EP1K100EFI484-2

The EP1K100EFI484-2 is an ACEX-1K family Field Programmable Gate Array (FPGA) manufactured by Intel. It provides a mid-density programmable logic fabric with embedded memory and a high pin count to support complex, reconfigurable system functions.

Targeted at system-on-a-programmable-chip integration and communications-oriented designs, the device combines 4,992 logic elements, approximately 49,152 bits of embedded RAM, and 333 user I/O pins in a 484-ball BGA package. The device is RoHS compliant and rated for industrial operating temperatures.

Key Features

• Core logic – 4,992 logic elements and up to 257,000 maximum system gates provide programmable combinational and sequential logic capacity for mid-density designs.
• Embedded memory – Approximately 49,152 bits of on-chip RAM organized via embedded array blocks (EABs) for dual-port and specialized memory functions without reducing logic capacity.
• I/O and voltages – 333 user I/O pins with MultiVolt I/O capability described at the series level; device operates with an internal 2.5 V supply and an external supply range of 2.375 V to 2.625 V.
• Package and mounting – 484-BBGA (supplier package 484-FBGA, 23 × 23) fine-pitch BGA in a surface-mount form factor, enabling compact board integration.
• Temperature and reliability – Industrial grade operation from −40 °C to 85 °C and RoHS-compliant construction.
• System-level features – Series-level capabilities include JTAG boundary-scan (IEEE 1149.1) for test, in-circuit reconfigurability, low-skew clock distribution, and series options such as ClockLock and ClockBoost for improved clock performance.
• Dedicated arithmetic and routing resources – The ACEX-1K architecture provides dedicated carry and cascade chains and a continuous FastTrack® interconnect for efficient arithmetic and high-fan-in logic implementation.
• PCI capability (series-level) – Series documentation cites compliance with the PCI Local Bus Specification for 3.3-V operation at 33 MHz or 66 MHz; -1 speed grade devices in the series are noted for 5.0-V PCI operation.

Typical Applications

• Communications and networking – Implements protocol processing, framing, and interface logic where embedded memory and high I/O count are required.
• System-on-a-programmable-chip (SOPC) – Integrates multiple logic functions and memory blocks into a single reconfigurable device for compact system designs.
• PCI-based systems – Suitable for designs that leverage the series-level PCI Local Bus compliance for 3.3-V operation at 33/66 MHz.
• Embedded control and signal glue logic – Provides the programmable logic and I/O density for glue logic, protocol bridging, and control functions in industrial applications.

Unique Advantages

• Highly integrated programmable fabric – 4,992 logic elements and embedded RAM reduce external component count and simplify board-level design.
• Significant I/O bandwidth – 333 user I/O pins accommodate complex interfaces and parallel buses without sacrificing logic resources.
• Industrial temperature rating – −40 °C to 85 °C operation supports deployment in industrial environments requiring extended temperature capability.
• Flexible reconfiguration and test – In-circuit reconfigurability and JTAG boundary-scan enable field updates and board-level testability.
• Deterministic clocking – Built-in low-skew clock distribution with multiple global clocks and series-level ClockLock/ClockBoost options improve timing control for synchronous designs.
• Compact, board-ready packaging – 484-ball BGA (23 × 23) surface-mount package balances pin count and PCB area for dense designs.

Why Choose EP1K100EFI484-2?

The EP1K100EFI484-2 delivers a balanced combination of logic density, embedded memory, and high I/O count in a RoHS-compliant, industrial-temperature FPGA package. It is well suited to designers who need reconfigurable logic and on-chip memory for communications, SOPC integration, or PCI-oriented systems while maintaining compact board footprint.

Backed by series-level development tool support and architecture features such as dedicated carry/cascade chains and FastTrack interconnect, the device provides a practical platform for mid-density, high-I/O applications where in-field reconfiguration and testability are important.

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