Implement custom protocol conversion, bus bridging, or glue logic between ASSP/ASIC components and system peripherals using available I/O and logic resources.
  • Embedded Control and Signal Processing  Deploy as a programmable controller for embedded systems that require flexible state machines, I/O management, and local data buffering.
  • Prototyping and Design Migration  Suitable for migrating or prototyping designs within the Cyclone family where vertical device migration is supported by family pinouts and software tools.

Unique Advantages

  • Balanced Logic and Memory  12,060 logic elements combined with approximately 0.24 Mbits of embedded memory lets you implement mid-scale logic and local data storage without external RAM for many use cases.
  • Moderate I/O Count  185 user I/O pins provide sufficient connectivity for multi-peripheral designs while keeping board routing manageable.
  • On-chip Clocking Flexibility  Two PLLs enable localized clock domain generation and phase adjustments for timing-critical interfaces.
  • Compact BGA Package  The 256-FBGA (17 × 17) package supports high-density board designs and surface-mount assembly.
  • Commercial Temperature and RoHS Compliance  Commercial operating range (0 °C to 85 °C) and RoHS compliance facilitate integration into consumer and commercial product lines.
  • Family Resources and Tool Support  As a Cyclone family device, it benefits from family-level IP and migration support documented for Cyclone devices, aiding design portability and reuse.

Why Choose EP1C12F256C6N?

The EP1C12F256C6N positions itself as a practical mid-range Cyclone FPGA option where a balance of programmable logic, embedded RAM, and moderate I/O is required. Its combination of 12,060 logic elements, approximately 239,616 bits of on-chip RAM, and two PLLs makes it well-suited for data-path tasks, memory interfacing, and embedded control within commercial products.

Designers looking for a compact, surface-mount BGA solution that aligns with Cyclone family migration paths and available IP can leverage this device to simplify BOM and accelerate prototyping and deployment while maintaining predictable electrical and thermal operating envelopes.

Request a quote or submit a pricing inquiry to evaluate EP1C12F256C6N for your next design and get detailed purchasing information and availability.

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