EP1C12F256C8

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

Quantity 323 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F256C8 – Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

The EP1C12F256C8 is a Cyclone® family SRAM-based FPGA offering 12,060 logic elements and on-chip memory suitable for data-path applications and system interfacing. As a commercial-grade device in a compact 256-FBGA (17×17) package, it combines mid-range logic density with flexible I/O and clocking resources for embedded system and prototyping use.

Designed within the Cyclone device family, this part provides integrated PLLs and support for common I/O standards and external memory interfaces, making it well suited to applications that require configurable logic, memory buffering, and a variety of I/O signaling options.

Key Features

  • Logic Resources  12,060 logic elements provide the core programmable fabric for custom logic, state machines, and signal processing tasks.
  • Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 total bits) for data buffering, FIFOs, and local storage.
  • I/O Capacity  185 user I/O pins support diverse board-level interfacing and signal routing requirements.
  • Clocking  Two PLLs per device enable clock multiplication and phase shifting for complex timing architectures.
  • I/O Standards and Interfaces  Family-level support includes LVTTL, LVCMOS, SSTL-2, SSTL-3, LVDS (high-speed and low-speed modes), and support for 66- and 33-MHz, 64- and 32-bit PCI signaling, enabling flexible system interfacing.
  • Memory Interface Support  Support for external memory types such as DDR SDRAM, FCRAM, and SDR SDRAM (as part of Cyclone family capabilities) for expanding system memory bandwidth.
  • Package  256-FBGA (17×17) surface-mount package provides a space-efficient footprint for board-level integration.
  • Power  Nominal supply range of 1.425 V to 1.575 V aligning with the Cyclone family’s 1.5-V process.
  • Commercial Temperature Range  Rated for 0 °C to 85 °C operation and supplied as a commercial-grade device.
  • Compliance  RoHS compliant for modern manufacturing and regulatory requirements.

Typical Applications

  • Data-Path Processing  Custom datapath implementations, protocol bridging, and hardware-accelerated functions that leverage the 12,060 logic elements and embedded RAM.
  • Memory Interface Bridging  Controller and buffering logic for external memory (DDR SDRAM, FCRAM, SDRAM) integration in mid-range systems.
  • High-Speed I/O and SerDes-Like Links  LVDS-capable interfaces for high-speed differential data reception and transmission in acquisition and communication modules.
  • System Integration and PCI Interfacing  Peripheral and host interfacing using supported PCI clock/data configurations and flexible I/O standards.

Unique Advantages

  • Balanced Logic and Memory:  12,060 logic elements paired with approximately 0.24 Mbits of on-chip RAM deliver a balanced resource mix for control and buffering tasks.
  • Flexible Clocking:  Two integrated PLLs enable robust clock domain management, useful for multi-rate designs and timing closure.
  • Broad I/O Support:  Support for multiple I/O standards — including LVTTL, LVCMOS, SSTL, and LVDS — simplifies board-level interfacing with legacy and modern components.
  • Compact Package:  The 256-FBGA (17×17) package reduces PCB real estate while providing a high I/O count for dense connectivity.
  • Commercial Temperature and RoHS Compliance:  Rated for 0 °C to 85 °C and RoHS compliant to meet common manufacturing and deployment requirements.

Why Choose EP1C12F256C8?

The EP1C12F256C8 positions itself as a mid-density Cyclone FPGA that blends substantial programmable logic with embedded RAM and flexible I/O in a compact BGA package. Its feature set supports a range of embedded and system-level designs that require reconfigurable logic, memory interfacing, and multiple signaling standards.

This device is well suited for teams developing data-path functions, protocol bridges, or system interface logic that benefit from field programmability, integrated clocking, and a controlled commercial temperature rating. The Cyclone family heritage and documented device characteristics provide a predictable platform for migration and system scaling.

Request a quote or submit a product inquiry for EP1C12F256C8 to receive pricing, availability, and ordering information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up