EP1AGX90EF1152I6N

IC FPGA 538 I/O 1152FBGA
Part Description

Arria GX Field Programmable Gate Array (FPGA) IC 538 4477824 90220 1152-BBGA

Quantity 562 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGANumber of I/O538Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4511Number of Logic Elements/Cells90220
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4477824

Overview of EP1AGX90EF1152I6N – Arria GX FPGA, 90,220 Logic Elements, 1152-BBGA

The EP1AGX90EF1152I6N is an industrial-grade Arria GX field-programmable gate array (FPGA) in a 1152-BBGA package. It combines a high-capacity logic array with embedded memory and I/O to address demanding embedded, communications, and signal-processing applications.

Built on the Arria GX family architecture, this device provides on-chip TriMatrix memory, high-speed serial transceiver technology, DSP resources and multiple PLLs for system-level integration where performance, configurability and temperature robustness are required.

Key Features

  • Logic Capacity — 90,220 logic elements for implementing complex custom logic and control functions.
  • Embedded Memory — Approximately 4.48 Mbits of on-chip RAM provided as TriMatrix memory with three block sizes for true dual-port memory and FIFO implementations (performance up to 380 MHz).
  • I/O — 538 I/O pins supporting numerous single-ended and differential I/O standards for broad interface support.
  • High‑Speed Transceivers — Arria GX family transceiver architecture includes serial transceivers with clock-data recovery (CDR) support up to 3.125 Gbps and embedded SERDES circuitry; supports common serial protocols such as PCI-Express, Gigabit Ethernet, SDI, SerialLite II, XAUI and Serial RapidIO.
  • DSP and Clocking — High-speed DSP blocks for multiply/multiply-accumulate operations and up to four enhanced PLLs for spread spectrum, programmable bandwidth and clock management.
  • Package and Mounting — 1152-BBGA (supplier device package: 1152-FBGA, 35×35 mm) with surface-mount mounting for compact PCB integration.
  • Power — Core voltage supply range 1.15 V to 1.25 V to match system power rails.
  • Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Compliance — RoHS compliant for regulatory/environmental alignment.

Typical Applications

  • High‑Speed Communications — Implement serial protocol endpoints and custom SERDES interfaces using the Arria GX transceiver architecture and embedded protocol support.
  • Video and SDI Processing — Use the device’s high-speed transceivers, memory architecture and DSP blocks for SDI transport, buffering and real-time packet handling.
  • Signal Processing and DSP — Leverage dedicated DSP blocks and ample logic elements for FIR filters, MAC operations and other compute‑intensive functions.
  • Embedded System Integration — Serve as a central FPGA for I/O aggregation, protocol bridging and custom control functions in industrial systems operating across −40 °C to 100 °C.

Unique Advantages

  • High Integration Density: 90,220 logic elements and approximately 4.48 Mbits of embedded RAM reduce external component count and simplify board-level design.
  • Versatile Serial Interfaces: Family-level transceiver architecture with CDR and SERDES support enables implementation of multiple standard serial protocols and custom serial IP.
  • Robust Clocking and DSP Resources: Enhanced PLLs and dedicated DSP blocks provide precise timing and efficient arithmetic performance for demanding signal-processing tasks.
  • Industrial Temperature Range: Rated from −40 °C to 100 °C to meet a wide range of industrial deployment conditions.
  • Compact, Surface‑Mount Package: 1152-BBGA (35×35 mm FBGA) offers a balance of I/O count and board density for space‑constrained systems.
  • Regulatory Compliance: RoHS compliance supports environmentally regulated product development and manufacturing.

Why Choose EP1AGX90EF1152I6N?

The EP1AGX90EF1152I6N delivers a well-balanced combination of logic capacity, embedded memory and I/O density within the Arria GX family architecture. It is suited for designers who need programmable logic with integrated high‑speed serial capabilities, DSP resources and flexible clock management while meeting industrial temperature requirements.

This device is appropriate for mid-to-high complexity designs in communications, video, and industrial signal-processing systems where on-chip memory, dedicated DSP blocks and robust transceiver technology enable consolidated, scalable solutions with predictable electrical and thermal characteristics.

Request a quote or submit a sales inquiry for EP1AGX90EF1152I6N to evaluate supply, lead time and integration support.

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