EP1C12F324C6N

IC FPGA 249 I/O 324FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

Quantity 25 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-FBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-BGANumber of I/O249Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F324C6N – Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA

The EP1C12F324C6N is an Intel Cyclone® family FPGA offering reconfigurable logic optimized for cost-sensitive, data-path oriented designs. It provides approximately 12,060 logic elements and roughly 0.24 Mbits of embedded RAM, enabling mid-range system integration and on-chip buffering.

Built on the Cyclone architecture, this device targets commercial applications requiring flexible I/O, clocking resources, and low-voltage core operation. Key assets include a high I/O count, integrated PLLs for clock management, and a compact 324-ball BGA package.

Key Features

  • Core Capacity  Approximately 12,060 logic elements for implementing medium-complexity control, glue-logic, and data-path functions.
  • Embedded Memory  Total on-chip memory of 239,616 bits (approximately 0.24 Mbits) for FIFOs, small buffers, and state storage.
  • I/O Density  Up to 249 available I/O pins to support dense external interfaces and board-level connectivity.
  • Clocking Resources  Two PLLs (as provided in the Cyclone family) to support clock multiplication, phase shifting, and flexible timing architectures.
  • Voltage and Power  Core supply range of 1.425 V to 1.575 V to match low-voltage system rails.
  • Operating Range  Commercial operating temperature range of 0 °C to 85 °C.
  • Package and Mounting  324-ball fine-pitch BGA (324-FBGA, 19 × 19) in a surface-mount package for compact board integration.
  • Standards Support (Family)  Cyclone family features include support for common I/O standards and high-speed LVDS interfaces, as well as support for common memory interfaces (as documented for the Cyclone series).
  • Compliance and Grade  Commercial-grade device with RoHS compliance.

Typical Applications

  • High-speed data-path logic  Mid-density logic and embedded RAM are well-suited for data aggregation, packet buffering, and on-board packet processing tasks.
  • Memory interface controllers  Use as the programmable interface between system logic and external memory subsystems, leveraging the Cyclone family’s memory interface support.
  • I/O bridging and protocol adaptation  High I/O count enables protocol conversion, bus bridging, and glue-logic roles between disparate system peripherals.
  • Consumer and commercial electronics  Compact BGA package and commercial-grade temperature range make it suitable for consumer and general commercial embedded applications requiring reconfigurable logic.

Unique Advantages

  • Balanced logic and memory resources  Combines roughly 12,060 logic elements with approximately 0.24 Mbits of on-chip RAM to implement mixed control and buffering functions without large external FPGA footprints.
  • High I/O flexibility  Up to 249 I/O pins provide the routing headroom necessary for multi-interface designs and board-level consolidation.
  • Integrated clock management  Two PLLs give designers the ability to generate and phase-shift clocks on-chip, simplifying timing architectures.
  • Compact surface-mount package  The 324-FBGA (19 × 19) package supports space-constrained PCB layouts while maintaining power and signal integrity considerations for mid-density devices.
  • Commercial-grade reliability with RoHS compliance  Designed for commercial applications and manufactured to meet RoHS environmental requirements.
  • Vendor ecosystem  Part of the Cyclone family from Intel, offering documented architecture and toolchain support referenced in the Cyclone device handbook.

Why Choose EP1C12F324C6N?

The EP1C12F324C6N delivers a pragmatic balance of logic density, embedded memory, and I/O capacity in a compact 324-ball BGA package for commercial embedded systems. Its Cyclone-family architecture provides clocking resources and memory interface capabilities that help streamline board-level designs without overprovisioning resources.

This device is suited for designers and teams building mid-complexity programmable logic solutions—where integration, flexible I/O, and controlled power rails are priorities—and for projects that benefit from a documented family architecture and tool support.

Request a quote or submit an inquiry for availability and pricing to evaluate the EP1C12F324C6N for your next design.

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