EP1C12F256C8
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA |
|---|---|
| Quantity | 323 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 185 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1206 | Number of Logic Elements/Cells | 12060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP1C12F256C8 – Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA
The EP1C12F256C8 is a Cyclone® family SRAM-based FPGA offering 12,060 logic elements and on-chip memory suitable for data-path applications and system interfacing. As a commercial-grade device in a compact 256-FBGA (17×17) package, it combines mid-range logic density with flexible I/O and clocking resources for embedded system and prototyping use.
Designed within the Cyclone device family, this part provides integrated PLLs and support for common I/O standards and external memory interfaces, making it well suited to applications that require configurable logic, memory buffering, and a variety of I/O signaling options.
Key Features
- Logic Resources 12,060 logic elements provide the core programmable fabric for custom logic, state machines, and signal processing tasks.
- Embedded Memory Approximately 0.24 Mbits of on-chip RAM (239,616 total bits) for data buffering, FIFOs, and local storage.
- I/O Capacity 185 user I/O pins support diverse board-level interfacing and signal routing requirements.
- Clocking Two PLLs per device enable clock multiplication and phase shifting for complex timing architectures.
- I/O Standards and Interfaces Family-level support includes LVTTL, LVCMOS, SSTL-2, SSTL-3, LVDS (high-speed and low-speed modes), and support for 66- and 33-MHz, 64- and 32-bit PCI signaling, enabling flexible system interfacing.
- Memory Interface Support Support for external memory types such as DDR SDRAM, FCRAM, and SDR SDRAM (as part of Cyclone family capabilities) for expanding system memory bandwidth.
- Package 256-FBGA (17×17) surface-mount package provides a space-efficient footprint for board-level integration.
- Power Nominal supply range of 1.425 V to 1.575 V aligning with the Cyclone family’s 1.5-V process.
- Commercial Temperature Range Rated for 0 °C to 85 °C operation and supplied as a commercial-grade device.
- Compliance RoHS compliant for modern manufacturing and regulatory requirements.
Typical Applications
- Data-Path Processing Custom datapath implementations, protocol bridging, and hardware-accelerated functions that leverage the 12,060 logic elements and embedded RAM.
- Memory Interface Bridging Controller and buffering logic for external memory (DDR SDRAM, FCRAM, SDRAM) integration in mid-range systems.
- High-Speed I/O and SerDes-Like Links LVDS-capable interfaces for high-speed differential data reception and transmission in acquisition and communication modules.
- System Integration and PCI Interfacing Peripheral and host interfacing using supported PCI clock/data configurations and flexible I/O standards.
Unique Advantages
- Balanced Logic and Memory: 12,060 logic elements paired with approximately 0.24 Mbits of on-chip RAM deliver a balanced resource mix for control and buffering tasks.
- Flexible Clocking: Two integrated PLLs enable robust clock domain management, useful for multi-rate designs and timing closure.
- Broad I/O Support: Support for multiple I/O standards — including LVTTL, LVCMOS, SSTL, and LVDS — simplifies board-level interfacing with legacy and modern components.
- Compact Package: The 256-FBGA (17×17) package reduces PCB real estate while providing a high I/O count for dense connectivity.
- Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant to meet common manufacturing and deployment requirements.
Why Choose EP1C12F256C8?
The EP1C12F256C8 positions itself as a mid-density Cyclone FPGA that blends substantial programmable logic with embedded RAM and flexible I/O in a compact BGA package. Its feature set supports a range of embedded and system-level designs that require reconfigurable logic, memory interfacing, and multiple signaling standards.
This device is well suited for teams developing data-path functions, protocol bridges, or system interface logic that benefit from field programmability, integrated clocking, and a controlled commercial temperature rating. The Cyclone family heritage and documented device characteristics provide a predictable platform for migration and system scaling.
Request a quote or submit a product inquiry for EP1C12F256C8 to receive pricing, availability, and ordering information.

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