EP1K100FC256-1

The EP1K100FC256-1 is an ACEX-1K family Field Programmable Gate Array (FPGA) device designed for low-cost system-on-a-programmable-chip integration. It combines a dense logic array with embedded memory blocks and flexible I/O to address communications, embedded control, and high-volume programmable-logic applications.

This device provides 4,992 logic elements and approximately 49,152 bits of on-chip RAM in a 256-pin FineLine BGA package, delivering a balance of integration, predictable timing, and reconfigurability for commercial-temperature designs.

Key Features

• Logic Capacity — 4,992 logic elements (LEs) and up to 257,000 system gates, enabling implementation of complex combinational and sequential logic.
• Embedded Memory (EABs) — Includes embedded array blocks with dual-port capability and up to 16-bit width per EAB, providing approximately 49,152 bits of RAM for efficient megafunction and buffer implementations.
• I/O Flexibility — 186 user I/O pins with individual tri-state control, open-drain option, programmable output slew-rate control, and selectable clamp to VCCIO on a pin-by-pin basis for flexible interfacing to mixed-voltage systems.
• Clocking and Timing — Built-in low-skew clock distribution, options for ClockLock™ and ClockBoost™ to reduce clock delay and skew, and support for up to six global clock signals and four global clear signals.
• Dedicated Arithmetic and Routing — Dedicated carry and cascade chains and FastTrack® continuous routing provide efficient implementation of adders, counters, comparators, and high-fan-in logic.
• Reconfiguration and Test — In-circuit reconfigurability via external configuration devices or JTAG; built-in JTAG boundary-scan test (IEEE 1149.1) without consuming device logic.
• Package and Mounting — 256-ball FineLine BGA (256-FBGA, 17×17) surface-mount package optimized for compact board designs and high routing density.
• Power and Supply — Operates with an internal supply in the range of 2.375 V to 2.625 V and is designed for low-power operation in commercial-temperature systems.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operating temperature and supplied as RoHS-compliant.

Typical Applications

• High-performance communications — Implement protocol processing, buffering, and custom packet handling using embedded RAM and programmable logic to reduce system cost.
• System-on-a-programmable-chip (SOPC) integration — Combine control logic, interfaces, and memory megafunctions on a single device to simplify board-level design.
• Embedded control and glue logic — Replace discrete logic and small microcontroller functions with a single FPGA implementing state machines, interfaces, and timing-critical control.
• Memory buffering and data path acceleration — Use dual-port EABs to implement FIFOs, line buffers, and fast data-path storage for real-time processing tasks.

Unique Advantages

• High integration density: 4,992 logic elements and approximately 49,152 bits of embedded RAM reduce board-level BOM and simplify system architecture.
• Flexible, mixed-voltage I/O: Programmable I/O features support interfacing to a variety of peripheral voltages while providing pin-level control over drive and slew behavior.
• Predictable timing and clock options: Low-skew clock trees plus ClockLock™/ClockBoost™ options and multiple global clocks help streamline timing closure for complex designs.
• Efficient arithmetic and routing: Dedicated carry and cascade chains accelerate implementation of adders, counters, and high-fan-in logic without hand-routing.
• Reconfigurability and testability: In-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan simplify development, production test, and field updates.
• Compact BGA package: 256-FBGA (17×17) packaging enables compact board layouts while supporting a high pin count for system I/O.

Why Choose EP1K100FC256-1?

The EP1K100FC256-1 is positioned for designers seeking a commercially graded, high-density FPGA with on-chip RAM and flexible I/O in a compact BGA package. Its combination of 4,992 logic elements, embedded array blocks, and dedicated arithmetic resources makes it well suited to communications, embedded control, and SOPC-style integration where board-level consolidation and predictable timing matter.

Engineers and procurement teams benefit from a RoHS-compliant, surface-mount device with clear electrical and thermal limits—supporting streamlined designs that leverage in-circuit reconfigurability and built-in test features for simpler development and production workflows.

Request a quote or submit an inquiry to receive pricing and availability for the EP1K100FC256-1 and to discuss volume purchasing or technical requirements.