EP1C12F324C6N
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA |
|---|---|
| Quantity | 25 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 249 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1206 | Number of Logic Elements/Cells | 12060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP1C12F324C6N – Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA
The EP1C12F324C6N is an Intel Cyclone® family FPGA offering reconfigurable logic optimized for cost-sensitive, data-path oriented designs. It provides approximately 12,060 logic elements and roughly 0.24 Mbits of embedded RAM, enabling mid-range system integration and on-chip buffering.
Built on the Cyclone architecture, this device targets commercial applications requiring flexible I/O, clocking resources, and low-voltage core operation. Key assets include a high I/O count, integrated PLLs for clock management, and a compact 324-ball BGA package.
Key Features
- Core Capacity Approximately 12,060 logic elements for implementing medium-complexity control, glue-logic, and data-path functions.
- Embedded Memory Total on-chip memory of 239,616 bits (approximately 0.24 Mbits) for FIFOs, small buffers, and state storage.
- I/O Density Up to 249 available I/O pins to support dense external interfaces and board-level connectivity.
- Clocking Resources Two PLLs (as provided in the Cyclone family) to support clock multiplication, phase shifting, and flexible timing architectures.
- Voltage and Power Core supply range of 1.425 V to 1.575 V to match low-voltage system rails.
- Operating Range Commercial operating temperature range of 0 °C to 85 °C.
- Package and Mounting 324-ball fine-pitch BGA (324-FBGA, 19 × 19) in a surface-mount package for compact board integration.
- Standards Support (Family) Cyclone family features include support for common I/O standards and high-speed LVDS interfaces, as well as support for common memory interfaces (as documented for the Cyclone series).
- Compliance and Grade Commercial-grade device with RoHS compliance.
Typical Applications
- High-speed data-path logic Mid-density logic and embedded RAM are well-suited for data aggregation, packet buffering, and on-board packet processing tasks.
- Memory interface controllers Use as the programmable interface between system logic and external memory subsystems, leveraging the Cyclone family’s memory interface support.
- I/O bridging and protocol adaptation High I/O count enables protocol conversion, bus bridging, and glue-logic roles between disparate system peripherals.
- Consumer and commercial electronics Compact BGA package and commercial-grade temperature range make it suitable for consumer and general commercial embedded applications requiring reconfigurable logic.
Unique Advantages
- Balanced logic and memory resources Combines roughly 12,060 logic elements with approximately 0.24 Mbits of on-chip RAM to implement mixed control and buffering functions without large external FPGA footprints.
- High I/O flexibility Up to 249 I/O pins provide the routing headroom necessary for multi-interface designs and board-level consolidation.
- Integrated clock management Two PLLs give designers the ability to generate and phase-shift clocks on-chip, simplifying timing architectures.
- Compact surface-mount package The 324-FBGA (19 × 19) package supports space-constrained PCB layouts while maintaining power and signal integrity considerations for mid-density devices.
- Commercial-grade reliability with RoHS compliance Designed for commercial applications and manufactured to meet RoHS environmental requirements.
- Vendor ecosystem Part of the Cyclone family from Intel, offering documented architecture and toolchain support referenced in the Cyclone device handbook.
Why Choose EP1C12F324C6N?
The EP1C12F324C6N delivers a pragmatic balance of logic density, embedded memory, and I/O capacity in a compact 324-ball BGA package for commercial embedded systems. Its Cyclone-family architecture provides clocking resources and memory interface capabilities that help streamline board-level designs without overprovisioning resources.
This device is suited for designers and teams building mid-complexity programmable logic solutions—where integration, flexible I/O, and controlled power rails are priorities—and for projects that benefit from a documented family architecture and tool support.
Request a quote or submit an inquiry for availability and pricing to evaluate the EP1C12F324C6N for your next design.

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