EP1C12F324C6AA

The EP1C12F324C6AA is an Intel Cyclone® field‑programmable gate array in a 324‑ball BGA package designed for commercial embedded systems. It combines mid‑range programmable logic density with on‑chip memory and a broad set of I/O resources for data‑path and control applications.

Built on the Cyclone family architecture, the device targets designs that need flexible logic, embedded RAM, and multiple I/O standards while operating within a commercial temperature range and a 1.425–1.575 V core supply.

Key Features

• Logic Capacity 12,060 logic elements providing mid‑range programmable logic for combinational and sequential designs.
• Embedded Memory Approximately 0.24 Mbits (239,616 bits) of on‑chip RAM for FIFOs, buffers, and local data storage.
• I/O Resources Up to 249 user I/O pins to support wide external interfacing and parallel connections.
• Clocking Device family supports up to two PLLs (EP1C12 device configuration) for clock multiplication and phase adjustment.
• Interfaces and Standards (Cyclone family) Series supports common interface standards including LVTTL, LVCMOS, SSTL‑2/3 and high‑speed LVDS options for high‑speed links and memory interfaces.
• Package and Mounting 324‑FBGA (19×19) fine‑pitch BGA package; surface‑mount mounting type suitable for compact board layouts.
• Power and Temperature Core voltage range 1.425 V to 1.575 V; commercial grade operating temperature 0 °C to 85 °C.
• Compliance RoHS compliant.

Typical Applications

• Data‑path processing — Implement packet processing, signal routing, and custom data pipelines using the device’s logic and embedded RAM.
• Memory interface controllers — Develop DDR/SDR memory controllers and buffering logic leveraging on‑chip RAM and the family’s external memory support.
• High‑speed serial/parallel I/O — Use the available I/O and LVDS support for board‑level communications and sensor interfaces.
• Prototyping and ASIC interfacing — Mid‑density logic and broad I/O count make the device suitable for prototype platforms and bridging to ASSP/ASIC devices.

Unique Advantages

• Balanced logic and memory — 12,060 logic elements combined with approximately 0.24 Mbits of embedded RAM supports mid‑complexity designs without external memory for many functions.
• High I/O count — 249 I/O pins enable wide parallel connectivity and flexible external interfacing options.
• Compact BGA package — 324‑FBGA (19×19) provides a space‑efficient footprint for dense board layouts while preserving signal access.
• Commercial temperature suitability — Rated for 0 °C to 85 °C, appropriate for standard commercial embedded products and systems.
• Design ecosystem support — Part of the Cyclone family with established configuration and tooling practices for pin migration and design portability within the family.
• Regulatory readiness — RoHS compliance helps simplify environmental compliance for manufactured products.

Why Choose EP1C12F324C6AA?

The EP1C12F324C6AA positions itself as a practical mid‑density FPGA choice for commercial embedded designs that require a mix of programmable logic, on‑chip memory, and extensive I/O in a compact BGA package. Its 12,060 logic elements, approximately 0.24 Mbits of embedded RAM, and 249 I/Os deliver the integration needed for data‑path processing, memory interfacing, and board‑level bridging tasks.

Designed for teams seeking a cost‑effective, configurable hardware platform backed by the Cyclone family ecosystem, this device supports efficient design migration and standard tool flows while meeting common commercial temperature and supply voltage requirements.

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