EP1K100FC256-3N
| Part Description |
ACEX-1K® Field Programmable Gate Array (FPGA) IC 186 49152 4992 256-BGA |
|---|---|
| Quantity | 1,528 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 186 | Voltage | 2.375 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 624 | Number of Logic Elements/Cells | 4992 | ||
| Number of Gates | 257000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 49152 |
Overview of EP1K100FC256-3N – ACEX-1K® FPGA, 4,992 logic elements, 49,152-bit RAM, 256-BGA
The EP1K100FC256-3N is an ACEX-1K family field programmable gate array (FPGA) IC designed for system-on-a-programmable-chip (SOPC) integration. It combines a high-density logic array with embedded memory and flexible I/O to support a range of commercial designs.
With 4,992 logic elements, approximately 49,152 bits of on-chip RAM, and 186 user I/O pins, this device targets cost-efficient communications and embedded applications that require reconfigurable logic, on-chip dual-port memory capability, and multi-voltage I/O support.
Key Features
- Logic Capacity — 4,992 logic elements and a reported maximum of 257,000 system gates provide substantial logic resources for mid-density designs.
- Embedded Memory — Approximately 49,152 bits of RAM available via up to 12 embedded array blocks (EABs), with dual-port capability and up to 16-bit width per EAB for efficient on-chip storage and buffering.
- I/O and Voltage — 186 user I/O pins with MultiVolt™ I/O support that can interface with 2.5 V, 3.3 V, or 5.0 V devices; core supply specified at 2.375 V to 2.625 V.
- Performance and Clocking — Bidirectional I/O timing performance up to 250 MHz and support for up to six global clock signals and four global clear signals to simplify clock distribution.
- Configuration and Test — In-circuit reconfigurability (ICR) via external configuration devices, intelligent controller, or JTAG port, plus built-in JTAG boundary-scan test (IEEE 1149.1) without consuming device logic.
- Specialized Logic Resources — Dedicated carry chains and cascade chains for high-speed arithmetic and high-fan-in logic; FastTrack® continuous routing for predictable interconnect delays.
- Package and Mounting — Surface-mount 256-ball FineLine BGA (256-FBGA, 17 × 17); package supports SameFrame™ pin migration across FineLine BGA options.
- Commercial Grade and Environmental — Commercial grade device with an operating temperature range of 0 °C to 70 °C and RoHS compliance.
- Design Support — Supported by Altera development systems for automatic place-and-route and standard HDL and netlist flows for streamlined implementation.
Typical Applications
- Communications Interfaces — Implement protocol bridging, packet buffering, and custom logic for mid-rate communications systems using the device's embedded RAM and high I/O count.
- System Integration / SOPC — Combine control logic, memory functions, and peripheral interfaces on a single device to reduce board-level component count.
- High-speed Glue Logic — Use dedicated carry and cascade chains to implement fast adders, counters, comparators, and other glue logic between high-speed subsystems.
- Prototyping and Functional Emulation — Reconfigurable logic and JTAG-based configuration support make the device suitable for iterative development and in-circuit debugging.
Unique Advantages
- Well-balanced mid-density resource mix: Combines 4,992 logic elements with approximately 49,152 bits of embedded RAM for designs that need both logic and local memory.
- Flexible I/O voltage support: MultiVolt I/O capability allows direct interfacing to 2.5 V, 3.3 V, or 5.0 V device families, reducing level-shifting components on the board.
- Predictable timing and fast arithmetic: FastTrack interconnect plus dedicated carry and cascade chains reduce critical-path uncertainty and accelerate arithmetic functions.
- In-system configurability and testability: JTAG boundary-scan and in-circuit reconfiguration simplify manufacturing test and field updates without consuming logic resources.
- Commercial-grade, RoHS compliant: Designed for mainstream commercial applications with RoHS compliance and a standard 0 °C to 70 °C operating range.
Why Choose EP1K100FC256-3N?
The EP1K100FC256-3N offers a practical combination of logic density, embedded RAM, and flexible I/O in a compact 256-FBGA package. It is suited to engineers building cost-sensitive, mid-density programmable solutions that require on-chip memory, multiple clocks, and reliable configuration and test support.
For teams seeking a reconfigurable device with predictable interconnect behavior, dedicated arithmetic resources, and broad development-tool support, this ACEX-1K device provides a balanced platform for commercial communications and embedded system designs.
Request a quote or submit an inquiry to obtain pricing and availability for the EP1K100FC256-3N and to discuss how it fits your next design.

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