EP1C12F256C6

The EP1C12F256C6 is an Intel Cyclone® family SRAM-based field-programmable gate array (FPGA) delivering mid-range logic density and embedded memory for data-path and interface applications. Built on the Cyclone architecture, this device combines approximately 12,060 logic elements with 239,616 bits of on-chip RAM and family-level features aimed at flexible clocking and high-speed I/O.

With 185 user I/O pins in a compact 256-ball FBGA (17×17) package and a core supply range of 1.425 V to 1.575 V, the device is targeted at commercial designs requiring programmable logic, memory resources, and a variety of I/O standards within a surface-mount form factor.

Key Features

• Core Logic Approximately 12,060 logic elements provide mid-range programmable logic capacity for control, data-path, and glue-logic functions.
• Embedded Memory Approximately 0.24 Mbits (239,616 bits) of on-chip RAM, implemented as 52 M4K blocks according to the Cyclone device family data, for FIFOs, buffers, and small on-chip data stores.
• I/O and Interface Support 185 user I/O pins in the 256-FBGA (17×17) package. The Cyclone family supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS, enabling a range of external interfaces.
• Clocking Two PLLs and family-level clock resources support clock multiplication and phase shifting for synchronous designs and memory interfaces.
• Package & Mounting 256-ball FineLine BGA (256-FBGA, 17×17) package supplied for surface-mount assembly, balancing I/O count and board-area efficiency.
• Power Core supply 1.425 V to 1.575 V, matching the Cyclone family’s 1.5-V process characteristics.
• Operating Conditions & Grade Commercial temperature range, 0 °C to 85 °C.
• Compliance RoHS compliant for environmentally conscious production requirements.

Typical Applications

• Data-Path Processing — Implement custom datapath logic, packet processing, and mid-density compute functions using the device’s logic elements and embedded RAM.
• Memory Interface Controllers — Use integrated clocking and on-chip memory resources to support external memory interfaces such as DDR SDRAM (as supported by Cyclone family features).
• Peripheral and Bus Bridging — Implement PCI-class peripheral bridging and other parallel/serial interfaces leveraging available I/O standards and the device’s I/O count.
• High-Speed I/O and Sensor Interfaces — Deploy LVDS and other supported I/O standards for video, sensor, and high-speed differential signaling applications.

Unique Advantages

• Balanced Logic and Memory: Approximately 12,060 logic elements paired with ~0.24 Mbits of embedded RAM provide a versatile mix for control logic and buffering without external memory for many functions.
• Flexible I/O Options: 185 user I/O pins and family support for multiple I/O standards enable connectivity to a wide range of peripherals and interfaces.
• Integrated Clocking: Two PLLs and dedicated clock resources simplify clock management for synchronous designs and memory interfaces.
• Compact, Surface-Mount Package: 256-FBGA (17×17) provides a high pin-count, space-efficient footprint suitable for compact PCBs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial embedded applications.
• RoHS Compliant: Conforms to environmental compliance requirements for lead-free assembly.

Why Choose EP1C12F256C6?

The EP1C12F256C6 delivers a practical balance of programmable logic density, embedded memory, and I/O capability within the Cyclone FPGA family architecture. It is well suited for commercial designs that require flexible, reprogrammable logic for data-path tasks, memory interface support, and diverse I/O connectivity while maintaining a compact BGA footprint.

Engineers seeking a mid-density FPGA solution will find this device appropriate for prototypes and production systems that benefit from Cyclone family features such as integrated clocking resources and support for multiple I/O standards, packaged in a RoHS-compliant, surface-mount form factor.

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