EP1C12F256C7
| Part Description |
Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA |
|---|---|
| Quantity | 1,229 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 185 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1206 | Number of Logic Elements/Cells | 12060 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 239616 |
Overview of EP1C12F256C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA
The EP1C12F256C7 is a Cyclone® family FPGA in a 256-pin FineLine BGA package, offering 12,060 logic elements and approximately 0.24 Mbits of embedded memory. The device targets commercial embedded and data-path applications that require flexible logic integration, on-chip RAM, and a moderate number of I/O signals in a surface-mount BGA footprint.
Built on the Cyclone device architecture, this part combines on-chip memory, configurable logic, and family-level features such as PLL-based clocking and support for multiple I/O standards to address interfacing, timing, and control tasks in compact systems.
Key Features
- Logic Capacity 12,060 logic elements provide programmable fabric for glue logic, state machines, and moderate-density digital signal processing functions.
- Embedded Memory Total on-chip RAM of 239,616 bits (approximately 0.24 Mbits) for FIFOs, buffering, and small data stores.
- I/O Count & Standards 185 I/O pins available in the 256-BGA package to support peripheral interfaces and board-level connectivity. The Cyclone family supports a variety of I/O standards for flexible interfacing.
- Clocking Resources Family-level support for phase-locked loops (PLLs) enables clock multiplication and phase shifting to simplify timing and memory interface designs.
- Package & Mounting 256-pin FineLine BGA (256-FBGA, 17×17) in a surface-mount package for compact, board-level integration.
- Power Supply Operates with a core supply voltage in the range 1.425 V to 1.575 V, matching the Cyclone device family’s 1.5-V process characteristics.
- Operating Range Commercial-grade temperature range from 0 °C to 85 °C for standard commercial applications.
- Regulatory RoHS-compliant construction for lead-free manufacturing environments.
Typical Applications
- Data-path and Memory Interfaces Use the on-chip RAM and Cyclone family DDR/FCRAM support to implement buffering and interface logic for external memory subsystems.
- Embedded Control & Glue Logic Programmable logic and I/O density suit system control, protocol bridging, and custom peripheral interfacing in compact commercial products.
- Timing and Clock Management PLLs and configurable clock resources help implement clock domain crossing, frequency multiplication, and phase alignment for synchronous designs.
- High-density I/O Connectivity 185 I/Os in a 256-FBGA package provide ample signals for multi-channel sensor interfaces, bus bridging, and peripheral expansion.
Unique Advantages
- Balanced Logic and Memory 12,060 logic elements paired with approximately 0.24 Mbits of embedded RAM allow designers to integrate control logic and local data storage on a single device, reducing external component count.
- Compact BGA Footprint The 256-FBGA (17×17) package offers a space-efficient surface-mount solution for board designs with constrained area.
- Flexible Power Window Core supply range centered around 1.5 V supports the Cyclone family process requirements and aids predictable power integration in system designs.
- Commercial Temperature Compatibility Rated for 0 °C to 85 °C operation to meet typical commercial product temperature profiles.
- RoHS Compliance Lead-free manufacturing compatibility simplifies regulatory compliance for consumer and commercial products.
Why Choose EP1C12F256C7?
The EP1C12F256C7 places a practical combination of logic density, embedded RAM, and I/O capacity into a compact 256-FBGA package for commercial embedded designs. It is well suited to engineers who need programmable logic with integrated memory and PLL-based clocking resources to implement data-path functions, interface bridging, and control logic without excessive board-level complexity.
With family-level support for common I/O standards and a core supply window aligned to the Cyclone architecture, this device offers a predictable platform for cost-sensitive, space-constrained designs where integration and flexibility matter.
Request a quote or submit a pricing inquiry to learn about availability and lead times for EP1C12F256C7. Our team can provide volume pricing and delivery options to support your project schedule.

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