EP1K100FC256-2N

The EP1K100FC256-2N is an ACEX-1K family FPGA delivering 4,992 logic elements and approximately 49,152 bits of embedded RAM in a 256-ball BGA (256-FBGA, 17×17) surface-mount package. Designed for commercial-grade applications, this device provides a programmable-logic platform for system-on-a-programmable-chip (SOPC) integration, embedded memory functions and multi-voltage I/O interfacing.

Key value comes from dense logic and on-chip memory, flexible I/O, and a package optimized for board-level integration — offering a compact, reconfigurable building block for communication and embedded system designs that require moderate logic density and significant embedded RAM.

Key Features

• Logic Capacity  4,992 logic elements (LEs) and a maximum system gate count listed as 257,000, providing mid-range programmable logic density.
• Embedded Memory  Approximately 49,152 bits of on-chip RAM implemented across embedded array blocks (EABs); EABs support dual-port operation with up to 16-bit width per block for efficient memory and megafunction implementation.
• I/O and Voltage  186 user I/O pins with MultiVolt I/O capability; I/O pins can drive or be driven by 2.5-V, 3.3-V, or 5.0-V devices while the device operates from a 2.375 V to 2.625 V supply and an internal 2.5-V core supply.
• Clocking and Performance  Built-in low-skew clock distribution, options such as ClockLock and ClockBoost for reduced clock delay/skew and clock multiplication, plus up to six global clock signals and four global clear signals.
• Dedicated Arithmetic and Cascade Structures  Dedicated carry and cascade chains to implement fast adders, counters and high-fan-in logic efficiently (automatically used by supported design tools and megafunctions).
• Flexible Interconnect  FastTrack interconnect structure for predictable routing delays and tri-state emulation to support internal bus structures.
• Configuration and Test  In-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG port; built-in JTAG boundary-scan (IEEE 1149.1) for board-level testability without consuming device logic.
• Package & Mounting  256-ball fine-pitch BGA (256-FBGA, 17×17) in a surface-mount package suited for compact PCB designs.
• Environmental & Grade  Commercial grade with an operating temperature range of 0 °C to 70 °C and RoHS compliance.

Typical Applications

• Communications and Networking  Protocol processing, packet buffering and specialized logic functions where embedded RAM and reconfigurable logic enable custom datapath and buffering implementations.
• SOPC and Integration  System-on-a-programmable-chip roles that combine memory, peripheral logic and glue functions into a single device to reduce BOM and board complexity.
• Embedded Memory Functions  On-chip dual-port RAM and EAB-based megafunctions for FIFO buffering, lookup tables and temporary storage in data-path designs.
• Multi-Voltage Interfacing  Mixed-voltage peripheral interfacing and level translation where MultiVolt I/O simplifies integration with 2.5 V, 3.3 V or 5.0 V devices.

Unique Advantages

• Mid-range Logic with Significant On-chip RAM: Combines 4,992 logic elements with ~49 kbits of embedded RAM, enabling designs that need both logic density and local memory without added external components.
• Flexible I/O Voltage Support: MultiVolt I/O capability permits direct interfacing to multiple I/O voltage domains, reducing the need for level-shifters and simplifying board design.
• Dedicated Arithmetic and Cascade Paths: Carry and cascade chains accelerate implementation of adders, counters and wide combinational logic, improving achievable performance for numeric and control logic.
• Reconfigurability and Testability: In-circuit reconfigurability and built-in JTAG boundary-scan support allow field updates and board-level test without consuming programmable resources.
• Compact Surface-Mount Package: 256-FBGA (17×17) provides a small PCB footprint suitable for space-constrained designs while keeping substantial I/O available.
• Standards-Based Design Flow: Series-level support includes common HDL and tool interoperability, easing integration into established design and verification flows.

Why Choose EP1K100FC256-2N?

The EP1K100FC256-2N is positioned for designers seeking a commercially graded, mid-density FPGA with a balance of logic elements and embedded RAM in a compact BGA package. Its combination of 4,992 logic elements, approximately 49,152 bits of on-chip RAM and 186 I/O makes it suitable for communication subsystems, embedded memory functions and integration tasks that benefit from reconfigurable logic and flexible I/O.

For teams focused on reducing BOM, consolidating glue logic and implementing custom datapaths or buffering on-chip, this ACEX-1K device offers predictable interconnect, dedicated arithmetic resources and configuration/test capabilities that support robust board-level integration and product lifecycle updates.

Request a quote or submit a product inquiry for pricing, lead times and availability for the EP1K100FC256-2N.