EP1K100FC256-3N

IC FPGA 186 I/O 256FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 49152 4992 256-BGA

Quantity 1,528 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O186Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates257000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits49152

Overview of EP1K100FC256-3N – ACEX-1K® FPGA, 4,992 logic elements, 49,152-bit RAM, 256-BGA

The EP1K100FC256-3N is an ACEX-1K family field programmable gate array (FPGA) IC designed for system-on-a-programmable-chip (SOPC) integration. It combines a high-density logic array with embedded memory and flexible I/O to support a range of commercial designs.

With 4,992 logic elements, approximately 49,152 bits of on-chip RAM, and 186 user I/O pins, this device targets cost-efficient communications and embedded applications that require reconfigurable logic, on-chip dual-port memory capability, and multi-voltage I/O support.

Key Features

  • Logic Capacity — 4,992 logic elements and a reported maximum of 257,000 system gates provide substantial logic resources for mid-density designs.
  • Embedded Memory — Approximately 49,152 bits of RAM available via up to 12 embedded array blocks (EABs), with dual-port capability and up to 16-bit width per EAB for efficient on-chip storage and buffering.
  • I/O and Voltage — 186 user I/O pins with MultiVolt™ I/O support that can interface with 2.5 V, 3.3 V, or 5.0 V devices; core supply specified at 2.375 V to 2.625 V.
  • Performance and Clocking — Bidirectional I/O timing performance up to 250 MHz and support for up to six global clock signals and four global clear signals to simplify clock distribution.
  • Configuration and Test — In-circuit reconfigurability (ICR) via external configuration devices, intelligent controller, or JTAG port, plus built-in JTAG boundary-scan test (IEEE 1149.1) without consuming device logic.
  • Specialized Logic Resources — Dedicated carry chains and cascade chains for high-speed arithmetic and high-fan-in logic; FastTrack® continuous routing for predictable interconnect delays.
  • Package and Mounting — Surface-mount 256-ball FineLine BGA (256-FBGA, 17 × 17); package supports SameFrame™ pin migration across FineLine BGA options.
  • Commercial Grade and Environmental — Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
  • Design Support — Supported by Altera development systems for automatic place-and-route and standard HDL and netlist flows for streamlined implementation.

Typical Applications

  • Communications Interfaces — Implement protocol bridging, packet buffering, and custom logic for mid-rate communications systems using the device's embedded RAM and high I/O count.
  • System Integration / SOPC — Combine control logic, memory functions, and peripheral interfaces on a single device to reduce board-level component count.
  • High-speed Glue Logic — Use dedicated carry and cascade chains to implement fast adders, counters, comparators, and other glue logic between high-speed subsystems.
  • Prototyping and Functional Emulation — Reconfigurable logic and JTAG-based configuration support make the device suitable for iterative development and in-circuit debugging.

Unique Advantages

  • Well-balanced mid-density resource mix: Combines 4,992 logic elements with approximately 49,152 bits of embedded RAM for designs that need both logic and local memory.
  • Flexible I/O voltage support: MultiVolt I/O capability allows direct interfacing to 2.5 V, 3.3 V, or 5.0 V device families, reducing level-shifting components on the board.
  • Predictable timing and fast arithmetic: FastTrack interconnect plus dedicated carry and cascade chains reduce critical-path uncertainty and accelerate arithmetic functions.
  • In-system configurability and testability: JTAG boundary-scan and in-circuit reconfiguration simplify manufacturing test and field updates without consuming logic resources.
  • Commercial-grade, RoHS compliant: Designed for mainstream commercial applications with RoHS compliance and a standard 0 °C to 70 °C operating range.

Why Choose EP1K100FC256-3N?

The EP1K100FC256-3N offers a practical combination of logic density, embedded RAM, and flexible I/O in a compact 256-FBGA package. It is suited to engineers building cost-sensitive, mid-density programmable solutions that require on-chip memory, multiple clocks, and reliable configuration and test support.

For teams seeking a reconfigurable device with predictable interconnect behavior, dedicated arithmetic resources, and broad development-tool support, this ACEX-1K device provides a balanced platform for commercial communications and embedded system designs.

Request a quote or submit an inquiry to obtain pricing and availability for the EP1K100FC256-3N and to discuss how it fits your next design.

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