EP1C12F256C7N

The EP1C12F256C7N is an Intel Cyclone® family FPGA in a 256‑ball FineLine BGA package, offering a midrange logic capacity and on‑chip memory suitable for data‑path and peripheral interfacing applications. It is based on the Cyclone architecture (1.5‑V, 0.13‑µm, all‑layer copper SRAM process) and targets commercial‑grade systems.

With 12,060 logic elements, approximately 0.24 Mbits of embedded RAM, and flexible I/O support, this device is intended for designs that require moderate programmable logic, embedded memory, and a mix of parallel and high‑speed serial interfaces.

Key Features

• Logic Capacity  12,060 logic elements provide midrange programmable logic for control, data‑path, and glue‑logic implementations.
• Embedded Memory  Approximately 0.24 Mbits of on‑chip RAM implemented as 52 M4K RAM blocks for FIFOs, buffers, and small data structures.
• I/O Count and Standards  185 user I/O pins supporting multiple I/O standards noted for the Cyclone family (including LVTTL, LVCMOS, SSTL‑2, SSTL‑3 and LVDS), enabling mixed‑signal and high‑speed interface designs.
• Clocking  Two PLLs per device for clock multiplication and phase shifting to support clock domain management and interface timing.
• Package  256‑ball FineLine BGA (256‑FBGA, 17×17) surface‑mount package for a compact PCB footprint.
• Power  Core supply operating range of 1.425 V to 1.575 V to match system power rails.
• Operating Conditions  Commercial grade operation from 0 °C to 85 °C.
• Standards and Connectivity  Family features include support for DDR SDRAM interfaces and PCI signaling options, enabling external memory and peripheral integration.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Data‑path processing  Implement midrange packet processing, signal multiplexing, and custom data pipelines using the device’s logic and embedded RAM.
• Memory interface controllers  Support DDR and SDR memory interface logic for external memory buffering and controllers.
• Peripheral and bus bridging  Create custom bridges or glue logic for PCI and other system peripherals using available I/O and clocking resources.
• High‑speed serial links  Implement LVDS‑based signaling and moderate‑speed serial interfaces for board‑level communications.

Unique Advantages

• Balanced logic and memory  12,060 logic elements paired with approximately 0.24 Mbits of on‑chip RAM lets you implement control logic and moderate buffering without immediate external memory dependence.
• Flexible I/O and standards support  185 I/O pins and Cyclone family support for multiple signaling standards simplify integration with a variety of peripherals and memory devices.
• Integrated clocking  Two PLLs allow on‑chip clock management for multi‑domain designs and timing adjustments at the device level.
• Compact, surface‑mount package  The 256‑FBGA (17×17) package reduces PCB area while providing sufficient I/O for midrange system designs.
• Commercial temperature range  Specified 0 °C to 85 °C operation for standard commercial applications.
• Established Cyclone ecosystem  Part of the Cyclone family with documented support for Quartus® II workflows and Altera® MegaCore® functions and AMPP megafunctions, aiding design reuse and migration across densities.

Why Choose EP1C12F256C7N?

The EP1C12F256C7N is positioned for commercial applications that need a balance of configurable logic, embedded memory, and flexible I/O in a compact BGA package. Its Cyclone family heritage provides features such as dual PLLs, support for multiple I/O standards, and documented flow support for IP integration and device migration across Cyclone densities.

This device is well suited to engineers building midrange FPGA solutions—such as memory controllers, bus interfaces, and data‑path logic—who require a commercially rated, RoHS‑compliant FPGA with a compact footprint and proven design tools support.

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