EP1C12F324C8N

The EP1C12F324C8N is an Intel Cyclone® family FPGA offering a balance of logic capacity and embedded memory intended for data-path and interface applications. It is based on the Cyclone architecture and provides on-chip SRAM-based resources with dedicated clocking and flexible I/O support described for the Cyclone family.

This device targets applications that require mid-range programmable logic, a high pin-count package, and low-voltage operation within a commercial temperature range.

Key Features

• Logic Capacity  Provides 12,060 logic elements for mid-density programmable logic implementations.
• Embedded Memory  Includes 239,616 bits of on-chip RAM (approximately 0.24 Mbits) to support buffering, FIFOs, and data-path storage.
• I/O Resources  Up to 249 user I/O pins to support complex interfacing and system connectivity.
• Clocking  Device-level support includes two phase-locked loops (PLLs) as documented for the EP1C12 device family for clock multiplication and phase shifting.
• I/O Standards (Cyclone family)  Cyclone devices support multiple I/O standards including LVTTL, LVCMOS, SSTL-2, SSTL-3 and LVDS (family-level specification).
• Package & Mounting  324-ball fine-pitch BGA (324-FBGA, 19×19) in a surface-mount package for space-efficient board designs.
• Power  Device supply range specified at 1.425 V to 1.575 V for core operation.
• Operating Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Data-path Processing  Mid-density logic and on-chip RAM make this device suitable for data-path functions such as packet buffering, protocol processing, and pattern matching.
• Memory Interface Bridging  On-chip RAM and the Cyclone family’s external memory support enable DDR and SDR interface bridging and buffering roles.
• Peripheral and System I/O  High I/O count and support for multiple I/O standards allow implementation of parallel and serialized peripheral interfaces, bridging external ASSP/ASIC devices.
• Clocking and Timing Control  Integrated PLL resources support clock multiplication and phase adjustments for multi-clock systems and synchronous data transfers.

Unique Advantages

• Balanced Logic and Memory:  12,060 logic elements paired with approximately 0.24 Mbits of embedded RAM give designers capacity for both control logic and local data storage.
• High Pin Count in a Compact Package:  249 I/Os in a 324-FBGA (19×19) package enables dense system integration without sacrificing board space.
• Flexible Clocking:  Two PLLs available on the EP1C12 family simplify clock domain management and support clock multiplication/phase shifting.
• Low-Voltage Core Operation:  Core supply specified between 1.425 V and 1.575 V supports integration into low-voltage system architectures.
• Commercial Temperature Rating:  0 °C to 85 °C rating matches commercial product and system requirements.
• Regulatory Compliance:  RoHS compliance supports environmental and sourcing requirements.

Why Choose EP1C12F324C8N?

The EP1C12F324C8N provides a practical mix of logic density, embedded RAM, and I/O resources in a surface-mount 324-FBGA package for commercial applications. Its Cyclone family architecture, documented family-level I/O standards, and integrated PLLs make it well suited to mid-range data-path, interface, and system-control designs where predictable resources and package density matter.

Designers and procurement teams can leverage the device’s combination of 12,060 logic elements, approximately 0.24 Mbits of on-chip RAM, and 249 I/Os to streamline BOM and board area while maintaining flexibility for clocking and memory interfacing needs.

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