EP1C12F324I7
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 249 239616 12060 324-BGA |
|---|---|
| Quantity | 239 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 324-FBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-BGA | Number of I/O | 249 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1206 | Number of Logic Elements/Cells | 12060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP1C12F324I7 – Cyclone® FPGA, 12,060 logic elements, ~0.24 Mbits RAM, 249 I/O, 324‑BGA
The EP1C12F324I7 is a Cyclone® family Field Programmable Gate Array (FPGA) in a 324‑ball FineBall Grid Array package. It leverages the Cyclone architecture and on‑chip SRAM-based logic to deliver a compact, industrial‑grade programmable logic solution for data‑path and control applications.
Designed for systems requiring moderate logic capacity, embedded memory, and flexible I/O, this device targets industrial controls, memory interface designs, and high‑speed I/O applications where a 324‑FBGA footprint, extended temperature range, and RoHS compliance are required.
Key Features
- Core Logic 12,060 logic elements provide programmable logic capacity for mid-range FPGA designs.
- Embedded Memory Approximately 0.24 Mbits (239,616 bits) of on‑chip RAM to support buffering, FIFOs, and small data structures.
- I/O Capability Up to 249 user I/O pins to connect peripherals, external memory, and high‑speed interfaces.
- Clocking Two PLLs (phase‑locked loops) and global clock resources for flexible clock management and phase control.
- Process and Architecture Based on the Cyclone family architecture (1.5‑V, 0.13‑µm SRAM process) with features aimed at data‑path applications.
- Supply and Power Core voltage range: 1.425 V to 1.575 V, providing precise supply requirements for system design.
- Package and Mounting 324‑FBGA package (19×19) in a surface‑mount format for compact board integration.
- Temperature and Grade Industrial operating temperature range from −40 °C to 100 °C for use in rugged environments.
- Standards and Interfaces (family) Cyclone devices support a range of I/O standards and high‑speed interfaces, including LVTTL, LVCMOS, SSTL, and LVDS, for versatile system interfacing.
- Compliance RoHS compliant for environmental and regulatory requirements.
Typical Applications
- Data‑Path Processing Implement mid‑range signal processing, packet handling, or custom logic pipelines using 12,060 logic elements and on‑chip RAM.
- Memory Interface Controllers Build DDR, FCRAM, or SDRAM interface logic and controllers supported by the Cyclone family’s external memory features and PLL‑based clocking.
- High‑Speed Serial and LVDS Links Use the device’s I/O resources and Cyclone family support for LVDS to implement point‑to‑point high‑speed data links.
- Industrial Control and Automation Deploy in sensor aggregation, motor control, or machine‑control subsystems that require industrial temperature operation and configurable I/O.
Unique Advantages
- Balanced Logic and Memory: 12,060 logic elements paired with ~0.24 Mbits of embedded RAM enables efficient partitioning of control and data buffering functions.
- Deterministic Clocking: Two PLLs and global clock resources simplify multi‑clock designs and phase alignment for memory and serial interfaces.
- Compact, Surface‑Mount Package: 324‑FBGA (19×19) delivers a high pin count in a small board footprint for space‑constrained systems.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in demanding environments without additional temperature qualification.
- System‑Level Interfacing: Up to 249 I/O pins and Cyclone family I/O standard support enable broad compatibility with peripherals and external memories.
- Regulatory Compliance: RoHS compliance facilitates inclusion in end products with environmental conformity requirements.
Why Choose EP1C12F324I7?
The EP1C12F324I7 brings Cyclone family architecture into a package and specification set suited for industrial and embedded system designs that require a mid‑range balance of logic, memory, and I/O. Its combination of 12,060 logic elements, roughly 0.24 Mbits of embedded RAM, two PLLs, and 249 I/O pins makes it well suited for data‑path tasks, memory interfaces, and high‑speed I/O roles where board space and extended temperature operation matter.
Choosing this device provides a pathway to scalable Cyclone family designs, with practical on‑chip resources, a compact 324‑FBGA footprint, and RoHS compliance — supporting streamlined integration and long‑term system maintainability.
Request a quote or submit a product inquiry to receive pricing and availability information for the EP1C12F324I7 today.

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