EP1C12F256I7N

The EP1C12F256I7N is an Intel Cyclone® family FPGA supplied in a 256-ball fine-pitch BGA (256-FBGA, 17×17) package designed for surface-mount assembly. It provides a mid-range integration point with 12,060 logic elements and approximately 0.24 Mbits of embedded memory for data-path and control applications.

Engineered for industrial use, this device supports 185 user I/O pins, operates over a –40 °C to 100 °C range, and runs from a 1.425 V to 1.575 V core supply, making it suitable for systems that require reliable operation across extended temperature ranges.

Key Features

• Logic Capacity  12,060 logic elements enable implementation of mid-density logic, control, and glue-logic functions.
• Embedded Memory  Total on-chip RAM of 239,616 bits (approximately 0.24 Mbits) for buffering, FIFOs, and small data structures.
• I/O  185 user I/O pins provide flexible interfacing for parallel buses and peripheral connections.
• Clocking  Cyclone family devices support up to two PLLs for clock multiplication and phase shifting to meet common timing requirements.
• Configuration & Interfaces  Cyclone architecture includes features for DDR SDRAM and fast-cycle memory interfaces and supports common I/O standards at the family level.
• Package & Mounting  256-FBGA (17×17) package in a surface-mount form factor suitable for compact board layouts.
• Power  Nominal core supply range of 1.425 V to 1.575 V for the device core.
• Industrial Grade  Rated for operation from –40 °C to 100 °C for industrial-environment deployments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Data-path Processing  Mid-density logic and embedded RAM support packet manipulation, protocol handling, and custom data pipeline tasks in communications and industrial systems.
• Memory Interface Controllers  Cyclone family features support DDR SDRAM and other external memories for applications requiring external buffer or frame storage.
• Peripheral Bridging and Glue Logic  Use the available logic elements and plentiful I/O to bridge buses, implement protocol adapters, or centralize peripheral control.
• Industrial Control  Industrial temperature rating and robust I/O count make the device suitable for motor control, factory automation interfaces, and sensor aggregation.

Unique Advantages

• Balanced Integration:  Combines 12,060 logic elements with approximately 0.24 Mbits of on-chip RAM to consolidate logic and buffering in a single device.
• Flexible I/O Capacity:  185 user I/O pins enable multiple parallel interfaces and flexible board-level connectivity without external IO expanders.
• Industrial Reliability:  Operating range from –40 °C to 100 °C supports deployment in extended-temperature environments common to industrial applications.
• Compact Package:  256-FBGA (17×17) surface-mount package saves PCB space while providing the pin count needed for complex I/O routing.
• Clocking Resources:  Support for up to two PLLs provides on-chip options for clock multiplication and phase alignment, simplifying system clocking schemes.
• Regulatory Compliance:  RoHS compliance facilitates integration into products targeting markets with environmental-material restrictions.

Why Choose EP1C12F256I7N?

The EP1C12F256I7N delivers a practical balance of logic density, embedded memory, and I/O capacity in a compact 256-FBGA package, well suited for mid-range FPGA tasks in industrial systems. Its operating voltage range and industrial temperature rating enable reliable deployment where environmental robustness matters.

This Cyclone device is a fit for designers seeking a cost-effective, mid-density programmable solution for data-path processing, memory interfacing, and system glue logic, offering predictable scalability within the Cyclone family and the ecosystem of Cyclone design flows and IP.

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