EP1K100EFI484-2

IC FPGA 333 I/O 484FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 333 49152 4992 484-BBGA

Quantity 741 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case484-BBGANumber of I/O333Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCNOBSOLETEHTS Code0000.00.0000
QualificationN/ATotal RAM Bits49152

Overview of EP1K100EFI484-2 – ACEX-1K Field Programmable Gate Array (FPGA), 484-BBGA

The EP1K100EFI484-2 is an ACEX-1K family Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a mid-density programmable logic fabric with embedded memory and a high pin count to support complex, reconfigurable system functions.

Targeted at system-on-a-programmable-chip integration and communications-oriented designs, the device combines 4,992 logic elements, approximately 49,152 bits of embedded RAM, and 333 user I/O pins in a 484-ball BGA package. The device is RoHS compliant and rated for industrial operating temperatures.

Key Features

  • Core logic – 4,992 logic elements and up to 257,000 maximum system gates provide programmable combinational and sequential logic capacity for mid-density designs.
  • Embedded memory – Approximately 49,152 bits of on-chip RAM organized via embedded array blocks (EABs) for dual-port and specialized memory functions without reducing logic capacity.
  • I/O and voltages – 333 user I/O pins with MultiVolt I/O capability described at the series level; device operates with an internal 2.5 V supply and an external supply range of 2.375 V to 2.625 V.
  • Package and mounting – 484-BBGA (supplier package 484-FBGA, 23 × 23) fine-pitch BGA in a surface-mount form factor, enabling compact board integration.
  • Temperature and reliability – Industrial grade operation from −40 °C to 85 °C and RoHS-compliant construction.
  • System-level features – Series-level capabilities include JTAG boundary-scan (IEEE 1149.1) for test, in-circuit reconfigurability, low-skew clock distribution, and series options such as ClockLock and ClockBoost for improved clock performance.
  • Dedicated arithmetic and routing resources – The ACEX-1K architecture provides dedicated carry and cascade chains and a continuous FastTrack® interconnect for efficient arithmetic and high-fan-in logic implementation.
  • PCI capability (series-level) – Series documentation cites compliance with the PCI Local Bus Specification for 3.3-V operation at 33 MHz or 66 MHz; -1 speed grade devices in the series are noted for 5.0-V PCI operation.

Typical Applications

  • Communications and networking – Implements protocol processing, framing, and interface logic where embedded memory and high I/O count are required.
  • System-on-a-programmable-chip (SOPC) – Integrates multiple logic functions and memory blocks into a single reconfigurable device for compact system designs.
  • PCI-based systems – Suitable for designs that leverage the series-level PCI Local Bus compliance for 3.3-V operation at 33/66 MHz.
  • Embedded control and signal glue logic – Provides the programmable logic and I/O density for glue logic, protocol bridging, and control functions in industrial applications.

Unique Advantages

  • Highly integrated programmable fabric – 4,992 logic elements and embedded RAM reduce external component count and simplify board-level design.
  • Significant I/O bandwidth – 333 user I/O pins accommodate complex interfaces and parallel buses without sacrificing logic resources.
  • Industrial temperature rating – −40 °C to 85 °C operation supports deployment in industrial environments requiring extended temperature capability.
  • Flexible reconfiguration and test – In-circuit reconfigurability and JTAG boundary-scan enable field updates and board-level testability.
  • Deterministic clocking – Built-in low-skew clock distribution with multiple global clocks and series-level ClockLock/ClockBoost options improve timing control for synchronous designs.
  • Compact, board-ready packaging – 484-ball BGA (23 × 23) surface-mount package balances pin count and PCB area for dense designs.

Why Choose EP1K100EFI484-2?

The EP1K100EFI484-2 delivers a balanced combination of logic density, embedded memory, and high I/O count in a RoHS-compliant, industrial-temperature FPGA package. It is well suited to designers who need reconfigurable logic and on-chip memory for communications, SOPC integration, or PCI-oriented systems while maintaining compact board footprint.

Backed by series-level development tool support and architecture features such as dedicated carry/cascade chains and FastTrack interconnect, the device provides a practical platform for mid-density, high-I/O applications where in-field reconfiguration and testability are important.

Request a quote or submit an inquiry to check availability and pricing for the EP1K100EFI484-2.

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