EP1C12F324C7N

The EP1C12F324C7N is an Intel Cyclone® family FPGA in a 324-ball BGA package targeted for commercial embedded designs. It provides 12,060 logic elements and on‑chip embedded memory tailored for data-path and interface applications that require moderate logic density and flexible I/O.

Built on the Cyclone FPGA architecture, this device combines SRAM-based logic, dedicated PLL resources, and a high I/O count to support custom glue logic, memory interfaces and system-level integration in consumer, communications and industrial‑style commercial products.

Key Features

• Logic Capacity  12,060 logic elements for implementing medium-complexity digital logic and custom data-paths.
• Embedded Memory  Total on-chip RAM of 239,616 bits, approximately 0.24 Mbits of embedded memory, with 52 M4K RAM blocks as listed in the Cyclone device table.
• Programmable Clocking  Two PLLs per device to provide clock multiplication and phase shifting for system clocking needs.
• I/O and Interface Density  Up to 249 user I/O pins to support wide parallel interfaces and multiple peripheral connections; supports common I/O standards listed for the Cyclone family.
• Package and Mounting  324-BGA (324-FBGA, 19×19) surface-mount package offering a compact, board‑level footprint.
• Supply and Temperature  Operates from a core supply range of 1.425 V to 1.575 V and is specified for commercial operating temperatures of 0 °C to 85 °C.
• Regulatory  RoHS compliant, meeting common environmental directives for commercial electronic products.

Typical Applications

• Data-path processing  Use the device to implement medium-density data-path logic and custom processing pipelines where on‑chip RAM and PLLs are required.
• Memory interface and buffering  Suitable for designs requiring local RAM and programmable clocking for interfacing to external memory or buffering streams.
• Peripheral and protocol bridging  High I/O count enables the FPGA to act as a bridge between multiple peripherals, custom buses, or ASIC/ASSP components.
• Prototyping and system glue  A practical platform for integrating custom logic, control functions, and I/O routing in commercial embedded systems.

Unique Advantages

• Targeted logic density: 12,060 logic elements provide a focused balance between capacity and cost for medium-complexity designs.
• Substantial embedded memory: Approximately 0.24 Mbits of on-chip RAM (239,616 bits) delivered as 52 M4K blocks for efficient local storage and buffering.
• Robust I/O capability: Up to 249 user I/Os support diverse parallel interfaces and system integration without needing external glue logic.
• Flexible clocking: Two integrated PLLs enable clock multiplication and phase adjustments for synchronized multi-domain designs.
• Compact BGA package: 324‑FBGA (19×19) surface-mount package minimizes PCB area while providing a high pin count for system connections.
• Commercial temperature and RoHS compliance: Designed for 0 °C to 85 °C operation and RoHS‑compliant manufacturing for standard commercial products.

Why Choose EP1C12F324C7N?

The EP1C12F324C7N delivers a practical combination of 12,060 logic elements, meaningful embedded memory, and 249 I/O in a compact 324-BGA footprint—well suited for commercial embedded designs that require programmable logic, local RAM, and flexible interfacing. Its two PLLs and Cyclone architecture features make it a capable choice for data-path tasks and system glue logic.

Designed within the Cyclone FPGA family ecosystem, this device aligns with available development tools and IP options documented for the family, enabling straightforward implementation and migration across Cyclone devices where needed.

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