EP1C12F256C7

IC FPGA 185 I/O 256FBGA
Part Description

Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

Quantity 1,229 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O185Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1206Number of Logic Elements/Cells12060
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP1C12F256C7 – Cyclone® Field Programmable Gate Array (FPGA) IC 185 239616 12060 256-BGA

The EP1C12F256C7 is a Cyclone® family FPGA in a 256-pin FineLine BGA package, offering 12,060 logic elements and approximately 0.24 Mbits of embedded memory. The device targets commercial embedded and data-path applications that require flexible logic integration, on-chip RAM, and a moderate number of I/O signals in a surface-mount BGA footprint.

Built on the Cyclone device architecture, this part combines on-chip memory, configurable logic, and family-level features such as PLL-based clocking and support for multiple I/O standards to address interfacing, timing, and control tasks in compact systems.

Key Features

  • Logic Capacity  12,060 logic elements provide programmable fabric for glue logic, state machines, and moderate-density digital signal processing functions.
  • Embedded Memory  Total on-chip RAM of 239,616 bits (approximately 0.24 Mbits) for FIFOs, buffering, and small data stores.
  • I/O Count & Standards  185 I/O pins available in the 256-BGA package to support peripheral interfaces and board-level connectivity. The Cyclone family supports a variety of I/O standards for flexible interfacing.
  • Clocking Resources  Family-level support for phase-locked loops (PLLs) enables clock multiplication and phase shifting to simplify timing and memory interface designs.
  • Package & Mounting  256-pin FineLine BGA (256-FBGA, 17×17) in a surface-mount package for compact, board-level integration.
  • Power Supply  Operates with a core supply voltage in the range 1.425 V to 1.575 V, matching the Cyclone device family’s 1.5-V process characteristics.
  • Operating Range  Commercial-grade temperature range from 0 °C to 85 °C for standard commercial applications.
  • Regulatory  RoHS-compliant construction for lead-free manufacturing environments.

Typical Applications

  • Data-path and Memory Interfaces  Use the on-chip RAM and Cyclone family DDR/FCRAM support to implement buffering and interface logic for external memory subsystems.
  • Embedded Control & Glue Logic  Programmable logic and I/O density suit system control, protocol bridging, and custom peripheral interfacing in compact commercial products.
  • Timing and Clock Management  PLLs and configurable clock resources help implement clock domain crossing, frequency multiplication, and phase alignment for synchronous designs.
  • High-density I/O Connectivity  185 I/Os in a 256-FBGA package provide ample signals for multi-channel sensor interfaces, bus bridging, and peripheral expansion.

Unique Advantages

  • Balanced Logic and Memory  12,060 logic elements paired with approximately 0.24 Mbits of embedded RAM allow designers to integrate control logic and local data storage on a single device, reducing external component count.
  • Compact BGA Footprint  The 256-FBGA (17×17) package offers a space-efficient surface-mount solution for board designs with constrained area.
  • Flexible Power Window  Core supply range centered around 1.5 V supports the Cyclone family process requirements and aids predictable power integration in system designs.
  • Commercial Temperature Compatibility  Rated for 0 °C to 85 °C operation to meet typical commercial product temperature profiles.
  • RoHS Compliance  Lead-free manufacturing compatibility simplifies regulatory compliance for consumer and commercial products.

Why Choose EP1C12F256C7?

The EP1C12F256C7 places a practical combination of logic density, embedded RAM, and I/O capacity into a compact 256-FBGA package for commercial embedded designs. It is well suited to engineers who need programmable logic with integrated memory and PLL-based clocking resources to implement data-path functions, interface bridging, and control logic without excessive board-level complexity.

With family-level support for common I/O standards and a core supply window aligned to the Cyclone architecture, this device offers a predictable platform for cost-sensitive, space-constrained designs where integration and flexibility matter.

Request a quote or submit a pricing inquiry to learn about availability and lead times for EP1C12F256C7. Our team can provide volume pricing and delivery options to support your project schedule.

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